JPH10310631A - 半導体封止用エポキシ樹脂組成物 - Google Patents

半導体封止用エポキシ樹脂組成物

Info

Publication number
JPH10310631A
JPH10310631A JP15423697A JP15423697A JPH10310631A JP H10310631 A JPH10310631 A JP H10310631A JP 15423697 A JP15423697 A JP 15423697A JP 15423697 A JP15423697 A JP 15423697A JP H10310631 A JPH10310631 A JP H10310631A
Authority
JP
Japan
Prior art keywords
epoxy resin
substituted
group
general formula
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15423697A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10310631A5 (enExample
Inventor
Yasuyuki Murata
保幸 村田
Norio Tsuuzan
典生 通岩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yuka Shell Epoxy KK
Original Assignee
Yuka Shell Epoxy KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yuka Shell Epoxy KK filed Critical Yuka Shell Epoxy KK
Priority to JP15423697A priority Critical patent/JPH10310631A/ja
Publication of JPH10310631A publication Critical patent/JPH10310631A/ja
Publication of JPH10310631A5 publication Critical patent/JPH10310631A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP15423697A 1997-05-09 1997-05-09 半導体封止用エポキシ樹脂組成物 Pending JPH10310631A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15423697A JPH10310631A (ja) 1997-05-09 1997-05-09 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15423697A JPH10310631A (ja) 1997-05-09 1997-05-09 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPH10310631A true JPH10310631A (ja) 1998-11-24
JPH10310631A5 JPH10310631A5 (enExample) 2005-03-17

Family

ID=15579827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15423697A Pending JPH10310631A (ja) 1997-05-09 1997-05-09 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPH10310631A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014065753A (ja) * 2012-09-24 2014-04-17 Dic Corp 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP2014098103A (ja) * 2012-11-15 2014-05-29 Dic Corp 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP2014114411A (ja) * 2012-12-12 2014-06-26 Dic Corp 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014065753A (ja) * 2012-09-24 2014-04-17 Dic Corp 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP2014098103A (ja) * 2012-11-15 2014-05-29 Dic Corp 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP2014114411A (ja) * 2012-12-12 2014-06-26 Dic Corp 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板

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