JP2001102747A - Multilayer board, and manufacturing method thereof and mounting structure of coaxial connector on the multilayer board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve electrical characteristics and reliability. SOLUTION: A stripline 1 is formed on one side of a dielectric board 22 having a conductor film layer formed on the other side, a through-hole 9 conducting to the stripline 1 is formed thereon, a peep hole 7 for exposing the through-hole 9 is formed into a dielectric board 21 having a conductor film layer on one side, and the dielectric boards 21, 22 are laminated one above the other with their conductor film layers back to back, to form a multilayer board 2. A coaxial connector 4 to be mounted on this board 2 uses a type having a center conductor 42 integrated with the body 41, the body 41 is mounted on the multilayer board 2 with the center conductor 42 passing through the through-hole 9, and the center conductor 42 is soldered to the through-hole 9 at the peep hole 7 side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-layer board used in a high frequency band, such as a power distribution / combining circuit of an antenna device for radar, a method of manufacturing the same, and a structure for attaching a coaxial connector to the multi-layer board.

[0002]

2. Description of the Related Art For example, power distribution /
In a composite circuit or the like, a coaxial connector is often attached, for example, vertically to a multilayer substrate on which a strip line is formed. FIG. 3 shows a conventional mounting structure of this type. That is, the two dielectric substrates 21 and
When the multilayer substrate 2 is formed by laminating the two, a through hole 3 is formed at the end of the strip line 1 by making a hole in both the dielectric substrates 21 and 22. The coaxial connector 4 connected to the multilayer board 2 has a main body 41 and a center conductor 42 fixed thereto. The main body 41 is fixed to the multilayer board 2 so that the center conductor 42 passes through the through hole 3.
The center conductor 42 was fixed by soldering or the like.

In addition, as shown in FIG. 4, a hole is made on one dielectric 22 side to form a non-penetrating through hole 5, and a coaxial connector 6 of a type in which a main body 41 and a center conductor 42 are separated from each other is used. In some cases, the center conductor 42 is connected to the non-penetrating through hole 5 in advance by soldering or the like, and then the main body 41 is fixed to the multilayer substrate 2 with screws or the like.

[0004]

However, in the method shown in FIG. 3, through holes on the side of the dielectric substrate 21 are essentially unnecessary for conduction between the strip line 1 and the center conductor 42, and the structure is wasted. ing. To make matters worse, this unnecessary through-hole acts as a reactance component, which causes impedance mismatching, especially when handling high frequencies, causing electrical characteristics to deteriorate and signal loss to occur. .

In the method shown in FIG. 4, since the center conductor 42 is separated from the main body 41 and individually attached to the multilayer board 2, if a displacement occurs at that time, mechanical stress caused by the displacement is reduced by soldering. It will act directly on the attachment. For this reason, there is a high risk of disconnection of the connection portion and the like, which is a cause of reducing reliability. This is especially true when the shape of the coaxial connector 6 is reduced in size, and some measures have been desired.

[0006] The present invention has been made in view of the above circumstances,
It is an object of the present invention to provide a multilayer board with improved electrical characteristics and improved reliability, a method for manufacturing the same, and a structure for attaching a coaxial connector to the multilayer board.

[0007]

In order to achieve the above object, a multi-layer substrate and a method of manufacturing the same according to the present invention are directed to a first dielectric substrate having a conductive film layer formed on one surface and a strip line disposed on the other surface. A multilayer substrate formed by laminating a second dielectric substrate on the other surface with respect to the body substrate, wherein the first dielectric substrate is electrically connected to the strip line and insulated from the conductive film layer. A through hole is formed, and a peep hole exposing the through hole forming portion is formed in the second dielectric substrate.

A coaxial connector mounting structure according to the present invention is a mounting structure for mounting a coaxial connector, in which a main body and a center conductor insulated from the main body are integrated, to the multilayer substrate, wherein the coaxial connector has a center. The main body is connected and fixed to the first dielectric substrate with the conductor passing through the through hole, and the center conductor is connected and fixed to the strip line from the peephole side.

