JPH10511433A - 金属化物質の製造方法 - Google Patents
金属化物質の製造方法Info
- Publication number
- JPH10511433A JPH10511433A JP9520165A JP52016597A JPH10511433A JP H10511433 A JPH10511433 A JP H10511433A JP 9520165 A JP9520165 A JP 9520165A JP 52016597 A JP52016597 A JP 52016597A JP H10511433 A JPH10511433 A JP H10511433A
- Authority
- JP
- Japan
- Prior art keywords
- solution
- intrinsically conductive
- conductive polymer
- metal
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Silicates, Zeolites, And Molecular Sieves (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. (1)金属化される物質が真性導電性ポリマーを含有する被覆を施され、 (2)真性導電性ポリマーが還元により活性化され、及び (3)被覆を施された物質を金属のイオン含有溶液と接触せしめることにより、非 電気化学的方法で金属が物質に塗布されることを特徴とする金属化物質の製造方 法。 2.ポリアニリンが真性導電性ポリマーとして使用されることを特徴とする請求 項1記載の方法。 3.真性導電性ポリマーが分散状態で使用されることを特徴とする請求項1又は 2記載の方法。 4.真性導電性ポリマーを含有するポリマー・ブレンドが被覆剤として使用され ることを特徴とする請求項1−3の何れか一つ記載の方法。 5.還元が化学的還元剤を使用することにより行われることを特徴とする請求項 1−4の何れか一つ記載の方法。 6.H2、水素化物及び/又は真性導電性ポリマーに関して還元効果を有する金属 が、化学的還元剤として使用されることを特徴とする請求項5記載の方法。 7.ヒドラジン又はヒドラジン化合物が化学的還元剤として使用されることを特 徴とする請求項5又は6記載の方法。 8.Cu、Ag、Pd、Sn、Pt及び/又はNiの金属が物質に塗布されることを特徴とす る請求項1−7の何れか一つ記載の方法。 9.付着される金属の1価又は2価の陽イオンを含有する溶液が使用されること を特徴とする請求項1−8の何れか一つ記載の方法。 10.<7のpH値を有する水溶液が使用されることを特徴とする請求項1−9の 何れか一つ記載の方法。 11.物質に対する金属の非電気化学的塗布における真性導電性ポリマーの使用 。 12. (1)金属化される物質が真性導電性ポリマーを含有する被覆を施され、 (2)真性導電性ポリマーが還元により活性化され、及び (3)被覆を施された物質を金属のイオン含有溶液と接触せしめることにより、非 電気化学的方法で金属が物質に塗布されることを特徴とする請求項11記載の使用 。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19544543.0 | 1995-11-29 | ||
DE19544543 | 1995-11-29 | ||
PCT/EP1996/005220 WO1997020084A1 (de) | 1995-11-29 | 1996-11-26 | Verfahren zur herstellung von metallisierten werkstoffen |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10511433A true JPH10511433A (ja) | 1998-11-04 |
JP3208735B2 JP3208735B2 (ja) | 2001-09-17 |
Family
ID=7778734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52016597A Expired - Lifetime JP3208735B2 (ja) | 1995-11-29 | 1996-11-26 | 金属化物質の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5846606A (ja) |
EP (1) | EP0807190B1 (ja) |
JP (1) | JP3208735B2 (ja) |
AT (1) | ATE213026T1 (ja) |
DE (1) | DE59608706D1 (ja) |
WO (1) | WO1997020084A1 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002507660A (ja) * | 1998-03-19 | 2002-03-12 | エス.セー.ペー.エス. ソシエテ ド コンセーユ エ ド プロスペクティーフ シアンティフィック エス.アー. | 導電性が付与された厚い複合多孔質構造及び対応する導電性活性化方法 |
JP2006037227A (ja) * | 2004-06-25 | 2006-02-09 | Ormecon Gmbh | ウィスカ形成傾向の少ないスズ被覆プリント配線基板 |
JP2008190026A (ja) * | 2007-01-12 | 2008-08-21 | Achilles Corp | めっき物及びその製造方法 |
JP2009041090A (ja) * | 2007-08-10 | 2009-02-26 | Achilles Corp | 微細凹凸のある基材フィルムを用いるめっきフィルムの製造方法及びめっきフィルム |
JP2009235501A (ja) * | 2008-03-27 | 2009-10-15 | Achilles Corp | スチレン系樹脂基材へのめっき下地塗料及びこれを用いて製造されるスチレン系樹脂基材のめっき物 |
JP2009293085A (ja) * | 2008-06-05 | 2009-12-17 | Achilles Corp | ポリオレフィン系樹脂又はポリアセタール系樹脂を基材とするめっき物 |
JP2010018842A (ja) * | 2008-07-10 | 2010-01-28 | Achilles Corp | 熱負荷後においても高い密着性を有するめっき物及びその製造方法 |
