JPH11238958A - 回路基板の製造方法及び製造装置 - Google Patents

回路基板の製造方法及び製造装置

Info

Publication number
JPH11238958A
JPH11238958A JP10041919A JP4191998A JPH11238958A JP H11238958 A JPH11238958 A JP H11238958A JP 10041919 A JP10041919 A JP 10041919A JP 4191998 A JP4191998 A JP 4191998A JP H11238958 A JPH11238958 A JP H11238958A
Authority
JP
Japan
Prior art keywords
manufacturing
prepreg sheet
circuit board
metal foil
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP10041919A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11238958A5 (OSRAM
Inventor
Yasuhiro Nakaya
安広 仲谷
Seiichi Nakatani
誠一 中谷
Tosaku Nishiyama
東作 西山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10041919A priority Critical patent/JPH11238958A/ja
Publication of JPH11238958A publication Critical patent/JPH11238958A/ja
Publication of JPH11238958A5 publication Critical patent/JPH11238958A5/ja
Withdrawn legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP10041919A 1998-02-24 1998-02-24 回路基板の製造方法及び製造装置 Withdrawn JPH11238958A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10041919A JPH11238958A (ja) 1998-02-24 1998-02-24 回路基板の製造方法及び製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10041919A JPH11238958A (ja) 1998-02-24 1998-02-24 回路基板の製造方法及び製造装置

Publications (2)

Publication Number Publication Date
JPH11238958A true JPH11238958A (ja) 1999-08-31
JPH11238958A5 JPH11238958A5 (OSRAM) 2005-06-23

Family

ID=12621671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10041919A Withdrawn JPH11238958A (ja) 1998-02-24 1998-02-24 回路基板の製造方法及び製造装置

Country Status (1)

Country Link
JP (1) JPH11238958A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005057997A1 (ja) * 2003-12-10 2005-06-23 Matsushita Electric Industrial Co., Ltd. 回路基板の製造方法
JP2007136835A (ja) * 2005-11-17 2007-06-07 Hitachi Chem Co Ltd 積層板の製造装置および積層板の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005057997A1 (ja) * 2003-12-10 2005-06-23 Matsushita Electric Industrial Co., Ltd. 回路基板の製造方法
KR100737057B1 (ko) 2003-12-10 2007-07-06 마츠시타 덴끼 산교 가부시키가이샤 회로 기판의 제조 방법
US7281325B2 (en) 2003-12-10 2007-10-16 Matsushita Electric Industrial Co., Ltd. Method of manufacturing circuit board
JP2007136835A (ja) * 2005-11-17 2007-06-07 Hitachi Chem Co Ltd 積層板の製造装置および積層板の製造方法

Similar Documents

Publication Publication Date Title
JP2000263577A5 (OSRAM)
JP3903701B2 (ja) 多層回路基板とその製造方法
KR20100003633A (ko) 다층 회로 기판의 제조 방법 및 다층 회로 기판의 제조장치
CN100466883C (zh) 电路基板及其制造方法
JPWO2007069510A1 (ja) 回路基板を製造するための中間材とそれを用いた回路基板の製造方法
KR20060037238A (ko) 회로 기판의 제조 방법
JP2768236B2 (ja) 多層基板の製造方法
JP2008124370A (ja) 多層プリント配線板の製造方法
JP3277195B2 (ja) 多層プリント配線板およびその製造方法
JP2991032B2 (ja) 多層基板の製造方法
JPH11238958A (ja) 回路基板の製造方法及び製造装置
JP3732905B2 (ja) 回路基板の製造装置
WO2005065001A1 (ja) 回路基板の製造方法および製造装置
JPH11207766A (ja) 多層プリント配線板の製造方法
JP3145079B2 (ja) 多層プリント基板の製造方法とその製造装置
JP2009246146A (ja) 回路基板の製造方法
JP3736450B2 (ja) 回路基板の製造方法
JP4395741B2 (ja) 多層基板の製造方法
JP2001308522A (ja) 多層プリント配線板の製造方法およびプリプレグ
JP2005019474A (ja) 多層基板の製造方法及び多層基板
JPH0565076B2 (OSRAM)
JPH0476784B2 (OSRAM)
JPS61211006A (ja) プリプレグの製造方法
JP2002171061A (ja) 多層プリント配線板の製造方法
JPH03110158A (ja) 積層板の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040929

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040929

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20061031

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20061211