KR100674116B1 - 전기도금방법 - Google Patents

전기도금방법 Download PDF

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Publication number
KR100674116B1
KR100674116B1 KR1019980021186A KR19980021186A KR100674116B1 KR 100674116 B1 KR100674116 B1 KR 100674116B1 KR 1019980021186 A KR1019980021186 A KR 1019980021186A KR 19980021186 A KR19980021186 A KR 19980021186A KR 100674116 B1 KR100674116 B1 KR 100674116B1
Authority
KR
South Korea
Prior art keywords
coating
solution
substrate
copper
dispersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019980021186A
Other languages
English (en)
Korean (ko)
Other versions
KR19990006763A (ko
Inventor
에드워드 씨. 커블
마크 제이. 카펙카스
스티븐 엠. 플로리오
데이빗 엘. 자퀘스
Original Assignee
롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 filed Critical 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨
Publication of KR19990006763A publication Critical patent/KR19990006763A/ko
Application granted granted Critical
Publication of KR100674116B1 publication Critical patent/KR100674116B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
KR1019980021186A 1997-06-03 1998-06-03 전기도금방법 Expired - Fee Related KR100674116B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8/868,092 1997-06-03
US08/868,092 1997-06-03
US08/868,092 US6565731B1 (en) 1997-06-03 1997-06-03 Electroplating process

Publications (2)

Publication Number Publication Date
KR19990006763A KR19990006763A (ko) 1999-01-25
KR100674116B1 true KR100674116B1 (ko) 2007-06-04

Family

ID=25351058

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980021186A Expired - Fee Related KR100674116B1 (ko) 1997-06-03 1998-06-03 전기도금방법

Country Status (5)

Country Link
US (1) US6565731B1 (enExample)
EP (1) EP0883331B1 (enExample)
JP (1) JP4249291B2 (enExample)
KR (1) KR100674116B1 (enExample)
DE (1) DE69832845T2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
JP4055319B2 (ja) * 2000-02-18 2008-03-05 ソニー株式会社 半導体装置の製造方法
EP1202384A1 (de) * 2000-10-31 2002-05-02 Molekulare Energietechnik AG Funkantenne als Sendeantenne oder Empfangsantenne und Mobilfunksystem
EP1598449B1 (en) * 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
JP4783954B2 (ja) * 2004-06-21 2011-09-28 Ｄｏｗａメタルテック株式会社 複合めっき材およびその製造方法
US7214304B2 (en) * 2004-10-13 2007-05-08 Hyunjung Lee Process for preparing a non-conductive substrate for electroplating
JP4806808B2 (ja) * 2005-07-05 2011-11-02 Ｄｏｗａメタルテック株式会社 複合めっき材およびその製造方法
CA2647947A1 (en) * 2006-03-30 2007-10-11 Metafoam Technologies Inc. Method for partially coating open cell porous materials
JP4692363B2 (ja) * 2006-04-10 2011-06-01 日立電線株式会社 配線基板のめっき形成方法、及びめっき装置
JP5715748B2 (ja) * 2008-10-31 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 無電解めっき用コンディショナー
US8161637B2 (en) 2009-07-24 2012-04-24 Ibiden Co., Ltd. Manufacturing method for printed wiring board
KR101537638B1 (ko) * 2010-05-18 2015-07-17 삼성전자 주식회사 그라펜 박막을 이용한 수지의 도금 방법
US10986738B2 (en) * 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015339A (en) * 1990-03-26 1991-05-14 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674711A (en) * 1969-12-10 1972-07-04 Varian Associates Electrically conductive transparent plastic material
CA956850A (en) 1970-03-16 1974-10-29 Frederick W. Schneble (Jr.) Direct bonding of electroless metals to substrates
US3962497A (en) * 1975-03-11 1976-06-08 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating
US4309247A (en) * 1976-03-15 1982-01-05 Amf Incorporated Filter and method of making same
US4701350B2 (en) 1980-11-06 1997-08-05 Surface Technology Corp Process for electroless metal deposition
US4515829A (en) 1983-10-14 1985-05-07 Shipley Company Inc. Through-hole plating
US4619741A (en) 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
US5110355A (en) * 1990-03-26 1992-05-05 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US5143592A (en) * 1990-06-01 1992-09-01 Olin Corporation Process for preparing nonconductive substrates
US5683565A (en) * 1995-06-09 1997-11-04 Shipley Company, L.L.C. Electroplating process
US5611905A (en) 1995-06-09 1997-03-18 Shipley Company, L.L.C. Electroplating process

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015339A (en) * 1990-03-26 1991-05-14 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates

Also Published As

Publication number Publication date
EP0883331A3 (en) 2001-08-01
KR19990006763A (ko) 1999-01-25
EP0883331B1 (en) 2005-12-21
JPH11177214A (ja) 1999-07-02
US6565731B1 (en) 2003-05-20
DE69832845T2 (de) 2006-08-10
DE69832845D1 (de) 2006-01-26
JP4249291B2 (ja) 2009-04-02
EP0883331A2 (en) 1998-12-09

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