JP2010209424A (ja) * | 2009-03-11 | 2010-09-24 | Achilles Corp | めっき下地層を形成する下地塗料、それを用いる筐体の製造方法及びそれにより製造される筐体 |
JP2011190483A (ja) * | 2010-03-12 | 2011-09-29 | Teijin Dupont Films Japan Ltd | 金属積層板 |
KR101419968B1 (ko) * | 2007-01-12 | 2014-07-16 | 아키레스 가부시키가이샤 | 도금물 및 이의 제조방법 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE59812308D1 (de) | 1997-07-25 | 2004-12-30 | Ormecon Gmbh | Chemische verbindungen von intrinsisch leitfähigen polymeren mit metallen |
US6380126B1 (en) | 1999-08-20 | 2002-04-30 | Medis El Ltd | Class of electrocatalysts and a gas diffusion electrode based thereon for fuel cells |
US6878664B1 (en) | 2001-01-16 | 2005-04-12 | Medis El Ltd. | Class of electrocatalysts and a gas diffusion electrode based thereon for fuel cells |
WO2002062296A2 (en) * | 2001-02-02 | 2002-08-15 | Chemocentryx, Inc. | Methods and compositions useful for stimulating an immune response |
EP1915041A1 (en) | 2001-09-28 | 2008-04-23 | Ibiden Co., Ltd. | Printed wiring board and printed wiring board manufacturing method |
US20040031404A1 (en) * | 2002-08-19 | 2004-02-19 | John Dixon | Seamless embossing shim |
US7316791B2 (en) * | 2003-12-30 | 2008-01-08 | E.I. Du Pont De Nemours And Company | Polyimide based substrate comprising doped polyaniline |
DE102004003784B4 (de) | 2004-01-23 | 2011-01-13 | Ormecon Gmbh | Dispersion intrinsisch leitfähigen Polyanilins und deren Verwendung |
EP1730215B1 (en) * | 2004-03-18 | 2017-08-16 | Enthone GmbH | A composition comprising a conductive polymer in colloidal form and carbon |
DE102004030388A1 (de) * | 2004-06-23 | 2006-01-26 | Ormecon Gmbh | Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Verfahren zu deren Herstellung |
DE102005010162B4 (de) | 2005-03-02 | 2007-06-14 | Ormecon Gmbh | Leitfähige Polymere aus Teilchen mit anisotroper Morphologie |
DE102005039608A1 (de) | 2005-08-19 | 2007-03-01 | Ormecon Gmbh | Zusammensetzung mit intrinsisch leitfähigem Polymer |
DE102006043811B4 (de) * | 2006-09-13 | 2010-05-06 | Ormecon Gmbh | Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Edel-/Halbedelmetall sowie Verfahren zu deren Herstellung |
MY147793A (en) * | 2006-09-13 | 2013-01-31 | Enthone | Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof |
US20080241401A1 (en) * | 2007-03-28 | 2008-10-02 | Hok-Kin Choi | Method of monitoring electroless plating chemistry |
DE102007040065A1 (de) | 2007-08-24 | 2009-02-26 | Ormecon Gmbh | Artikel mit einer nanoskopischen Beschichtung aus Edel-/Halbedelmetall sowie Verfahren zu deren Herstellung |
US7874674B2 (en) | 2007-12-12 | 2011-01-25 | Allred Lloyd G | Aberrometer having reduced noise |
KR101496501B1 (ko) * | 2008-04-30 | 2015-02-26 | 아키레스 가부시키가이샤 | 성형품의 도금물 및 이의 제조 방법 |
US20100055378A1 (en) * | 2008-08-26 | 2010-03-04 | Snu R&Db Foundation | Encapsulated ionic polymer-metal composite device |
EP2374612A4 (en) * | 2008-12-26 | 2017-11-15 | FUJIFILM Corporation | Surface metal film material, process for producing surface metal film material, process for producing metal pattern material, and metal pattern material |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62139896A (ja) * | 1985-12-12 | 1987-06-23 | Furukawa Electric Co Ltd:The | プラスチツクのメタライジング法 |
JPS63303077A (ja) * | 1987-05-31 | 1988-12-09 | Res Inst For Prod Dev | 導電性高分子のメッキ法 |
US5300208A (en) * | 1989-08-14 | 1994-04-05 | International Business Machines Corporation | Fabrication of printed circuit boards using conducting polymer |
DE3928832C2 (de) * | 1989-08-31 | 1995-04-20 | Blasberg Oberflaechentech | Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug |
US5237023A (en) * | 1991-03-25 | 1993-08-17 | Tomoegawa Paper Co., Ltd. | Polyaniline derivatives and their production process |
JPH0758478A (ja) * | 1993-08-09 | 1995-03-03 | Inoac Corp | 電磁シールドハウジング及びその製造方法 |
-
1996
- 1996-11-26 WO PCT/EP1996/005220 patent/WO1997020084A1/de active IP Right Grant
- 1996-11-26 JP JP52016597A patent/JP3208735B2/ja not_active Expired - Lifetime
- 1996-11-26 DE DE59608706T patent/DE59608706D1/de not_active Expired - Lifetime
- 1996-11-26 EP EP96941031A patent/EP0807190B1/de not_active Expired - Lifetime
- 1996-11-26 US US08/875,480 patent/US5846606A/en not_active Expired - Lifetime
- 1996-11-26 AT AT96941031T patent/ATE213026T1/de not_active IP Right Cessation
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002507660A (ja) * | 1998-03-19 | 2002-03-12 | エス.セー.ペー.エス. ソシエテ ド コンセーユ エ ド プロスペクティーフ シアンティフィック エス.アー. | 導電性が付与された厚い複合多孔質構造及び対応する導電性活性化方法 |
JP2006037227A (ja) * | 2004-06-25 | 2006-02-09 | Ormecon Gmbh | ウィスカ形成傾向の少ないスズ被覆プリント配線基板 |
JP4647412B2 (ja) * | 2004-06-25 | 2011-03-09 | オルメコン・ゲーエムベーハー | ウィスカ形成傾向の少ないスズ被覆プリント配線基板 |
JP2008190026A (ja) * | 2007-01-12 | 2008-08-21 | Achilles Corp | めっき物及びその製造方法 |
TWI422708B (zh) * | 2007-01-12 | 2014-01-11 | Achilles Corp | 鍍敷物及其製造方法 |
KR101419968B1 (ko) * | 2007-01-12 | 2014-07-16 | 아키레스 가부시키가이샤 | 도금물 및 이의 제조방법 |
JP2009041090A (ja) * | 2007-08-10 | 2009-02-26 | Achilles Corp | 微細凹凸のある基材フィルムを用いるめっきフィルムの製造方法及びめっきフィルム |
JP2009235501A (ja) * | 2008-03-27 | 2009-10-15 | Achilles Corp | スチレン系樹脂基材へのめっき下地塗料及びこれを用いて製造されるスチレン系樹脂基材のめっき物 |
JP2009293085A (ja) * | 2008-06-05 | 2009-12-17 | Achilles Corp | ポリオレフィン系樹脂又はポリアセタール系樹脂を基材とするめっき物 |
JP2010018842A (ja) * | 2008-07-10 | 2010-01-28 | Achilles Corp | 熱負荷後においても高い密着性を有するめっき物及びその製造方法 |
JP2010209424A (ja) * | 2009-03-11 | 2010-09-24 | Achilles Corp | めっき下地層を形成する下地塗料、それを用いる筐体の製造方法及びそれにより製造される筐体 |
JP2011190483A (ja) * | 2010-03-12 | 2011-09-29 | Teijin Dupont Films Japan Ltd | 金属積層板 |
Also Published As
Publication number | Publication date |
---|---|
EP0807190A1 (de) | 1997-11-19 |
ATE213026T1 (de) | 2002-02-15 |
EP0807190B1 (de) | 2002-02-06 |
WO1997020084A1 (de) | 1997-06-05 |
JP3208735B2 (ja) | 2001-09-17 |
DE59608706D1 (de) | 2002-03-21 |
US5846606A (en) | 1998-12-08 |
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