By taking such measures, the center conductor is exposed from the peephole when the coaxial connector is mounted on the multilayer board. The center conductor is in a state of being passed through a through hole that is electrically connected to a strip line to be connected, and can be connected and fixed to the strip line by soldering or the like from a peep hole.

[0010] At this time, the length of the through hole is reduced by the amount corresponding to the formation of the observation hole. As a result, the reactance component is reduced, so that it is possible to improve the electrical characteristics by eliminating the impedance mismatch particularly in the high frequency band. Of course, the workability is not impaired because the central conductor is exposed when viewed from the peephole.

Further, in the present invention, when a conductive film layer is formed on a surface of the second dielectric substrate opposite to the lamination surface, the conductive film layers of the first and second dielectric substrates are separated from each other. A through hole electrically connected to each other may be formed around the peep hole. By doing so, a shield effect can be exerted on the mounting portion of the coaxial connector,
This can also improve the electrical characteristics.

[0012]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a diagram showing a coaxial connector mounting structure according to the present invention. In FIG. 1, the same reference numerals are given to portions common to FIG. 3 and FIG. FIG.
In the configuration shown in FIG.
And the center conductor 42 are fixed. The multilayer board 2 to which the coaxial connector 4 is attached is prepared, for example, as follows.

(1) As shown in FIG. 1 (a), a strip of a desired pattern is formed on the other surface of a dielectric substrate 22 having a ground conductor film layer (not numbered) formed on one surface. Form line 1. A hole is formed at the end of the strip line 1 in accordance with the size of the central conductor 42 of the coaxial connector 4, and a through-hole 9 is formed by forming a conductor film layer connected to the strip line 1 in this hole. Of course, the conductor film layer covering the through-hole 9 is insulated from the conductor film layer for grounding.

(2) A peephole 7 is formed in the dielectric substrate 21 having a conductor film layer for grounding formed on one surface. The peep hole 7 is provided at a position where the center conductor 42 can be seen as shown in FIG. More preferably, the size is set so that the work (whether manual work or mechanical work) of soldering the center conductor 42 to the through-hole 9 can be easily performed. As shown in FIG. 1, no conductor film layer is formed around the peephole 7.

(3) The two dielectric substrates 21 and 22 are attached to each other with the surfaces on which the grounding conductor film layers are formed opposite to each other. In this state, holes are made through the dielectric substrates 21 and 22 so as to connect the ground conductor film layers of the dielectric substrates 21 and 22 and avoid the strip line 1. Preferably, a plurality of holes are formed so as to surround the perimeter of the peep hole 7 as shown in FIG. A conductor film layer is formed in this hole to form a through-hole 8 for grounding, and the multilayer substrate 2 is obtained. At this time, the size of the observation hole 7 is smaller than the arrangement diameter of the through-hole 8 for grounding.

The multilayer substrate 2 formed as described above includes
The coaxial connector 4 is attached from the opposite surface of the peep hole 7.
At this time, the main body 41 is fixed by screwing or the like while the center conductor 42 is passed through the through-hole 9. After that, the center conductor 42 may be fixed to the through-hole 9 by soldering or the like from the peephole 7 side.

The above configuration is characterized by the coaxial connector 4
In the dielectric substrate 21 on the side opposite to the mounting surface of
Has been formed. That is, as can be seen by comparing FIG. 1 (the present invention) and FIG. 3 (conventional example), the length of the penetrating portion of the center conductor 42 is reduced by the thickness of the dielectric substrate 21 by providing the peep holes 7. . As a result, the reactance component can be reduced, and in particular, the impedance mismatch in a high frequency band can be eliminated and the electrical characteristics can be improved.

In addition, since the coaxial connector 4 is of a type in which the main body 41 and the central conductor 42 are integrated, mechanical stress concentrates on the fixed portion of the central conductor 42 during installation. Can be avoided. For this reason, the possibility of disconnection can be reduced, and the reliability can be improved.

Further, according to the above configuration, as shown in FIG. 2, the through through hole 8 provided around the peep hole 7
The shield effect is exerted on the soldered portion of the center conductor 42. This can also improve the electrical characteristics.

