DE69832845T2 - Elektroplattierungsverfahren - Google Patents

Elektroplattierungsverfahren Download PDF

Info

Publication number
DE69832845T2
DE69832845T2 DE69832845T DE69832845T DE69832845T2 DE 69832845 T2 DE69832845 T2 DE 69832845T2 DE 69832845 T DE69832845 T DE 69832845T DE 69832845 T DE69832845 T DE 69832845T DE 69832845 T2 DE69832845 T2 DE 69832845T2
Authority
DE
Germany
Prior art keywords
solution
carbon
substrate
dispersion
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69832845T
Other languages
German (de)
English (en)
Other versions
DE69832845D1 (de
Inventor
Edward C. Couble
Mark J. Kapeckas
Steven M. Florio
David L. Jacques
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
DuPont Electronic Materials International LLC
Original Assignee
Shipley Co Inc
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc, Shipley Co LLC filed Critical Shipley Co Inc
Application granted granted Critical
Publication of DE69832845D1 publication Critical patent/DE69832845D1/de
Publication of DE69832845T2 publication Critical patent/DE69832845T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
DE69832845T 1997-06-03 1998-05-25 Elektroplattierungsverfahren Expired - Lifetime DE69832845T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/868,092 US6565731B1 (en) 1997-06-03 1997-06-03 Electroplating process
US868092 1997-06-03

Publications (2)

Publication Number Publication Date
DE69832845D1 DE69832845D1 (de) 2006-01-26
DE69832845T2 true DE69832845T2 (de) 2006-08-10

Family

ID=25351058

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69832845T Expired - Lifetime DE69832845T2 (de) 1997-06-03 1998-05-25 Elektroplattierungsverfahren

Country Status (5)

Country Link
US (1) US6565731B1 (enExample)
EP (1) EP0883331B1 (enExample)
JP (1) JP4249291B2 (enExample)
KR (1) KR100674116B1 (enExample)
DE (1) DE69832845T2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
JP4055319B2 (ja) * 2000-02-18 2008-03-05 ソニー株式会社 半導体装置の製造方法
EP1202384A1 (de) * 2000-10-31 2002-05-02 Molekulare Energietechnik AG Funkantenne als Sendeantenne oder Empfangsantenne und Mobilfunksystem
EP1598449B1 (en) * 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
JP4783954B2 (ja) * 2004-06-21 2011-09-28 Ｄｏｗａメタルテック株式会社 複合めっき材およびその製造方法
US7214304B2 (en) * 2004-10-13 2007-05-08 Hyunjung Lee Process for preparing a non-conductive substrate for electroplating
JP4806808B2 (ja) * 2005-07-05 2011-11-02 Ｄｏｗａメタルテック株式会社 複合めっき材およびその製造方法
CA2647947A1 (en) * 2006-03-30 2007-10-11 Metafoam Technologies Inc. Method for partially coating open cell porous materials
JP4692363B2 (ja) * 2006-04-10 2011-06-01 日立電線株式会社 配線基板のめっき形成方法、及びめっき装置
JP5715748B2 (ja) * 2008-10-31 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 無電解めっき用コンディショナー
US8161637B2 (en) 2009-07-24 2012-04-24 Ibiden Co., Ltd. Manufacturing method for printed wiring board
KR101537638B1 (ko) * 2010-05-18 2015-07-17 삼성전자 주식회사 그라펜 박막을 이용한 수지의 도금 방법
US10986738B2 (en) * 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674711A (en) * 1969-12-10 1972-07-04 Varian Associates Electrically conductive transparent plastic material
CA956850A (en) 1970-03-16 1974-10-29 Frederick W. Schneble (Jr.) Direct bonding of electroless metals to substrates
US3962497A (en) * 1975-03-11 1976-06-08 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating
US4309247A (en) * 1976-03-15 1982-01-05 Amf Incorporated Filter and method of making same
US4701350B2 (en) 1980-11-06 1997-08-05 Surface Technology Corp Process for electroless metal deposition
US4515829A (en) 1983-10-14 1985-05-07 Shipley Company Inc. Through-hole plating
US4619741A (en) 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
US5110355A (en) * 1990-03-26 1992-05-05 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US5015339A (en) * 1990-03-26 1991-05-14 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US5143592A (en) * 1990-06-01 1992-09-01 Olin Corporation Process for preparing nonconductive substrates
US5683565A (en) * 1995-06-09 1997-11-04 Shipley Company, L.L.C. Electroplating process
US5611905A (en) 1995-06-09 1997-03-18 Shipley Company, L.L.C. Electroplating process

Also Published As

Publication number Publication date
EP0883331A3 (en) 2001-08-01
KR19990006763A (ko) 1999-01-25
EP0883331B1 (en) 2005-12-21
KR100674116B1 (ko) 2007-06-04
JPH11177214A (ja) 1999-07-02
US6565731B1 (en) 2003-05-20
DE69832845D1 (de) 2006-01-26
JP4249291B2 (ja) 2009-04-02
EP0883331A2 (en) 1998-12-09

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