JPH11288975A - ボンディング方法及びボンディング装置 - Google Patents

ボンディング方法及びボンディング装置

Info

Publication number
JPH11288975A
JPH11288975A JP9131198A JP9131198A JPH11288975A JP H11288975 A JPH11288975 A JP H11288975A JP 9131198 A JP9131198 A JP 9131198A JP 9131198 A JP9131198 A JP 9131198A JP H11288975 A JPH11288975 A JP H11288975A
Authority
JP
Japan
Prior art keywords
bonding
substrate
chip
electrode
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9131198A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11288975A5 (enExample
Inventor
Taizo Tomioka
泰造 冨岡
Tomohiro Iguchi
知洋 井口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP9131198A priority Critical patent/JPH11288975A/ja
Publication of JPH11288975A publication Critical patent/JPH11288975A/ja
Publication of JPH11288975A5 publication Critical patent/JPH11288975A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/75353—Ultrasonic horns
    • H01L2224/75355—Design, e.g. of the wave guide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Wire Bonding (AREA)
JP9131198A 1998-04-03 1998-04-03 ボンディング方法及びボンディング装置 Pending JPH11288975A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9131198A JPH11288975A (ja) 1998-04-03 1998-04-03 ボンディング方法及びボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9131198A JPH11288975A (ja) 1998-04-03 1998-04-03 ボンディング方法及びボンディング装置

Publications (2)

Publication Number Publication Date
JPH11288975A true JPH11288975A (ja) 1999-10-19
JPH11288975A5 JPH11288975A5 (enExample) 2005-09-15

Family

ID=14022934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9131198A Pending JPH11288975A (ja) 1998-04-03 1998-04-03 ボンディング方法及びボンディング装置

Country Status (1)

Country Link
JP (1) JPH11288975A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6193136B1 (en) * 1998-08-20 2001-02-27 Matsushita Electric Industrial Co., Ltd. Component mounting method and apparatus
JP2001267359A (ja) * 2000-03-14 2001-09-28 Toshiba Corp 半導体装置の製造方法及び半導体装置
JP2005183459A (ja) * 2003-12-16 2005-07-07 Fujitsu Ltd 電子部品のボンディング方法及び装置
JP2007005676A (ja) * 2005-06-27 2007-01-11 Athlete Fa Kk 電子部品の接合装置
US7513032B2 (en) 2004-10-29 2009-04-07 Fujitsu Limited Method of mounting an electronic part to a substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6193136B1 (en) * 1998-08-20 2001-02-27 Matsushita Electric Industrial Co., Ltd. Component mounting method and apparatus
US6467670B2 (en) 1998-08-20 2002-10-22 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting component
JP2001267359A (ja) * 2000-03-14 2001-09-28 Toshiba Corp 半導体装置の製造方法及び半導体装置
JP2005183459A (ja) * 2003-12-16 2005-07-07 Fujitsu Ltd 電子部品のボンディング方法及び装置
US7513032B2 (en) 2004-10-29 2009-04-07 Fujitsu Limited Method of mounting an electronic part to a substrate
JP2007005676A (ja) * 2005-06-27 2007-01-11 Athlete Fa Kk 電子部品の接合装置

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