JPH08778Y2 - 多層誘電体基板 - Google Patents
多層誘電体基板Info
- Publication number
- JPH08778Y2 JPH08778Y2 JP1990031195U JP3119590U JPH08778Y2 JP H08778 Y2 JPH08778 Y2 JP H08778Y2 JP 1990031195 U JP1990031195 U JP 1990031195U JP 3119590 U JP3119590 U JP 3119590U JP H08778 Y2 JPH08778 Y2 JP H08778Y2
- Authority
- JP
- Japan
- Prior art keywords
- dielectric substrate
- substrate
- circuit
- connector
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 21
- 239000002184 metal Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990031195U JPH08778Y2 (ja) | 1990-03-27 | 1990-03-27 | 多層誘電体基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990031195U JPH08778Y2 (ja) | 1990-03-27 | 1990-03-27 | 多層誘電体基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03122580U JPH03122580U (enExample) | 1991-12-13 |
| JPH08778Y2 true JPH08778Y2 (ja) | 1996-01-10 |
Family
ID=31533933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990031195U Expired - Lifetime JPH08778Y2 (ja) | 1990-03-27 | 1990-03-27 | 多層誘電体基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08778Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI239798B (en) * | 1999-05-28 | 2005-09-11 | Toppan Printing Co Ltd | Photo electric wiring substrate, mounted substrate, and the manufacture method of the photo electric wiring substrate |
-
1990
- 1990-03-27 JP JP1990031195U patent/JPH08778Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03122580U (enExample) | 1991-12-13 |
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