JPH10247648A5 - - Google Patents
Info
- Publication number
- JPH10247648A5 JPH10247648A5 JP1997050079A JP5007997A JPH10247648A5 JP H10247648 A5 JPH10247648 A5 JP H10247648A5 JP 1997050079 A JP1997050079 A JP 1997050079A JP 5007997 A JP5007997 A JP 5007997A JP H10247648 A5 JPH10247648 A5 JP H10247648A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- wiring
- semiconductor chip
- same level
- wiring structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05007997A JP3962443B2 (ja) | 1997-03-05 | 1997-03-05 | 半導体装置とその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05007997A JP3962443B2 (ja) | 1997-03-05 | 1997-03-05 | 半導体装置とその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH10247648A JPH10247648A (ja) | 1998-09-14 |
| JPH10247648A5 true JPH10247648A5 (enExample) | 2005-01-06 |
| JP3962443B2 JP3962443B2 (ja) | 2007-08-22 |
Family
ID=12849016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05007997A Expired - Fee Related JP3962443B2 (ja) | 1997-03-05 | 1997-03-05 | 半導体装置とその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3962443B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000208622A (ja) * | 1999-01-12 | 2000-07-28 | Tokyo Electron Ltd | 半導体装置及びその製造方法 |
| JP4363716B2 (ja) | 1999-06-25 | 2009-11-11 | 株式会社東芝 | Ｌｓｉの配線構造の設計方法 |
| US6312988B1 (en) * | 1999-09-02 | 2001-11-06 | Micron Technology, Inc. | Methods of forming capacitors, methods of forming capacitor-over-bit line memory circuitry, and related integrated circuitry constructions |
| JP4148321B2 (ja) * | 2003-10-24 | 2008-09-10 | パイオニア株式会社 | 半導体レーザ装置及び製造方法 |
| JP4955277B2 (ja) * | 2006-02-03 | 2012-06-20 | ラピスセミコンダクタ株式会社 | 絶縁膜の形成方法 |
| DE112018006764T5 (de) * | 2018-01-05 | 2020-09-10 | Sony Semiconductor Solutions Corporation | Halbleitervorrichtung |
| CN112219274B (zh) * | 2018-06-27 | 2024-09-17 | 索尼半导体解决方案公司 | 半导体装置和半导体装置的制造方法 |
-
1997
- 1997-03-05 JP JP05007997A patent/JP3962443B2/ja not_active Expired - Fee Related
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