JPH11251539A - 回路モジュール - Google Patents

回路モジュール

Info

Publication number
JPH11251539A
JPH11251539A JP10055202A JP5520298A JPH11251539A JP H11251539 A JPH11251539 A JP H11251539A JP 10055202 A JP10055202 A JP 10055202A JP 5520298 A JP5520298 A JP 5520298A JP H11251539 A JPH11251539 A JP H11251539A
Authority
JP
Japan
Prior art keywords
connector
wiring
main surface
circuit module
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10055202A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11251539A5 (enExample
Inventor
Yasunobu Nakase
泰伸 中瀬
Tsutomu Yoshimura
勉 吉村
Kiichi Morooka
毅一 諸岡
Naoya Watanabe
直也 渡邊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10055202A priority Critical patent/JPH11251539A/ja
Priority to US09/131,688 priority patent/US6392897B1/en
Priority to TW087113301A priority patent/TW486809B/zh
Priority to KR1019980051395A priority patent/KR100332518B1/ko
Publication of JPH11251539A publication Critical patent/JPH11251539A/ja
Publication of JPH11251539A5 publication Critical patent/JPH11251539A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Semiconductor Memories (AREA)
  • Memory System (AREA)
  • Dram (AREA)
JP10055202A 1998-03-06 1998-03-06 回路モジュール Pending JPH11251539A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP10055202A JPH11251539A (ja) 1998-03-06 1998-03-06 回路モジュール
US09/131,688 US6392897B1 (en) 1998-03-06 1998-08-10 Circuit module
TW087113301A TW486809B (en) 1998-03-06 1998-08-13 Circuit module
KR1019980051395A KR100332518B1 (ko) 1998-03-06 1998-11-27 회로 모듈

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10055202A JPH11251539A (ja) 1998-03-06 1998-03-06 回路モジュール

Publications (2)

Publication Number Publication Date
JPH11251539A true JPH11251539A (ja) 1999-09-17
JPH11251539A5 JPH11251539A5 (enExample) 2005-09-02

Family

ID=12992098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10055202A Pending JPH11251539A (ja) 1998-03-06 1998-03-06 回路モジュール

Country Status (4)

Country Link
US (1) US6392897B1 (enExample)
JP (1) JPH11251539A (enExample)
KR (1) KR100332518B1 (enExample)
TW (1) TW486809B (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001100064A (ja) * 1999-09-30 2001-04-13 Kyocera Corp 光部品実装用基板及びそれを用いた光モジュール
JP2001256772A (ja) * 2000-03-10 2001-09-21 Hitachi Ltd メモリモジュール
JP2001256175A (ja) * 2000-03-10 2001-09-21 Hitachi Ltd メモリシステム
JP2002023900A (ja) * 2000-06-09 2002-01-25 Samsung Electronics Co Ltd 短いループスルー方式のメモリシステム構成を有するメモリモジュール
US6487086B2 (en) 2000-03-13 2002-11-26 Nec Corporation Circuit module
US6882241B2 (en) 2001-09-27 2005-04-19 Elpida Memory, Inc. Method, memory system and memory module board for avoiding local incoordination of impedance around memory chips on the memory system
DE10121901B4 (de) * 2000-06-30 2010-04-29 Samsung Electronics Co., Ltd., Suwon Speichersystem
US8734166B2 (en) 2010-10-21 2014-05-27 Fujitsu Limited Printed wiring board and connector, and method for manufacturing printed wiring board

