WO2009157563A1 - Measuring device for transmission line boards and high-frequency parts - Google Patents
Measuring device for transmission line boards and high-frequency parts Download PDFInfo
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- WO2009157563A1 WO2009157563A1 PCT/JP2009/061777 JP2009061777W WO2009157563A1 WO 2009157563 A1 WO2009157563 A1 WO 2009157563A1 JP 2009061777 W JP2009061777 W JP 2009061777W WO 2009157563 A1 WO2009157563 A1 WO 2009157563A1
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- transmission line
- substrate
- line
- signal conductor
- measurement
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
Definitions
- the present invention relates to a transmission line substrate and a high-frequency component measuring apparatus suitable for measuring characteristics of high-frequency components that process high-frequency signals in the millimeter wave band.
- the transmission line substrate 10 constituting the microstrip line is a signal conductor line for high-frequency signal transmission on the surface of the dielectric substrate 14 having the ground layer 12 formed on the back surface, as illustrated in FIGS. 7A-7B. 16 is formed.
- the signal conductor wire 16 (specifically, its end portion) and the signal conductor wire 16 of the dielectric substrate 14 are the same on one end side of the microstrip line constituted by the signal conductor wire 16.
- a pair of ground conductors 22 formed so as to sandwich the signal conductor wire 16 (specifically, an end thereof) on the surface, and a pair of the pair of ground conductors 22 and the ground layer 12 on the back surface of the dielectric substrate 14 are connected to each other.
- the measurement terminal portion 20 is provided.
- substrate 10 comprised in this way it usually consists of a pair of transmission line board
- a base 30 is used.
- the base 30 is configured to simultaneously mount the high-frequency component 40 to be measured and the pair of transmission line substrates 10 and use the pair of transmission line substrates 10 as an input / output path for high-frequency signals to the high-frequency components 40. belongs to.
- the pair of transmission line substrates 10 has the ground layer 12 on the back side in contact with the base (specifically, conductive), and the microstrip line measurement terminal 20 formed on each transmission line substrate 10.
- the opposite end portions are stacked on the base 30 so as to face each other with the mounting portion 32 of the high-frequency component 40 in the base 30 interposed therebetween.
- the end of the microstrip line on the opposite side of the measurement strip 20 formed on each transmission line substrate 10 and the high-frequency component 40 on the base 30 When actually measuring the characteristics of the high-frequency component 40, the end of the microstrip line on the opposite side of the measurement strip 20 formed on each transmission line substrate 10 and the high-frequency component 40 on the base 30.
- the high frequency signal input / output terminals are electrically connected by wire bonding 34 or the like, and the signal conductor lines 16 and the pair of ground conductors 22 in the measurement terminal portions 20 formed on each transmission line substrate 10 are connected to each other.
- the high frequency component 40 is connected to the measuring device connected to each coplanar probe 50 via the pair of transmission line substrates 10 by pressing the electrodes of the measuring coplanar probes 50 respectively.
- the measurement apparatus when measuring the characteristics of the high-frequency component 40 using the pair of transmission line substrates 10 as described above, the measurement apparatus is arranged so that the characteristics of the transmission line substrate 10 can be offset from the measurement results obtained by the measurement apparatus. It is necessary to calibrate. And when calibrating a measuring apparatus, the transmission line board
- the calibration transmission line substrate 11 forms a microstrip line having the same length as the transmission path formed between the pair of measurement terminals 20 when the high-frequency component 40 is measured.
- the transmission line substrate 10 is configured in substantially the same manner.
- the transmission line substrate 11 for calibration forms a microstrip line by forming the signal conductor wire 16 having the above length on the surface of the dielectric substrate 14 having the ground layer 12 formed on the back surface, and both ends thereof.
- the measurement terminal portion 20 is formed by providing a pair of ground conductors 22 and a pair of conductive through holes 24 with the signal conductor wire 16 interposed therebetween (in other words, measured when measuring the high-frequency component 40).
- the high frequency component 40 in the transmission line formed between the terminal portions 20 for use is replaced with a microstrip line).
- the high frequency component 40 is provided. It is possible to measure the transmission characteristics of the reference transmission line that is not, and if the characteristics of the high-frequency component 40 are measured with reference to the measured transmission characteristics, the characteristics of the high-frequency component 40 alone can be measured.
- Japanese Patent No. 3827485 Japanese Patent No. 3827485
- the transmission line substrates 10 and 11 on which the microstrip line is formed are used, and the transmission line substrates 10 and 11 include a coplanar probe.
