JPH11317428A5 - - Google Patents

Info

Publication number
JPH11317428A5
JPH11317428A5 JP1998124536A JP12453698A JPH11317428A5 JP H11317428 A5 JPH11317428 A5 JP H11317428A5 JP 1998124536 A JP1998124536 A JP 1998124536A JP 12453698 A JP12453698 A JP 12453698A JP H11317428 A5 JPH11317428 A5 JP H11317428A5
Authority
JP
Japan
Prior art keywords
leads
semiconductor chip
tape
mounting
user area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998124536A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11317428A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP12453698A priority Critical patent/JPH11317428A/ja
Priority claimed from JP12453698A external-priority patent/JPH11317428A/ja
Publication of JPH11317428A publication Critical patent/JPH11317428A/ja
Publication of JPH11317428A5 publication Critical patent/JPH11317428A5/ja
Pending legal-status Critical Current

Links

JP12453698A 1998-05-07 1998-05-07 テープキャリア、半導体装置及びその製造方法 Pending JPH11317428A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12453698A JPH11317428A (ja) 1998-05-07 1998-05-07 テープキャリア、半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12453698A JPH11317428A (ja) 1998-05-07 1998-05-07 テープキャリア、半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPH11317428A JPH11317428A (ja) 1999-11-16
JPH11317428A5 true JPH11317428A5 (enExample) 2005-02-10

Family

ID=14887912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12453698A Pending JPH11317428A (ja) 1998-05-07 1998-05-07 テープキャリア、半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JPH11317428A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100713637B1 (ko) * 2000-02-21 2007-05-02 엘지.필립스 엘시디 주식회사 테이프 캐리어 팩키지 필름
JP2005183720A (ja) 2003-12-19 2005-07-07 Brother Ind Ltd 素子実装基板の製造方法及びプリント基板
KR100684793B1 (ko) 2004-12-07 2007-02-20 삼성에스디아이 주식회사 릴상의 테이프 캐리어 패키지와 이를 적용한 플라즈마디스플레이 장치
KR100793068B1 (ko) * 2005-03-07 2008-01-10 엘지전자 주식회사 더미 패턴을 이용한 티씨피 제조 방법 및 그 더미 패턴 필름

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