JPH11177214A5 - - Google Patents
Info
- Publication number
- JPH11177214A5 JPH11177214A5 JP1998192270A JP19227098A JPH11177214A5 JP H11177214 A5 JPH11177214 A5 JP H11177214A5 JP 1998192270 A JP1998192270 A JP 1998192270A JP 19227098 A JP19227098 A JP 19227098A JP H11177214 A5 JPH11177214 A5 JP H11177214A5
- Authority
- JP
- Japan
- Prior art keywords
- immerse
- rinse
- minutes
- water
- promoter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/868,092 US6565731B1 (en) | 1997-06-03 | 1997-06-03 | Electroplating process |
| US868092 | 1997-06-03 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11177214A JPH11177214A (ja) | 1999-07-02 |
| JPH11177214A5 true JPH11177214A5 (enExample) | 2008-11-06 |
| JP4249291B2 JP4249291B2 (ja) | 2009-04-02 |
Family
ID=25351058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19227098A Expired - Fee Related JP4249291B2 (ja) | 1997-06-03 | 1998-06-03 | 電解めっき方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6565731B1 (enExample) |
| EP (1) | EP0883331B1 (enExample) |
| JP (1) | JP4249291B2 (enExample) |
| KR (1) | KR100674116B1 (enExample) |
| DE (1) | DE69832845T2 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
| TW593731B (en) * | 1998-03-20 | 2004-06-21 | Semitool Inc | Apparatus for applying a metal structure to a workpiece |
| JP4055319B2 (ja) * | 2000-02-18 | 2008-03-05 | ソニー株式会社 | 半導体装置の製造方法 |
| EP1202384A1 (de) * | 2000-10-31 | 2002-05-02 | Molekulare Energietechnik AG | Funkantenne als Sendeantenne oder Empfangsantenne und Mobilfunksystem |
| EP1598449B1 (en) * | 2004-04-26 | 2010-08-04 | Rohm and Haas Electronic Materials, L.L.C. | Improved plating method |
| JP4783954B2 (ja) * | 2004-06-21 | 2011-09-28 | Dowaメタルテック株式会社 | 複合めっき材およびその製造方法 |
| US7214304B2 (en) * | 2004-10-13 | 2007-05-08 | Hyunjung Lee | Process for preparing a non-conductive substrate for electroplating |
| JP4806808B2 (ja) * | 2005-07-05 | 2011-11-02 | Dowaメタルテック株式会社 | 複合めっき材およびその製造方法 |
| CA2647947A1 (en) * | 2006-03-30 | 2007-10-11 | Metafoam Technologies Inc. | Method for partially coating open cell porous materials |
| JP4692363B2 (ja) * | 2006-04-10 | 2011-06-01 | 日立電線株式会社 | 配線基板のめっき形成方法、及びめっき装置 |
| JP5715748B2 (ja) * | 2008-10-31 | 2015-05-13 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 無電解めっき用コンディショナー |
| US8161637B2 (en) | 2009-07-24 | 2012-04-24 | Ibiden Co., Ltd. | Manufacturing method for printed wiring board |
| KR101537638B1 (ko) * | 2010-05-18 | 2015-07-17 | 삼성전자 주식회사 | 그라펜 박막을 이용한 수지의 도금 방법 |
| US10986738B2 (en) * | 2018-05-08 | 2021-04-20 | Macdermid Enthone Inc. | Carbon-based direct plating process |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3674711A (en) * | 1969-12-10 | 1972-07-04 | Varian Associates | Electrically conductive transparent plastic material |
| CA956850A (en) | 1970-03-16 | 1974-10-29 | Frederick W. Schneble (Jr.) | Direct bonding of electroless metals to substrates |
| US3962497A (en) * | 1975-03-11 | 1976-06-08 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating |
| US4309247A (en) * | 1976-03-15 | 1982-01-05 | Amf Incorporated | Filter and method of making same |
| US4701350B2 (en) | 1980-11-06 | 1997-08-05 | Surface Technology Corp | Process for electroless metal deposition |
| US4515829A (en) | 1983-10-14 | 1985-05-07 | Shipley Company Inc. | Through-hole plating |
| US4619741A (en) | 1985-04-11 | 1986-10-28 | Olin Hunt Specialty Products Inc. | Process for preparing a non-conductive substrate for electroplating |
| US5110355A (en) * | 1990-03-26 | 1992-05-05 | Olin Hunt Sub Iii Corp. | Process for preparing nonconductive substrates |
| US5015339A (en) * | 1990-03-26 | 1991-05-14 | Olin Hunt Sub Iii Corp. | Process for preparing nonconductive substrates |
| US5143592A (en) * | 1990-06-01 | 1992-09-01 | Olin Corporation | Process for preparing nonconductive substrates |
| US5683565A (en) * | 1995-06-09 | 1997-11-04 | Shipley Company, L.L.C. | Electroplating process |
| US5611905A (en) | 1995-06-09 | 1997-03-18 | Shipley Company, L.L.C. | Electroplating process |
-
1997
- 1997-06-03 US US08/868,092 patent/US6565731B1/en not_active Expired - Fee Related
-
1998
- 1998-05-25 EP EP98109457A patent/EP0883331B1/en not_active Expired - Lifetime
- 1998-05-25 DE DE69832845T patent/DE69832845T2/de not_active Expired - Lifetime
- 1998-06-03 JP JP19227098A patent/JP4249291B2/ja not_active Expired - Fee Related
- 1998-06-03 KR KR1019980021186A patent/KR100674116B1/ko not_active Expired - Fee Related
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