JPH1121693A5 - - Google Patents
Info
- Publication number
- JPH1121693A5 JPH1121693A5 JP1997188953A JP18895397A JPH1121693A5 JP H1121693 A5 JPH1121693 A5 JP H1121693A5 JP 1997188953 A JP1997188953 A JP 1997188953A JP 18895397 A JP18895397 A JP 18895397A JP H1121693 A5 JPH1121693 A5 JP H1121693A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- hydrogen atom
- atom
- alkyl
- nitrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18895397A JP3782869B2 (ja) | 1997-07-01 | 1997-07-01 | 錫−銀合金めっき浴 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18895397A JP3782869B2 (ja) | 1997-07-01 | 1997-07-01 | 錫−銀合金めっき浴 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH1121693A JPH1121693A (ja) | 1999-01-26 |
| JPH1121693A5 true JPH1121693A5 (enExample) | 2004-08-19 |
| JP3782869B2 JP3782869B2 (ja) | 2006-06-07 |
Family
ID=16232819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18895397A Expired - Lifetime JP3782869B2 (ja) | 1997-07-01 | 1997-07-01 | 錫−銀合金めっき浴 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3782869B2 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6210556B1 (en) * | 1998-02-12 | 2001-04-03 | Learonal, Inc. | Electrolyte and tin-silver electroplating process |
| JP3352422B2 (ja) | 1999-02-10 | 2002-12-03 | セントラル硝子株式会社 | 銀被膜形成用薬液および銀被膜形成方法 |
| JP3433291B2 (ja) * | 1999-09-27 | 2003-08-04 | 石原薬品株式会社 | スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品 |
| JP3181571B2 (ja) * | 2000-01-27 | 2001-07-03 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 金メッキ液及びそれを用いた金メッキ方法 |
| DE10026680C1 (de) * | 2000-05-30 | 2002-02-21 | Schloetter Fa Dr Ing Max | Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten |
| US6448281B1 (en) | 2000-07-06 | 2002-09-10 | Boehringer Ingelheim (Canada) Ltd. | Viral polymerase inhibitors |
| FR2825764B1 (fr) * | 2001-06-07 | 2003-09-19 | Hispano Suiza Sa | Palier lisse muni d'un revetement de frottement et procede de realisation |
| AU2003252677A1 (en) * | 2002-07-25 | 2004-02-16 | Shinryo Electronics Co., Ltd. | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| US7273540B2 (en) | 2002-07-25 | 2007-09-25 | Shinryo Electronics Co., Ltd. | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| JP4758614B2 (ja) * | 2003-04-07 | 2011-08-31 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 電気めっき組成物および方法 |
| EP1826295A4 (en) | 2004-10-21 | 2011-06-29 | Fcm Co Ltd | METHOD FOR FORMING A THIN FILM OF SN-AG-CU-DREAMED ALLOY ALLOY ALLOY |
| JP3741709B1 (ja) * | 2005-02-07 | 2006-02-01 | Fcm株式会社 | Sn−Ag−Cu三元合金薄膜を形成する方法 |
| JP4756887B2 (ja) * | 2005-03-22 | 2011-08-24 | 石原薬品株式会社 | 非シアン系のスズ−銀合金電気メッキ浴 |
| JP4756886B2 (ja) * | 2005-03-22 | 2011-08-24 | 石原薬品株式会社 | 非シアン系のスズ−銀合金メッキ浴 |
| US7713859B2 (en) * | 2005-08-15 | 2010-05-11 | Enthone Inc. | Tin-silver solder bumping in electronics manufacture |
| EP1918426A1 (de) * | 2006-10-09 | 2008-05-07 | Enthone, Inc. | Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten |
| JP5622360B2 (ja) * | 2009-01-16 | 2014-11-12 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 電気錫めっき液および電気錫めっき方法 |
| DE102009029558A1 (de) * | 2009-09-17 | 2011-03-31 | Schott Solar Ag | Elektrolytzusammensetzung |
| JP2017025382A (ja) * | 2015-07-23 | 2017-02-02 | 奥野製薬工業株式会社 | 黒色光沢スズ−ニッケル合金めっき浴、スズ−ニッケル合金めっき方法、黒色光沢スズ−ニッケル合金めっき皮膜及び該皮膜を有する物品 |
| JP7009679B2 (ja) * | 2015-07-29 | 2022-01-26 | 石原ケミカル株式会社 | 電気スズ及び電気スズ合金メッキ浴、当該メッキ浴を用いた電着物の形成方法 |
| JP6834070B2 (ja) * | 2016-06-13 | 2021-02-24 | 石原ケミカル株式会社 | 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いて電着物を形成した電子部品の製造方法 |
-
1997
- 1997-07-01 JP JP18895397A patent/JP3782869B2/ja not_active Expired - Lifetime
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