JPH11317428A - テープキャリア、半導体装置及びその製造方法 - Google Patents

テープキャリア、半導体装置及びその製造方法

Info

Publication number
JPH11317428A
JPH11317428A JP12453698A JP12453698A JPH11317428A JP H11317428 A JPH11317428 A JP H11317428A JP 12453698 A JP12453698 A JP 12453698A JP 12453698 A JP12453698 A JP 12453698A JP H11317428 A JPH11317428 A JP H11317428A
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor chip
tape
lead
tape carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12453698A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11317428A5 (enExample
Inventor
Hiroyuki Mori
博幸 毛利
Makoto Kimura
誠 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Japan Display Inc
Original Assignee
Hitachi Device Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Device Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Device Engineering Co Ltd
Priority to JP12453698A priority Critical patent/JPH11317428A/ja
Publication of JPH11317428A publication Critical patent/JPH11317428A/ja
Publication of JPH11317428A5 publication Critical patent/JPH11317428A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP12453698A 1998-05-07 1998-05-07 テープキャリア、半導体装置及びその製造方法 Pending JPH11317428A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12453698A JPH11317428A (ja) 1998-05-07 1998-05-07 テープキャリア、半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12453698A JPH11317428A (ja) 1998-05-07 1998-05-07 テープキャリア、半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPH11317428A true JPH11317428A (ja) 1999-11-16
JPH11317428A5 JPH11317428A5 (enExample) 2005-02-10

Family

ID=14887912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12453698A Pending JPH11317428A (ja) 1998-05-07 1998-05-07 テープキャリア、半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JPH11317428A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100684793B1 (ko) * 2004-12-07 2007-02-20 삼성에스디아이 주식회사 릴상의 테이프 캐리어 패키지와 이를 적용한 플라즈마디스플레이 장치
KR100713637B1 (ko) * 2000-02-21 2007-05-02 엘지.필립스 엘시디 주식회사 테이프 캐리어 팩키지 필름
KR100793068B1 (ko) * 2005-03-07 2008-01-10 엘지전자 주식회사 더미 패턴을 이용한 티씨피 제조 방법 및 그 더미 패턴 필름
US7353595B2 (en) 2003-12-19 2008-04-08 Brother Kogyo Kabushiki Kaisha Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100713637B1 (ko) * 2000-02-21 2007-05-02 엘지.필립스 엘시디 주식회사 테이프 캐리어 팩키지 필름
US7353595B2 (en) 2003-12-19 2008-04-08 Brother Kogyo Kabushiki Kaisha Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon
KR100684793B1 (ko) * 2004-12-07 2007-02-20 삼성에스디아이 주식회사 릴상의 테이프 캐리어 패키지와 이를 적용한 플라즈마디스플레이 장치
US7656089B2 (en) 2004-12-07 2010-02-02 Samsung Sdi Co., Ltd. Tape carrier package on reel and plasma display device using the same
KR100793068B1 (ko) * 2005-03-07 2008-01-10 엘지전자 주식회사 더미 패턴을 이용한 티씨피 제조 방법 및 그 더미 패턴 필름

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