JPH10335900A - 電子部品の実装検査装置 - Google Patents

電子部品の実装検査装置

Info

Publication number
JPH10335900A
JPH10335900A JP9136809A JP13680997A JPH10335900A JP H10335900 A JPH10335900 A JP H10335900A JP 9136809 A JP9136809 A JP 9136809A JP 13680997 A JP13680997 A JP 13680997A JP H10335900 A JPH10335900 A JP H10335900A
Authority
JP
Japan
Prior art keywords
electronic component
joint
inspection
infrared camera
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9136809A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10335900A5 (enrdf_load_stackoverflow
Inventor
Kenji Okamoto
健二 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9136809A priority Critical patent/JPH10335900A/ja
Publication of JPH10335900A publication Critical patent/JPH10335900A/ja
Publication of JPH10335900A5 publication Critical patent/JPH10335900A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
JP9136809A 1997-05-27 1997-05-27 電子部品の実装検査装置 Pending JPH10335900A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9136809A JPH10335900A (ja) 1997-05-27 1997-05-27 電子部品の実装検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9136809A JPH10335900A (ja) 1997-05-27 1997-05-27 電子部品の実装検査装置

Publications (2)

Publication Number Publication Date
JPH10335900A true JPH10335900A (ja) 1998-12-18
JPH10335900A5 JPH10335900A5 (enrdf_load_stackoverflow) 2005-04-07

Family

ID=15184022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9136809A Pending JPH10335900A (ja) 1997-05-27 1997-05-27 電子部品の実装検査装置

Country Status (1)

Country Link
JP (1) JPH10335900A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1326220C (zh) * 2002-04-12 2007-07-11 松下电器产业株式会社 元件安装方法、安装检查装置及安装系统
JP2013207292A (ja) * 2012-03-29 2013-10-07 Nec Networks & System Integration Corp 電子部品実装回路基板のショート検査方法
TWI486583B (zh) * 2013-06-25 2015-06-01 矽品精密工業股份有限公司 半導體基板之檢測方法
TWI500927B (zh) * 2013-10-14 2015-09-21 Nat Univ Tsing Hua 非接觸式中介層檢測方法與裝置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1326220C (zh) * 2002-04-12 2007-07-11 松下电器产业株式会社 元件安装方法、安装检查装置及安装系统
JP2013207292A (ja) * 2012-03-29 2013-10-07 Nec Networks & System Integration Corp 電子部品実装回路基板のショート検査方法
TWI486583B (zh) * 2013-06-25 2015-06-01 矽品精密工業股份有限公司 半導體基板之檢測方法
TWI500927B (zh) * 2013-10-14 2015-09-21 Nat Univ Tsing Hua 非接觸式中介層檢測方法與裝置

Similar Documents

Publication Publication Date Title
US8574932B2 (en) PCB-mounted integrated circuits
JPH07221151A (ja) 部品間の接合部を検査する方法および装置
US20120105096A1 (en) Assessing Connection Joint Coverage Between a Device and a Printed Circuit Board
US8860456B2 (en) Non-destructive tilt data measurement to detect defective bumps
JP3599986B2 (ja) フリップチップ接合検査方法および検査装置
EP0773445A2 (en) Inspection apparatus of conductive patterns
JPH10335900A (ja) 電子部品の実装検査装置
JPH10335900A5 (enrdf_load_stackoverflow)
US20080061812A1 (en) Component-attach test vehicle
JP2530788B2 (ja) 電子部品の接合部検査方法
JPH09203765A (ja) ビジュアル併用型基板検査装置
JPH07142545A (ja) フリップチップ部品の実装装置
JPH11121648A (ja) 電子部品実装体およびこれを構成する基板
JP2011185746A (ja) プリント基板の検査方法及びこれに用いる検査装置
KR100801899B1 (ko) 인쇄회로기판 검사방법
JP3178784B2 (ja) 半導体パッケージ基板の検査装置及び検査方法
Schmid et al. Automatic transient thermal impedance tester for quality inspection of soldered and sintered power electronic devices on panel and tile level
JP2003004794A (ja) 電子部品、回路基板及び電子部品と回路基板のはんだ付け接合の検査方法
JP5495303B2 (ja) 半導体モジュール及び半導体モジュールの検査方法
JP2002043711A (ja) 回路基板、電子機器及び回路基板と電子部品のはんだ付け接合の検査方法
KR100553812B1 (ko) 전/후면 겸용 불량 위치 검출 장치 및 방법
JP3437467B2 (ja) 半導体装置の検査方法
JPH08250559A (ja) 半導体装置の検査方法及びプローブカード
KR100531957B1 (ko) 전/후면 겸용 불량 위치 검출 장치 및 방법
JPH04315068A (ja) プリント回路板の検査装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040524

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040524

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20061220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20061226

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070223

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070320

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070516

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20070619