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6067594A (en) * 1997-09-26 2000-05-23 Rambus, Inc. High frequency bus system
JP4383601B2 (ja) * 1999-09-30 2009-12-16 株式会社東芝 高速メモリ装置、高速メモリ装置のソケット実装構造、及び高速メモリ装置の実装方法
US6545875B1 (en) * 2000-05-10 2003-04-08 Rambus, Inc. Multiple channel modules and bus systems using same
KR100351053B1 (ko) * 2000-05-19 2002-09-05 삼성전자 주식회사 종단저항을 내장하는 메모리 모듈 및 이를 포함하여 다중채널구조를 갖는 메모리 모듈
JP2002117000A (ja) * 2000-10-05 2002-04-19 Hitachi Ltd メモリシステムおよび接続部材
KR100355237B1 (ko) * 2000-10-16 2002-10-11 삼성전자 주식회사 모듈확장용 소켓들 및 상기 모듈확장용 소켓들을 이용하는메모리시스템
KR100429878B1 (ko) * 2001-09-10 2004-05-03 삼성전자주식회사 메모리 모듈과 그에 사용되는 인쇄회로기판
JP4094370B2 (ja) * 2002-07-31 2008-06-04 エルピーダメモリ株式会社 メモリモジュール及びメモリシステム
DE10250156A1 (de) * 2002-10-28 2004-05-13 Infineon Technologies Ag Speichermodul und Speicheranordnung mit abzweigfreien Signalleitungen und verteilten kapazitiven Lasten
US7219242B2 (en) * 2003-03-31 2007-05-15 Intel Corporation Direct plane access power delivery
JP2005136090A (ja) * 2003-10-29 2005-05-26 Toshiba Corp カード形電子機器およびその製造方法
KR100576366B1 (ko) * 2004-10-29 2006-05-03 삼성전자주식회사 반도체 메모리 장치 및 이 장치의 신호라인 배치방법
KR20070033714A (ko) * 2005-09-22 2007-03-27 삼성전자주식회사 데이터 전송 라인 배선 방법
JP2007109932A (ja) * 2005-10-14 2007-04-26 Toshiba Corp 半導体装置
US8161219B2 (en) * 2008-09-30 2012-04-17 Qimonda Ag Distributed command and address bus architecture for a memory module having portions of bus lines separately disposed
KR101526318B1 (ko) * 2009-01-09 2015-06-05 삼성전자주식회사 메인 보드 상에 스터브 저항이 형성된 메모리 보드를 포함하는 메모리 시스템
JP2011049216A (ja) * 2009-08-25 2011-03-10 Elpida Memory Inc 回路基板及びこれを備える半導体装置、メモリモジュール、メモリシステム、並びに、回路基板の製造方法
TWI400999B (zh) * 2011-04-15 2013-07-01 Hon Hai Prec Ind Co Ltd 印刷電路板
TW201249268A (en) * 2011-05-20 2012-12-01 Hon Hai Prec Ind Co Ltd Printed circuit board
US9437518B2 (en) * 2012-10-29 2016-09-06 Samsung Electronics Co., Ltd. Semiconductor module
US20140304445A1 (en) * 2013-04-09 2014-10-09 William Michael Gervasi Memory bus loading and conditioning module
DE102013109234B4 (de) 2013-08-27 2021-08-12 HELLA GmbH & Co. KGaA Leiterplatteneinheit mit Mitteln zur Kontaktierung eines Randkontaktsteckers
JP2020030978A (ja) * 2018-08-23 2020-02-27 株式会社デンソー 基板モジュール
DE102023206234A1 (de) * 2023-06-30 2025-01-02 Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Coburg Steuergerät für einen bürstenlosen Elektromotor

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2509969B2 (ja) * 1988-02-26 1996-06-26 株式会社日立製作所 電子装置
US5227664A (en) * 1988-02-26 1993-07-13 Hitachi, Ltd. Semiconductor device having particular mounting arrangement
US5319591A (en) 1991-12-26 1994-06-07 Oki Electric Industry Co., Ltd. Memory module
US5731633A (en) * 1992-09-16 1998-03-24 Gary W. Hamilton Thin multichip module
JP3099051B2 (ja) 1993-06-25 2000-10-16 株式会社日立製作所 半導体実装装置
US5412538A (en) * 1993-07-19 1995-05-02 Cordata, Inc. Space-saving memory module
US5513135A (en) * 1994-12-02 1996-04-30 International Business Machines Corporation Synchronous memory packaged in single/dual in-line memory module and method of fabrication
US5754408A (en) * 1995-11-29 1998-05-19 Mitsubishi Semiconductor America, Inc. Stackable double-density integrated circuit assemblies
JPH09162572A (ja) 1995-12-13 1997-06-20 Mitsubishi Electric Corp 電子機器
JPH09205283A (ja) * 1996-01-25 1997-08-05 Hitachi Ltd 半導体モジュール及びメモリモジュール
US5841686A (en) * 1996-11-22 1998-11-24 Ma Laboratories, Inc. Dual-bank memory module with shared capacitors and R-C elements integrated into the module substrate
US5995378A (en) * 1997-12-31 1999-11-30 Micron Technology, Inc. Semiconductor device socket, assembly and methods

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001100064A (ja) * 1999-09-30 2001-04-13 Kyocera Corp 光部品実装用基板及びそれを用いた光モジュール
JP2001256772A (ja) * 2000-03-10 2001-09-21 Hitachi Ltd メモリモジュール
JP2001256175A (ja) * 2000-03-10 2001-09-21 Hitachi Ltd メモリシステム
US6487086B2 (en) 2000-03-13 2002-11-26 Nec Corporation Circuit module
JP2002023900A (ja) * 2000-06-09 2002-01-25 Samsung Electronics Co Ltd 短いループスルー方式のメモリシステム構成を有するメモリモジュール
US6772262B1 (en) 2000-06-09 2004-08-03 Samsung Electronics Co., Ltd. Memory module with improved data bus performance
US6990543B2 (en) 2000-06-09 2006-01-24 Samsung Electronics, Co., Ltd. Memory module with improved data bus performance
DE10121901B4 (de) * 2000-06-30 2010-04-29 Samsung Electronics Co., Ltd., Suwon Speichersystem
US6882241B2 (en) 2001-09-27 2005-04-19 Elpida Memory, Inc. Method, memory system and memory module board for avoiding local incoordination of impedance around memory chips on the memory system
US8734166B2 (en) 2010-10-21 2014-05-27 Fujitsu Limited Printed wiring board and connector, and method for manufacturing printed wiring board

Also Published As

Publication number Publication date
TW486809B (en) 2002-05-11
KR19990076547A (ko) 1999-10-15
US6392897B1 (en) 2002-05-21
KR100332518B1 (ko) 2002-06-20

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