JPH11287936A - 受動熱補償を伴う光学構造及びマイクロリソグラフィの投影露光装置 - Google Patents

受動熱補償を伴う光学構造及びマイクロリソグラフィの投影露光装置

Info

Publication number
JPH11287936A
JPH11287936A JP11035932A JP3593299A JPH11287936A JP H11287936 A JPH11287936 A JP H11287936A JP 11035932 A JP11035932 A JP 11035932A JP 3593299 A JP3593299 A JP 3593299A JP H11287936 A JPH11287936 A JP H11287936A
Authority
JP
Japan
Prior art keywords
optical element
projection exposure
exposure apparatus
optical
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11035932A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11287936A5 (enExample
Inventor
Christian Wagner
クリスティアン・ヴァグナー
Michael Trunz
ミヒャエル・トルンツ
Ralf Hilgers
ラルフ・ヒルガース
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss SMT GmbH
Carl Zeiss AG
Original Assignee
Carl Zeiss SMT GmbH
Carl Zeiss AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss SMT GmbH, Carl Zeiss AG filed Critical Carl Zeiss SMT GmbH
Publication of JPH11287936A publication Critical patent/JPH11287936A/ja
Publication of JPH11287936A5 publication Critical patent/JPH11287936A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70108—Off-axis setting using a light-guiding element, e.g. diffractive optical elements [DOEs] or light guides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP11035932A 1998-02-20 1999-02-15 受動熱補償を伴う光学構造及びマイクロリソグラフィの投影露光装置 Pending JPH11287936A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19807094.2 1998-02-20
DE19807094A DE19807094A1 (de) 1998-02-20 1998-02-20 Optische Anordnung und Projektionsbelichtungsanlage der Mikrolithographie mit passiver thermischer Kompensation

Publications (2)

Publication Number Publication Date
JPH11287936A true JPH11287936A (ja) 1999-10-19
JPH11287936A5 JPH11287936A5 (enExample) 2006-04-06

Family

ID=7858359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11035932A Pending JPH11287936A (ja) 1998-02-20 1999-02-15 受動熱補償を伴う光学構造及びマイクロリソグラフィの投影露光装置

Country Status (5)

Country Link
EP (2) EP0938009B1 (enExample)
JP (1) JPH11287936A (enExample)
KR (1) KR100593429B1 (enExample)
DE (3) DE19807094A1 (enExample)
TW (1) TW401516B (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218023A (ja) * 2002-01-28 2003-07-31 Nikon Corp Ｘ線反射鏡、ｘ線露光転写装置及び半導体デバイスの製造方法
US6621557B2 (en) 2000-01-13 2003-09-16 Nikon Corporation Projection exposure apparatus and exposure methods
JP2004363571A (ja) * 2003-05-14 2004-12-24 Canon Inc ミラー保持方法、光学装置及びそれを用いた露光装置、デバイスの製造方法
JP2011034965A (ja) * 2009-07-31 2011-02-17 Carl Zeiss Laser Optics Gmbh 光学系、特に照明系内に備えられる光学配置
JP2018055111A (ja) * 2006-05-09 2018-04-05 カール・ツァイス・エスエムティー・ゲーエムベーハー 光学結像装置
JP2021501353A (ja) * 2017-10-30 2021-01-14 エーエスエムエル ホールディング エヌ．ブイ． 半導体フォトリソグラフィで使用するためのアセンブリ及び同一のものを製造する方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7274430B2 (en) 1998-02-20 2007-09-25 Carl Zeiss Smt Ag Optical arrangement and projection exposure system for microlithography with passive thermal compensation
DE19956353C1 (de) * 1999-11-24 2001-08-09 Zeiss Carl Optische Anordnung
DE19959741A1 (de) * 1999-12-10 2001-06-13 Zeiss Carl Vorrichtung zur deformationsarmen Lagerung eines optischen Elementes und Verfahren zur deformationsarmen Lagerung des optischen Elementes
DE19963588C2 (de) * 1999-12-29 2002-01-10 Zeiss Carl Optische Anordnung
DE10151919B4 (de) * 2001-10-20 2007-02-01 Carl Zeiss Smt Ag Belichtungsobjektiv in der Halbleiterlithographie
EP1310829B1 (en) * 2001-11-07 2007-05-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
DE10210893A1 (de) * 2002-03-07 2003-09-18 Zeiss Carl Laser Optics Gmbh Optische Anordnung mit einem optischen Bauelement, insbesondere einer Blende
GB0511692D0 (en) 2005-06-08 2005-07-13 Digital Projection Ltd Heat transfer apparatus
GB2451684A (en) * 2007-08-09 2009-02-11 Digital Projection Ltd Heat transfer apparatus for cooling a light valve or digital micro mirror
WO2009124590A1 (en) * 2008-04-09 2009-10-15 Carl Zeiss Smt Ag Optical aperture device
DE102013203032A1 (de) * 2013-02-25 2014-02-27 Carl Zeiss Smt Gmbh Optische Anordnung mit einem optischen Element und einem zusätzlichen Wärmeleitelement
CN103499865B (zh) * 2013-10-10 2015-07-29 中国科学院上海技术物理研究所 一种具有热应力缓冲结构的滤光片安装支架
DE102015115931B3 (de) * 2015-09-21 2016-10-27 Jenoptik Optical Systems Gmbh Spannungsentkoppelte monolithische Linsenfassung
DE102015115929B3 (de) 2015-09-21 2016-10-06 Jenoptik Optical Systems Gmbh Monolithische Linsenfassung
DE102017217111A1 (de) * 2017-09-26 2019-03-28 Robert Bosch Gmbh Anordnung eines optischen Systems und Entwärmungsverfahren
DE102017217107A1 (de) * 2017-09-26 2019-03-28 Robert Bosch Gmbh Anordnung eines optischen Systems und Entwärmungsverfahren
JP6951498B2 (ja) * 2019-06-25 2021-10-20 キヤノン株式会社 露光装置、露光方法および物品製造方法
IL284361B2 (en) * 2021-06-24 2024-08-01 Rafael Advanced Defense Systems Ltd Temperature balanced spacer

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4057332A (en) * 1976-04-21 1977-11-08 Caterpillar Tractor Co. Peripherally cooled laser lens assembly
US4155631A (en) * 1977-04-14 1979-05-22 W. J. Schafer Associates, Inc. Apparatus for compensating for thermally introduced distortions in reflecting surfaces
JPS56102392A (en) * 1980-01-22 1981-08-15 Nec Corp Laser working optical device
JPS6037632B2 (ja) * 1983-02-15 1985-08-27 株式会社東芝 固体レ−ザ発振装置
JPS59175178A (ja) * 1983-03-24 1984-10-03 Mitsubishi Electric Corp レ−ザ装置
JPS61208002A (ja) * 1985-03-13 1986-09-16 Toshiba Corp 光透過装置
DE69220868T2 (de) 1991-09-07 1997-11-06 Canon K.K., Tokio/Tokyo System zur Stabilisierung der Formen von optischen Elementen, Belichtungsvorrichtung unter Verwendung dieses Systems und Verfahren zur Herstellung von Halbleitervorrichtungen
JPH05203884A (ja) * 1992-01-24 1993-08-13 Toshiba Corp 光学素子
JP3169267B2 (ja) * 1992-06-17 2001-05-21 パイオニア株式会社 液体プリズム
JP3368091B2 (ja) * 1994-04-22 2003-01-20 キヤノン株式会社 投影露光装置及びデバイスの製造方法
US5881088A (en) * 1997-01-08 1999-03-09 Trw Inc. Face-cooled high-power laser optic cell

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621557B2 (en) 2000-01-13 2003-09-16 Nikon Corporation Projection exposure apparatus and exposure methods
JP2003218023A (ja) * 2002-01-28 2003-07-31 Nikon Corp Ｘ線反射鏡、ｘ線露光転写装置及び半導体デバイスの製造方法
JP2004363571A (ja) * 2003-05-14 2004-12-24 Canon Inc ミラー保持方法、光学装置及びそれを用いた露光装置、デバイスの製造方法
JP2018055111A (ja) * 2006-05-09 2018-04-05 カール・ツァイス・エスエムティー・ゲーエムベーハー 光学結像装置
JP2011034965A (ja) * 2009-07-31 2011-02-17 Carl Zeiss Laser Optics Gmbh 光学系、特に照明系内に備えられる光学配置
JP2021501353A (ja) * 2017-10-30 2021-01-14 エーエスエムエル ホールディング エヌ．ブイ． 半導体フォトリソグラフィで使用するためのアセンブリ及び同一のものを製造する方法
US11415893B2 (en) 2017-10-30 2022-08-16 Asml Holding N. V. Assembly for use in semiconductor photolithography and method of manufacturing same

Also Published As

Publication number Publication date
DE59912313D1 (de) 2005-09-01
EP1596235A1 (de) 2005-11-16
EP0938009B1 (de) 2005-07-27
DE59914228D1 (de) 2007-04-12
DE19807094A1 (de) 1999-08-26
EP1596235B1 (de) 2007-02-28
EP0938009A1 (de) 1999-08-25
KR100593429B1 (ko) 2006-10-24
KR19990071443A (ko) 1999-09-27
TW401516B (en) 2000-08-11

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