JPH11168045A - 半導体製造装置およびウェハの処理方法 - Google Patents

半導体製造装置およびウェハの処理方法

Info

Publication number
JPH11168045A
JPH11168045A JP9332584A JP33258497A JPH11168045A JP H11168045 A JPH11168045 A JP H11168045A JP 9332584 A JP9332584 A JP 9332584A JP 33258497 A JP33258497 A JP 33258497A JP H11168045 A JPH11168045 A JP H11168045A
Authority
JP
Japan
Prior art keywords
wafer
chamber
cover
gas passage
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9332584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11168045A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Satoshi Miyagi
聡 宮城
Yoshiaki Yamada
善章 山田
Takayuki Saito
隆幸 斉藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9332584A priority Critical patent/JPH11168045A/ja
Priority to US09/088,702 priority patent/US6217319B1/en
Publication of JPH11168045A publication Critical patent/JPH11168045A/ja
Publication of JPH11168045A5 publication Critical patent/JPH11168045A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP9332584A 1997-12-03 1997-12-03 半導体製造装置およびウェハの処理方法 Pending JPH11168045A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9332584A JPH11168045A (ja) 1997-12-03 1997-12-03 半導体製造装置およびウェハの処理方法
US09/088,702 US6217319B1 (en) 1997-12-03 1998-06-02 Semiconductor manufacturing device and method of processing wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9332584A JPH11168045A (ja) 1997-12-03 1997-12-03 半導体製造装置およびウェハの処理方法

Publications (2)

Publication Number Publication Date
JPH11168045A true JPH11168045A (ja) 1999-06-22
JPH11168045A5 JPH11168045A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2005-04-07

Family

ID=18256575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9332584A Pending JPH11168045A (ja) 1997-12-03 1997-12-03 半導体製造装置およびウェハの処理方法

Country Status (2)

Country Link
US (1) US6217319B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPH11168045A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100479942B1 (ko) * 2002-06-28 2005-03-30 참이앤티 주식회사 웨이퍼 가열장치
KR100732806B1 (ko) * 1999-10-19 2007-06-27 동경 엘렉트론 주식회사 가열처리장치
JP2008066645A (ja) * 2006-09-11 2008-03-21 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
KR20160141250A (ko) * 2015-05-29 2016-12-08 세메스 주식회사 기판 처리 장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080008837A1 (en) * 2006-07-10 2008-01-10 Yasuhiro Shiba Substrate processing apparatus and substrate processing method for heat-treating substrate
CN119105239A (zh) * 2023-06-09 2024-12-10 沈阳芯源微电子设备股份有限公司 盘盖单元及烘烤装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841614A (en) * 1971-12-06 1974-10-15 Kawasaki Heavy Ind Ltd Apparatus for preheating steel ingot or blooms by the use of high-speed jet streams as well as heating furnace using the same
US4556785A (en) * 1983-05-23 1985-12-03 Gca Corporation Apparatus for vapor sheathed baking of semiconductor wafers
JPS63107116A (ja) 1986-10-24 1988-05-12 Fujitsu Ltd レジストベ−キング方法
JPH03163819A (ja) 1989-11-22 1991-07-15 Mitsubishi Electric Corp 半導体装置の製造方法
JPH0684781A (ja) 1992-09-03 1994-03-25 Fujitsu Ltd 半導体製造装置
JP3983831B2 (ja) * 1995-05-30 2007-09-26 シグマメルテック株式会社 基板ベーキング装置及び基板ベーキング方法
TW464944B (en) * 1997-01-16 2001-11-21 Tokyo Electron Ltd Baking apparatus and baking method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100732806B1 (ko) * 1999-10-19 2007-06-27 동경 엘렉트론 주식회사 가열처리장치
KR100479942B1 (ko) * 2002-06-28 2005-03-30 참이앤티 주식회사 웨이퍼 가열장치
JP2008066645A (ja) * 2006-09-11 2008-03-21 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
KR20160141250A (ko) * 2015-05-29 2016-12-08 세메스 주식회사 기판 처리 장치

Also Published As

Publication number Publication date
US6217319B1 (en) 2001-04-17

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