JPH1032387A - 中間の絶縁シートの重合の間多層プリント回路基板を決まった位置に保持するためのブロックシステム - Google Patents

中間の絶縁シートの重合の間多層プリント回路基板を決まった位置に保持するためのブロックシステム

Info

Publication number
JPH1032387A
JPH1032387A JP9102620A JP10262097A JPH1032387A JP H1032387 A JPH1032387 A JP H1032387A JP 9102620 A JP9102620 A JP 9102620A JP 10262097 A JP10262097 A JP 10262097A JP H1032387 A JPH1032387 A JP H1032387A
Authority
JP
Japan
Prior art keywords
insulating sheet
epoxy resin
printed
printed circuit
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP9102620A
Other languages
English (en)
Japanese (ja)
Inventor
Volpi Pierluigi
ヴォルピ ピエールルイジ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SO MA CI S SpA
Original Assignee
SO MA CI S SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SO MA CI S SpA filed Critical SO MA CI S SpA
Publication of JPH1032387A publication Critical patent/JPH1032387A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP9102620A 1996-04-05 1997-04-04 中間の絶縁シートの重合の間多層プリント回路基板を決まった位置に保持するためのブロックシステム Withdrawn JPH1032387A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT96MC000043A ITMC960043A1 (it) 1996-04-05 1996-04-05 Sistema per mantenere bloccati i pannelli dei circuiti stampati multistrato durante la polimerizzazione dei fogli isolanti intermedi
IT96A000043 1996-04-05

Publications (1)

Publication Number Publication Date
JPH1032387A true JPH1032387A (ja) 1998-02-03

Family

ID=11357197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9102620A Withdrawn JPH1032387A (ja) 1996-04-05 1997-04-04 中間の絶縁シートの重合の間多層プリント回路基板を決まった位置に保持するためのブロックシステム

Country Status (5)

Country Link
EP (1) EP0800337A1 (enExample)
JP (1) JPH1032387A (enExample)
KR (1) KR970073270A (enExample)
CA (1) CA2201700A1 (enExample)
IT (1) ITMC960043A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19830628C1 (de) * 1998-07-09 2000-04-20 Lauffer Maschf Verfahren zum Verpressen von Mehrlagenleiterplatten (Multilayer)
US6162314A (en) * 1998-09-29 2000-12-19 Alliant Techsystems Inc. Thermal welding of fiber reinforced thermoplastic prepreg
IT1317799B1 (it) * 2000-06-02 2003-07-15 Cedal Srl Sistema per la saldatura del pacco di layers e di fogli di pre-pregdestinato alla formazione in presse a caldo di un circuito

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE465399B (sv) * 1990-05-16 1991-09-02 Perstorp Ab Saett vid tillverkning av flerlagermoensterkort
DE4029970A1 (de) * 1990-09-21 1992-04-02 Siemens Nixdorf Inf Syst Verfahren zum verpressen von mehrlagenleiterplatten

Also Published As

Publication number Publication date
KR970073270A (ko) 1997-11-07
ITMC960043A1 (it) 1997-10-05
CA2201700A1 (en) 1997-10-05
EP0800337A1 (en) 1997-10-08
ITMC960043A0 (enExample) 1996-04-05

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Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20040706