TW401516B - Optical device and a microlithography projection exposure system with passive thermal compensation - Google Patents
Optical device and a microlithography projection exposure system with passive thermal compensation Download PDFInfo
- Publication number
- TW401516B TW401516B TW088100316A TW88100316A TW401516B TW 401516 B TW401516 B TW 401516B TW 088100316 A TW088100316 A TW 088100316A TW 88100316 A TW88100316 A TW 88100316A TW 401516 B TW401516 B TW 401516B
- Authority
- TW
- Taiwan
- Prior art keywords
- optical element
- projection exposure
- optical
- heat
- patent application
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 74
- 238000001393 microlithography Methods 0.000 title 1
- 238000001816 cooling Methods 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 16
- 230000002079 cooperative effect Effects 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 7
- 238000005286 illumination Methods 0.000 claims description 5
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 210000001747 pupil Anatomy 0.000 claims 1
- 238000000034 method Methods 0.000 description 7
- 241000022563 Rema Species 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000031700 light absorption Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 201000009310 astigmatism Diseases 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 235000015170 shellfish Nutrition 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000006244 Medium Thermal Substances 0.000 description 1
- 229910052778 Plutonium Inorganic materials 0.000 description 1
- 239000006094 Zerodur Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- OYEHPCDNVJXUIW-UHFFFAOYSA-N plutonium atom Chemical compound [Pu] OYEHPCDNVJXUIW-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70108—Off-axis setting using a light-guiding element, e.g. diffractive optical elements [DOEs] or light guides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19807094A DE19807094A1 (de) | 1998-02-20 | 1998-02-20 | Optische Anordnung und Projektionsbelichtungsanlage der Mikrolithographie mit passiver thermischer Kompensation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW401516B true TW401516B (en) | 2000-08-11 |
Family
ID=7858359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW088100316A TW401516B (en) | 1998-02-20 | 1999-01-11 | Optical device and a microlithography projection exposure system with passive thermal compensation |
Country Status (5)
| Country | Link |
|---|---|
| EP (2) | EP0938009B1 (enExample) |
| JP (1) | JPH11287936A (enExample) |
| KR (1) | KR100593429B1 (enExample) |
| DE (3) | DE19807094A1 (enExample) |
| TW (1) | TW401516B (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7274430B2 (en) | 1998-02-20 | 2007-09-25 | Carl Zeiss Smt Ag | Optical arrangement and projection exposure system for microlithography with passive thermal compensation |
| DE19956353C1 (de) * | 1999-11-24 | 2001-08-09 | Zeiss Carl | Optische Anordnung |
| DE19959741A1 (de) * | 1999-12-10 | 2001-06-13 | Zeiss Carl | Vorrichtung zur deformationsarmen Lagerung eines optischen Elementes und Verfahren zur deformationsarmen Lagerung des optischen Elementes |
| DE19963588C2 (de) * | 1999-12-29 | 2002-01-10 | Zeiss Carl | Optische Anordnung |
| US6621557B2 (en) | 2000-01-13 | 2003-09-16 | Nikon Corporation | Projection exposure apparatus and exposure methods |
| DE10151919B4 (de) * | 2001-10-20 | 2007-02-01 | Carl Zeiss Smt Ag | Belichtungsobjektiv in der Halbleiterlithographie |
| EP1310829B1 (en) * | 2001-11-07 | 2007-05-02 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2003218023A (ja) * | 2002-01-28 | 2003-07-31 | Nikon Corp | Ｘ線反射鏡、ｘ線露光転写装置及び半導体デバイスの製造方法 |
| DE10210893A1 (de) * | 2002-03-07 | 2003-09-18 | Zeiss Carl Laser Optics Gmbh | Optische Anordnung mit einem optischen Bauelement, insbesondere einer Blende |
| JP4590205B2 (ja) * | 2003-05-14 | 2010-12-01 | キヤノン株式会社 | ミラー保持方法、光学装置、露光装置、およびデバイス製造方法 |
| GB0511692D0 (en) | 2005-06-08 | 2005-07-13 | Digital Projection Ltd | Heat transfer apparatus |