The present invention is not limited to the above-described configuration, but can be used in applications in which a coaxial wire is directly connected to and fixed to the multilayer substrate 2 instead of the coaxial connector 4. In addition, various modifications can be made without departing from the spirit of the present invention.

[0021]

As described above in detail, according to the present invention, there are provided a multilayer substrate having improved electrical characteristics and improved reliability, a method of manufacturing the same, and a structure for attaching a coaxial connector to the multilayer substrate. It becomes possible.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a coaxial connector mounting structure according to the present invention.

FIG. 2 is a top view showing a coaxial connector mounting structure according to the present invention.

FIG. 3 is a sectional view showing an example of a conventional mounting structure.

FIG. 4 is a sectional view showing an example of a conventional mounting structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Strip line 2 ... Multilayer board 21 and 22 ... Dielectric board 3 ... Through-hole 4 ... Coaxial connector 41 ... Body 42 ... Center conductor 5 ... Non-through-hole 6 ... Coaxial connector 7 ... Peephole 8 ... Grounding Through through hole 9 ... Through through hole

Continuing on the front page (72) Inventor Tsuyoshi Kumamoto 1 Kosaka Toshiba-cho, Saiwai-ku, Kawasaki City, Kanagawa Prefecture Inside the Toshiba Komukai Plant (72) Inventor Hideaki Fukuda 1 Kochi Toshiba-cho, Saiwai-ku, Kawasaki City, Kanagawa Prefecture F-term in Toshiba Komukai Plant (reference) 5E023 AA01 AA16 BB22 CC22 FF01 HH01 HH11 HH16 HH18 5E346 AA42 BB02 FF34 FF45 GG15 GG28 HH06 HH07

Claims (6)

[Claims] 1. A multilayer substrate comprising a first dielectric substrate having a conductor film layer formed on one surface and a strip line disposed on the other surface, and a second dielectric substrate laminated on the other surface. In the first dielectric substrate, a through hole that is electrically connected to the strip line and is insulated from the conductive film layer is formed, and the second dielectric substrate exposes the through hole forming portion. A multilayer substrate characterized by forming a peephole to be formed. 2. When the conductive film layer is formed on the surface of the second dielectric substrate opposite to the lamination surface, the first and second dielectric substrates are further provided around the peephole. The multi-layer substrate according to claim 1, wherein a through hole is formed between the conductive film layers of the substrate to electrically couple with each other. 3. A step of arranging a strip line on the other surface of the first dielectric substrate having a conductor film layer formed on one surface, and a through hole electrically connected to the strip line and insulated from the conductor film layer. Forming on the first dielectric substrate, forming a peephole capable of exposing the through-hole on the second dielectric substrate, and forming on the other surface of the first dielectric substrate And laminating the second dielectric substrate so that the through-hole forming portion is exposed from the peep hole. 4. When a conductive film layer is formed on a surface of the second dielectric substrate opposite to a lamination surface, furthermore, the conductive film layers of the first and second dielectric substrates are further separated from each other. 4. The method according to claim 3, further comprising a step of forming a through hole for electrically coupling around the peep hole. 5. A first dielectric substrate having a conductor film layer formed on one surface and a strip line disposed on the other surface, wherein the second dielectric substrate has a second dielectric film layer.
A coaxial connector mounting structure for mounting a coaxial connector in which a main body and a central conductor insulated from the main body are integrated on a multilayer substrate obtained by laminating the dielectric substrate on the other surface; In the dielectric substrate, a through hole that is electrically connected to the strip line and is insulated from the conductive film layer is formed. In the second dielectric substrate, a peep hole that exposes the through hole forming portion is formed. In the coaxial connector, the main body is connected and fixed to the first dielectric substrate in a state where the center conductor is passed through the through hole, and the center conductor is connected and fixed to the strip line from the peephole side. A coaxial connector mounting structure, characterized in that: 6. When the conductive film layer is formed on the surface of the second dielectric substrate opposite to the laminating surface, the first and second dielectric materials are further provided around the viewing hole. 6. The coaxial connector mounting structure according to claim 5, wherein a through hole is formed to electrically connect the conductive film layers of the substrate to each other.