JPH11233545A - 半導体装置とその製造方法 - Google Patents

半導体装置とその製造方法

Info

Publication number
JPH11233545A
JPH11233545A JP10317057A JP31705798A JPH11233545A JP H11233545 A JPH11233545 A JP H11233545A JP 10317057 A JP10317057 A JP 10317057A JP 31705798 A JP31705798 A JP 31705798A JP H11233545 A JPH11233545 A JP H11233545A
Authority
JP
Japan
Prior art keywords
photosensitive resin
semiconductor device
electrode
electrode pad
protruding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10317057A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11233545A5 (https=
Inventor
Noboru Taguchi
昇 田口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP10317057A priority Critical patent/JPH11233545A/ja
Publication of JPH11233545A publication Critical patent/JPH11233545A/ja
Publication of JPH11233545A5 publication Critical patent/JPH11233545A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
JP10317057A 1997-11-10 1998-11-09 半導体装置とその製造方法 Pending JPH11233545A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10317057A JPH11233545A (ja) 1997-11-10 1998-11-09 半導体装置とその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9-306958 1997-11-10
JP30695897 1997-11-10
JP10317057A JPH11233545A (ja) 1997-11-10 1998-11-09 半導体装置とその製造方法

Publications (2)

Publication Number Publication Date
JPH11233545A true JPH11233545A (ja) 1999-08-27
JPH11233545A5 JPH11233545A5 (https=) 2005-12-08

Family

ID=26564925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10317057A Pending JPH11233545A (ja) 1997-11-10 1998-11-09 半導体装置とその製造方法

Country Status (1)

Country Link
JP (1) JPH11233545A (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186333A (ja) * 2002-12-02 2004-07-02 Seiko Epson Corp 半導体装置及びその製造方法と回路基板及び電気光学装置、並びに電子機器
EP1587142A1 (en) * 2004-04-16 2005-10-19 Seiko Epson Corporation Electronic component, mounted structure, electro-optical device, and electronic device
JP2005303021A (ja) * 2004-04-13 2005-10-27 Sony Corp 配線基板、半導体装置およびこれらの製造方法
JP2007027230A (ja) * 2005-07-13 2007-02-01 Sanyo Epson Imaging Devices Corp 半導体装置、実装構造体、電気光学装置及び電子機器
JP2015220409A (ja) * 2014-05-20 2015-12-07 三菱電機株式会社 半導体装置の製造方法および半導体装置
CN107591386A (zh) * 2016-07-06 2018-01-16 南亚科技股份有限公司 半导体结构及其制造方法
KR20180021034A (ko) * 2015-12-16 2018-02-28 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 반도체 소자 구조체 및 이의 형성 방법

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9362246B2 (en) 2002-12-02 2016-06-07 Seiko Epson Corporation Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
US7098127B2 (en) 2002-12-02 2006-08-29 Seiko Epson Corporation Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
US7132749B2 (en) 2002-12-02 2006-11-07 Seiko Epson Corporation Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
US7795129B2 (en) 2002-12-02 2010-09-14 Seiko Epson Corporation Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
JP2004186333A (ja) * 2002-12-02 2004-07-02 Seiko Epson Corp 半導体装置及びその製造方法と回路基板及び電気光学装置、並びに電子機器
JP2005303021A (ja) * 2004-04-13 2005-10-27 Sony Corp 配線基板、半導体装置およびこれらの製造方法
EP1587142A1 (en) * 2004-04-16 2005-10-19 Seiko Epson Corporation Electronic component, mounted structure, electro-optical device, and electronic device
US7166920B2 (en) 2004-04-16 2007-01-23 Seiko Epson Corporation Electronic component, mounted structure, electro-optical device, and electronic device
JP2007027230A (ja) * 2005-07-13 2007-02-01 Sanyo Epson Imaging Devices Corp 半導体装置、実装構造体、電気光学装置及び電子機器
JP2015220409A (ja) * 2014-05-20 2015-12-07 三菱電機株式会社 半導体装置の製造方法および半導体装置
KR20180021034A (ko) * 2015-12-16 2018-02-28 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 반도체 소자 구조체 및 이의 형성 방법
US10163817B2 (en) 2015-12-16 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same
US10224293B2 (en) 2015-12-16 2019-03-05 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method for forming the same
US10636748B2 (en) 2015-12-16 2020-04-28 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure
US10943873B2 (en) 2015-12-16 2021-03-09 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same
CN107591386A (zh) * 2016-07-06 2018-01-16 南亚科技股份有限公司 半导体结构及其制造方法
CN107591386B (zh) * 2016-07-06 2019-11-26 南亚科技股份有限公司 半导体结构及其制造方法

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