| DE102006021797A1 (de) * | 2006-05-09 | 2007-11-15 | Carl Zeiss Smt Ag | Optische Abbildungseinrichtung mit thermischer Dämpfung |
| GB2451684A (en) * | 2007-08-09 | 2009-02-11 | Digital Projection Ltd | Heat transfer apparatus for cooling a light valve or digital micro mirror |
| WO2009124590A1 (en) * | 2008-04-09 | 2009-10-15 | Carl Zeiss Smt Ag | Optical aperture device |
| DE102009035788B4 (de) * | 2009-07-31 | 2011-06-30 | Carl Zeiss Laser Optics GmbH, 73447 | Optische Anordnung in einem optischen System, insbesondere einer Beleuchtungseinrichtung |
| DE102013203032A1 (de) * | 2013-02-25 | 2014-02-27 | Carl Zeiss Smt Gmbh | Optische Anordnung mit einem optischen Element und einem zusätzlichen Wärmeleitelement |
| CN103499865B (zh) * | 2013-10-10 | 2015-07-29 | 中国科学院上海技术物理研究所 | 一种具有热应力缓冲结构的滤光片安装支架 |
| DE102015115931B3 (de) * | 2015-09-21 | 2016-10-27 | Jenoptik Optical Systems Gmbh | Spannungsentkoppelte monolithische Linsenfassung |
| DE102015115929B3 (de) | 2015-09-21 | 2016-10-06 | Jenoptik Optical Systems Gmbh | Monolithische Linsenfassung |
| DE102017217111A1 (de) * | 2017-09-26 | 2019-03-28 | Robert Bosch Gmbh | Anordnung eines optischen Systems und Entwärmungsverfahren |
| DE102017217107A1 (de) * | 2017-09-26 | 2019-03-28 | Robert Bosch Gmbh | Anordnung eines optischen Systems und Entwärmungsverfahren |
| EP3704546A1 (en) * | 2017-10-30 | 2020-09-09 | ASML Holding N.V. | Assembly for use in semiconductor photolithography and method of manufacturing same |
| JP6951498B2 (ja) * | 2019-06-25 | 2021-10-20 | キヤノン株式会社 | 露光装置、露光方法および物品製造方法 |
| IL284361B2 (en) * | 2021-06-24 | 2024-08-01 | Rafael Advanced Defense Systems Ltd | Temperature balanced spacer |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4057332A (en) * | 1976-04-21 | 1977-11-08 | Caterpillar Tractor Co. | Peripherally cooled laser lens assembly |
| US4155631A (en) * | 1977-04-14 | 1979-05-22 | W. J. Schafer Associates, Inc. | Apparatus for compensating for thermally introduced distortions in reflecting surfaces |
| JPS56102392A (en) * | 1980-01-22 | 1981-08-15 | Nec Corp | Laser working optical device |
| JPS6037632B2 (ja) * | 1983-02-15 | 1985-08-27 | 株式会社東芝 | 固体レ−ザ発振装置 |
| JPS59175178A (ja) * | 1983-03-24 | 1984-10-03 | Mitsubishi Electric Corp | レ−ザ装置 |
| JPS61208002A (ja) * | 1985-03-13 | 1986-09-16 | Toshiba Corp | 光透過装置 |
| DE69220868T2 (de) | 1991-09-07 | 1997-11-06 | Canon K.K., Tokio/Tokyo | System zur Stabilisierung der Formen von optischen Elementen, Belichtungsvorrichtung unter Verwendung dieses Systems und Verfahren zur Herstellung von Halbleitervorrichtungen |
| JPH05203884A (ja) * | 1992-01-24 | 1993-08-13 | Toshiba Corp | 光学素子 |
| JP3169267B2 (ja) * | 1992-06-17 | 2001-05-21 | パイオニア株式会社 | 液体プリズム |
| JP3368091B2 (ja) * | 1994-04-22 | 2003-01-20 | キヤノン株式会社 | 投影露光装置及びデバイスの製造方法 |
| US5881088A (en) * | 1997-01-08 | 1999-03-09 | Trw Inc. | Face-cooled high-power laser optic cell |
-
1998
- 1998-02-20 DE DE19807094A patent/DE19807094A1/de not_active Withdrawn
- 1998-12-22 KR KR1019980057360A patent/KR100593429B1/ko not_active Expired - Fee Related
-
1999
- 1999-01-11 TW TW088100316A patent/TW401516B/zh not_active IP Right Cessation
- 1999-01-19 EP EP99100845A patent/EP0938009B1/de not_active Expired - Lifetime
- 1999-01-19 DE DE59912313T patent/DE59912313D1/de not_active Expired - Fee Related
- 1999-01-19 DE DE59914228T patent/DE59914228D1/de not_active Expired - Fee Related
- 1999-01-19 EP EP05106797A patent/EP1596235B1/de not_active Expired - Lifetime
- 1999-02-15 JP JP11035932A patent/JPH11287936A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE59912313D1 (de) | 2005-09-01 |
| EP1596235A1 (de) | 2005-11-16 |
| JPH11287936A (ja) | 1999-10-19 |
| EP0938009B1 (de) | 2005-07-27 |
| DE59914228D1 (de) | 2007-04-12 |
| DE19807094A1 (de) | 1999-08-26 |
| EP1596235B1 (de) | 2007-02-28 |
| EP0938009A1 (de) | 1999-08-25 |
| KR100593429B1 (ko) | 2006-10-24 |
| KR19990071443A (ko) | 1999-09-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |