JPH10505121A - プリプレグ及び複合材料用エポキシ樹脂混合物 - Google Patents

プリプレグ及び複合材料用エポキシ樹脂混合物

Info

Publication number
JPH10505121A
JPH10505121A JP8509101A JP50910196A JPH10505121A JP H10505121 A JPH10505121 A JP H10505121A JP 8509101 A JP8509101 A JP 8509101A JP 50910196 A JP50910196 A JP 50910196A JP H10505121 A JPH10505121 A JP H10505121A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin mixture
weight
epoxy
phosphorus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8509101A
Other languages
English (en)
Japanese (ja)
Inventor
フオン ゲンツコフ、ウオルフガング
フーバー、ユルゲン
カピツア、ハインリツヒ
ログラー、ウオルフガング
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPH10505121A publication Critical patent/JPH10505121A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C08G59/444—Sulfonamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H10W70/695—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP8509101A 1994-09-09 1995-08-25 プリプレグ及び複合材料用エポキシ樹脂混合物 Pending JPH10505121A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4432190 1994-09-09
DE4432190.2 1994-09-09
PCT/DE1995/001137 WO1996007686A1 (de) 1994-09-09 1995-08-25 Epoxidharzmischungen für prepregs und verbundwerkstoffe

Publications (1)

Publication Number Publication Date
JPH10505121A true JPH10505121A (ja) 1998-05-19

Family

ID=6527845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8509101A Pending JPH10505121A (ja) 1994-09-09 1995-08-25 プリプレグ及び複合材料用エポキシ樹脂混合物

Country Status (9)

Country Link
US (1) US5759690A (cg-RX-API-DMAC10.html)
EP (1) EP0779906B1 (cg-RX-API-DMAC10.html)
JP (1) JPH10505121A (cg-RX-API-DMAC10.html)
CN (1) CN1068348C (cg-RX-API-DMAC10.html)
AT (1) ATE168120T1 (cg-RX-API-DMAC10.html)
CZ (1) CZ70597A3 (cg-RX-API-DMAC10.html)
DE (1) DE59502777D1 (cg-RX-API-DMAC10.html)
TW (1) TW297034B (cg-RX-API-DMAC10.html)
WO (1) WO1996007686A1 (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022098178A (ja) * 2020-12-21 2022-07-01 富士フイルム株式会社 熱伝導材料形成用組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス

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KR20000048654A (ko) 1996-09-26 2000-07-25 칼 하인쯔 호르닝어 에폭시 수지 혼합물
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
EP1268665B1 (en) 1999-12-13 2005-11-02 Dow Global Technologies Inc. Flame retardant phosphorus element-containing epoxy resin compositions
AU2089701A (en) 1999-12-13 2001-06-18 Dow Chemical Company, The Phosphorus element-containing crosslinking agents and flame retardant phosphoruselement-containing epoxy resin compositions prepared therewith
DE10043205A1 (de) * 2000-09-01 2002-03-28 Siemens Ag Epoxidharzmischung
DE60114240T2 (de) * 2000-12-18 2006-07-13 Mitsubishi Rayon Co., Ltd. Flammhemmende epoxidharzzusammensetzung und damit hergestellte prepregs und faserverstärkte verbundwerkstoffe
ES2178588B1 (es) * 2000-12-29 2004-08-16 Lear Automotive (Eeds) Spain, S.L. Caja de interconexion, control y gestion para automovil, con impacto medioambiental reducido.
US20050239975A1 (en) * 2002-05-30 2005-10-27 Joseph Gan Halogen free ignition resistant thermoplastic resin compositions
FR2848016B1 (fr) * 2002-11-29 2005-01-28 Nexans Cable ignifuge
US20050075024A1 (en) * 2003-10-01 2005-04-07 Ranken Paul F. Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability
BRPI0510861A (pt) 2004-05-28 2007-12-26 Dow Global Technologies Inc processo para preparar um composto contendo fósforo, processo para preparar uma composição contendo fósforo, processo para preparar um composto de resina epóxi contendo fósforo, processo para preparar uma composição de resina epóxi contendo fósforo , processo para preparar um composto contendo um anel de benzoxazina e fósforo, processo para preparar uma composição de resina contendo anel de benzoxazina e fósforo, processo para preparar um composto contendo grupo termolábil e fósforo, processo para preparar uma composição de resina termolábil contendo fósforo, composto contendo fósforo, composição contendo fósforo, composição de resina epóxi contendo fósforo, composição contendo fósforo, composto de resina epóxi contendo fósforo, composto contendo anel de benzoxazina e fósforo, composição de resina contendo anel de benzoxazina e fósforo, composto contendo grupo termolábil e fósforo, composição de resina termolábil contendo fósforo, produto obtenìvel, composição de resina epóxi resistente à chama, composto de epóxi, composição de resina epóxi resistente a chama, composição de cura resistente à ignição, pré-impregnado, laminado, placa de circuito, poliol, resina de poliuretano resistente à chama, composição termoplástica resistente à ignição, composição hìbrida termoplástica / termofixa resistente à ignição e composição de revestimento
KR101520131B1 (ko) * 2007-09-28 2015-05-13 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지 조성물
US20110065838A1 (en) 2009-09-11 2011-03-17 Chemtura Corporation Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins
US20110065870A1 (en) * 2009-09-11 2011-03-17 Chemtura Corporation Tris(Hydroxoxyphenyl) Phosphine Oxides and their Use as Flame Retardants for Epoxy Resins
WO2012064703A1 (en) 2010-11-12 2012-05-18 Albemarle Corporation Dopo-derived flame retardant and synthetic hydrogarnets for epoxy resin compositions
CN103382242B (zh) 2013-06-25 2015-06-24 江苏雅克科技股份有限公司 含磷阻燃酚醛树脂及以其为原料制备的阻燃环氧树脂固化物
CN107266639B (zh) 2014-08-15 2019-08-27 江苏雅克科技股份有限公司 含磷酚醛树脂化合物及以其为原料制备的含磷阻燃环氧树脂固化物
CN105623238B (zh) 2014-11-06 2018-07-27 江苏雅克科技股份有限公司 含磷官能化聚(亚芳基醚)及以其为原料制备组合物
CN105566621B (zh) 2014-11-11 2018-09-21 江苏雅克科技股份有限公司 低介电含磷聚酯化合物组成及其制法
US9534108B2 (en) 2015-03-13 2017-01-03 Chemtura Corporation Flame retardant epoxy resins comprising phosphorus containing flame retardants
JP6768698B2 (ja) 2015-04-17 2020-10-14 アルツヒエム トローストベアク ゲー・エム・べー・ハーＡｌｚＣｈｅｍ Ｔｒｏｓｔｂｅｒｇ ＧｍｂＨ エポキシ樹脂（ｉｉ）の硬化用の難燃作用を有する硬化剤および硬化促進剤
WO2018164833A1 (en) 2017-03-07 2018-09-13 Icl-Ip America Inc. Non-migratory, high-melting/softening polymeric phosphorus-containing flame retardant for printed wiring boards

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US4111909A (en) * 1977-04-11 1978-09-05 Celanese Polymer Specialties Company Controlled reactivity epoxy resin compositions
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022098178A (ja) * 2020-12-21 2022-07-01 富士フイルム株式会社 熱伝導材料形成用組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス

Also Published As

Publication number Publication date
US5759690A (en) 1998-06-02
ATE168120T1 (de) 1998-07-15
CN1068348C (zh) 2001-07-11
EP0779906A1 (de) 1997-06-25
TW297034B (cg-RX-API-DMAC10.html) 1997-02-01
CN1157628A (zh) 1997-08-20
EP0779906B1 (de) 1998-07-08
CZ70597A3 (en) 1997-06-11
DE59502777D1 (de) 1998-08-13
WO1996007686A1 (de) 1996-03-14

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