JPH08778Y2 - Multilayer dielectric substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a multilayer dielectric substrate, and more particularly to a multilayer dielectric substrate having an improved connector connection structure when an electromagnetic circuit is provided in an intermediate layer thereof.

[Conventional technology]

Conventionally, as a technique of connecting a coaxial connector to a multi-layer substrate, as shown in FIG. 5, after forming a multi-layer, a through hole is formed in all layers of the substrate as a coaxial connector center conductor connecting portion by forming a through hole 11. , Was in electrical contact with the power supply section of the intermediate circuit layer.

[Problems to be solved by the device]

In the case of the conventional multi-layer board connector connection described above, a pin stands on the waveguide on the opposite side of the connector,
Since this blocks the waveguide, the waveguide conversion to the connector part is not performed smoothly (VSWR seen from the connector).
Is bad). Further, since the opposite side of the connector has an opening centered on the through hole, and there is radio wave radiation from this, it is necessary to take a method to prevent this.

[Means for solving the problem]

The present invention is a multi-layered dielectric substrate having an electromagnetic circuit as an intermediate layer, which has a circular head portion and a cylindrical needle portion, and is inserted into one substrate having no circuit before the multi-layering of the substrate. In addition, it is provided with a metal rivet arranged such that the head portion is located at the position of the power feeding portion of the electromagnetic circuit formed on the other substrate when forming the multilayer structure.

〔Example〕

 Next, the present invention will be described with reference to the drawings.

1 (a) and 1 (b) are a plan view and a sectional view of a first embodiment of the present invention with a stud inserted therein, and FIG. 2 is a sectional view showing the first embodiment, and FIG. (A) And (b) is a plan view and a side view showing a stud of a second embodiment of the present invention, and a fourth view.
The drawing is a sectional view showing the second embodiment.

In the first embodiment, as shown in FIG. 1, a rivet 1 made of metal and having a circular head portion and a cylindrical needle portion is inserted into a dielectric substrate 2a having no electromagnetic circuit before the multilayering. As shown in FIG. 2, the dielectric substrate 2b on which the electromagnetic wave circuit 4 is formed is multi-layered so that the head portion of the tack 1 is positioned so as to overlap with the feeding portion of the electromagnetic wave circuit 4, and the surface contact or It comprises a multi-layer substrate which is connected by electromagnetic waves.

At this time, if the through hole 5 is formed in the dielectric substrate 2b forming the electromagnetic wave circuit 4, the coaxial connector 7 is inserted by inserting the connector center conductor 8 into the cylinder of the tack 1.
Can be installed and connected in the vertical direction, and since there is no through hole penetrating the multilayer board, the waveguide can be converted smoothly and the through hole and ground can be connected to the opposite part where the connector is joined as in the conventional case. Since there is no opening between them, radio wave radiation can be prevented.

As shown in FIGS. 3 and 4, the second embodiment is an example in which a stud 9 having a strip portion is used, and since the waveguide 10 can be partially formed by the strip portion of the ground 3 and the stud 9, Waveguide conversion is performed more smoothly.

[Effect of device]

As described above, according to the present invention, by providing the metal studs for electromagnetic wave connection inside the multi-layered substrate, the coaxial connector is connected, the waveguide conversion is smoothly performed, and the effect of preventing radio wave radiation is further provided. is there.

[Brief description of drawings]

1 (a) and 1 (b) are a plan view and a sectional view of a first embodiment of the present invention with a stud inserted therein, and FIG.
FIG. 3 (a) and FIG. 3 (b) are a plan view and a side view showing a stud of a second embodiment of the present invention, and FIG. 4 is a cross section showing the second embodiment. FIG. 5 and FIG. 5 are sectional views showing a connector joining state in a conventional multilayer dielectric substrate. 1 ... tack, 2a, 2b ... dielectric substrate, 3 ... ground, 4
...... Electromagnetic wave circuit in multilayer substrate, 5 ・ ・ ・ Through hole, 6
...... Adhesive layer, 7 ...... Connector, 8 ...... Central conductor of connector, 9 ...... Tack with band-shaped portion, 10 ...... Waveguide formed by ground and band stud, 11 ・ ・ ・ Through hole in multilayer board A through hole formed by opening, 12 ... An opening between the through hole and the ground.

Claims (1)

[Scope of utility model registration request] 1. A multilayer dielectric substrate having an electromagnetic wave circuit as an intermediate layer, which has a circular head portion and a cylindrical needle portion, and has one circuit without a circuit before a multilayer substrate is formed. A multi-layer dielectric substrate comprising a metal stud that is inserted and is arranged such that the head portion is located at a position of a power feeding portion of the electromagnetic circuit formed on the other substrate when the multi-layer structure is formed.