- a measurement terminal portion 20 for connecting 50 is formed.
- the measurement terminal portion 20 has the tip end portion in the axial direction of the signal conductor line 16 and the tip end position in the same direction of the ground conductor 22 aligned.
- Each electrode of the coplanar probe 50 is configured to be connected to the black portion shown in the drawing.
- connection point of the coplanar probe 50 and the conductive through hole 24 are separated from each other in the ground conductor 22, and the distance from the coplanar probe 50 to the ground layer 12 on the back surface of the dielectric substrate 14 is long for a high frequency signal in the millimeter wave band.
- transmission loss increases.
- connection point of the coplanar probe 50 to the ground conductor 22 is brought close to the conductive through-hole 24 as shown by hatching in FIG. 7C.
- connection point between the signal conductor line 16 and the coplanar probe 50 moves inward from the tip of the signal conductor line 16, so that the connection point to the tip becomes an open stub, and the high-frequency signal is transmitted.
- reflection or the like occurs and the transmission characteristics deteriorate.
- the present invention has been made in view of these problems.
- a high-frequency signal is connected at a connection portion between the transmission line substrate and a coplanar probe. It is an object of the present invention to provide a transmission line substrate and a high-frequency component measuring device capable of preventing the transmission characteristics from deteriorating.
- the transmission line substrate made to achieve such an object, A microstrip line comprising a dielectric substrate, a signal conductor line formed on the surface of the dielectric substrate, and a ground layer formed on the back surface of the dielectric substrate opposite to the signal conductor line; , At least one end position of the microstrip line, The signal conductor line, a pair of ground conductors formed so as to sandwich the signal conductor line on the same plane as the signal conductor line of the dielectric substrate, and the pair of ground conductors penetrating the dielectric substrate And a measurement terminal portion comprising a pair of conductive through holes connecting the ground layer and the ground layer, A transmission line substrate used to measure a transmission characteristic of a high-frequency signal by pressing a measurement coplanar probe against the signal conductor wire and the pair of ground conductors constituting the measurement terminal portion, In the measurement terminal portion, the tip end in the axial direction of the signal conductor wire is cut at an intersection position with a line segment connecting the pair of conductive through holes.
- the second aspect of the present invention is the transmission line substrate according to the first aspect of the present invention, wherein the pair of ground conductors in the measurement terminal portion has a rectangular shape substantially concentric with the pair of conductive through holes, A notch is formed in a corner adjacent to the signal conductor line so as to increase a distance from the signal conductor line.
- a third aspect of the present invention is characterized in that, in the transmission line substrate of the first aspect or the second aspect of the present invention, the measurement terminal portions are provided at both ends of the microstrip line.
- the transmission line substrate according to the first aspect or the second aspect of the present invention, wherein the measurement terminal portion is provided on one end side of the microstrip line.
- the end side is characterized in that it is open so that a measurement object can be connected via a conductive member.
- a fifth aspect of the present invention is the transmission line substrate according to the fourth aspect of the present invention, wherein the other end side of the microstrip line that is open so that the measurement object can be connected is measured via a conductive member.
- a matching circuit for matching input / output impedance when an object is connected is formed.
- the high-frequency component measuring apparatus includes a conductive base on which a high-frequency component that is a measurement object can be placed, and a pair of transmission line substrates according to the fourth or fifth aspect. Prepared, The ground layer of each transmission line substrate is in contact with the base, and the end opposite to the measurement terminal portion of the microstrip line formed on each transmission line substrate is the high-frequency component on the base.
- a microstrip line is formed as in the conventional transmission line substrate described above, and at least one end position of the microstrip line has a signal conductor line, A measurement terminal portion including a pair of ground conductors and a conductive through hole is provided.
- the tip end in the axial direction of the signal conductor wire is cut at the intersection point with the line segment connecting the pair of conductive through holes.
- the arrangement direction of the electrodes of the coplanar probe (specifically, the center electrode and the outer electrodes on both sides thereof) and the axial direction of the signal conductor line are orthogonal to each other. If the coplanar probe is disposed on the center electrode and the center electrode of the coplanar probe is brought into contact with the tip end portion of the signal conductor wire, the outer electrode of the coplanar probe is brought into contact with a position near the conductive through hole of the ground conductor. It will be.
- the transmission line substrate of the first aspect of the present invention in the ground conductor, the distance between the connection point of the coplanar probe and the conductive through hole is shortened to reduce the transmission loss of the high-frequency signal generated in the measurement terminal portion. Moreover, in the signal conductor line, the portion that extends outward from the connection point with the coplanar probe and becomes an open stub can be eliminated, and characteristic deterioration due to reflection of a high-frequency signal or the like can be prevented.
- the transmission line substrate of the first aspect of the present invention it is possible to prevent the transmission characteristic of the high frequency signal at the measurement terminal portion from being deteriorated, and to provide an optimum transmission line substrate for measuring the characteristics of the high frequency component. realizable.
- the ground conductor has a rectangular shape substantially concentric with the conductive through hole, and the signal conductor line is connected to the corner adjacent to the signal conductor line. Cutouts are formed to increase the spacing.
- the transmission line substrate of the second aspect of the present invention it is possible to prevent the ground conductor and the signal conductor line from being coupled to each other and prevent the transmission characteristics of the high-frequency signal from being deteriorated at the measurement terminal portion.
- measurement terminal portions are provided at both ends of the microstrip line. Therefore, the transmission line substrate of the third aspect can be used as the transmission line substrate for calibration illustrated in FIG. 7C.
- the measurement terminal portion is provided on one end side of the microstrip line, and the other end side of the microstrip line is connected to the measurement object via the conductive member. Open for connection. Therefore, the transmission line substrate of the fourth aspect can be used as the transmission line substrate for measurement illustrated in FIGS. 7A-7B.
- the transmission line substrate when the measurement object is connected to the other end of the microstrip line that can be connected to the measurement object via a conductive member.
- a matching circuit for matching input / output impedances is formed.
- the sixth aspect of the present invention is a measuring apparatus for measuring the characteristics of a high-frequency component using the transmission line substrate according to the fourth or fifth aspect of the present invention, and is a conventional apparatus shown in FIGS. 7A-7B. As with the apparatus, a conductive base for mounting (in other words, fixing) high-frequency components is provided.
- the base is provided with a placement portion for high-frequency components, and a pair of transmission line substrates are stacked with the placement portion interposed therebetween. That is, in this pair of transmission line substrates, the ground layer is in contact with the base, and the end portion on the opposite side to the measurement terminal portion of the microstrip line is opposed to each other across the placement portion of the high-frequency component. Laminated on the base.
- the bottom of the mounting portion on which the high-frequency component is mounted is such that the side surface opposite to the base of the high-frequency component and the side surface opposite to the base of the transmission line substrate are substantially on the same plane. It is formed lower than the base surface around the mounting portion.
- the height of the conductive member such as a wire used for connecting the high-frequency component and the transmission line substrates on both sides thereof from the transmission line substrate can be reduced, and the length thereof can be shortened. Therefore, according to the measuring apparatus of the sixth aspect of the present invention, it is possible to improve the measurement accuracy of the characteristics of the high-frequency components by suppressing the deterioration of the transmission characteristics of the high-frequency signal generated at the connection portion between the high-frequency components and the transmission line substrate.
- FIG. 1A is a plan view of a measurement transmission line substrate in the embodiment as viewed from the substrate surface
- FIG. 1B is a cross-sectional view illustrating a state in which the measurement transmission line substrate in the embodiment is cut along a signal conductor line
- FIG. 1C is a plan view of the transmission line substrate for calibration in the embodiment as seen from the substrate surface.
- 2A is an explanatory diagram showing the configuration of the measurement terminal portion in the calibration transmission line substrate of the embodiment used in Experiment 1
- FIG. 2B is the measurement in the conventional calibration transmission line substrate used in Experiment 1.
- FIG. It is explanatory drawing which showed the structure of the terminal part for operation.
- FIG. 3A is an explanatory diagram showing a measurement result of measuring the input return loss of the measurement terminal unit using the transmission line substrate shown in FIGS. 2A-2B
- FIG. 3B shows the transmission line substrate shown in FIGS. 2A-2B.
- 4A is an explanatory diagram illustrating the configuration of the measurement transmission line substrate used in Experiment 2
- FIG. 4B is an explanatory diagram illustrating the connection between the measurement transmission line substrate and the high-frequency component.
- FIG. 5A is an explanatory view showing the measurement result of measuring the input return loss (wire bonding side) of the connection portion between the transmission line substrate and the high-frequency component shown in FIGS. 4A-4B.
- FIG. 7A is a plan view of a conventional measurement transmission line substrate as viewed from the substrate surface
- FIG. 7B is a cross-sectional view illustrating a state in which the conventional measurement transmission line substrate is cut along a signal conductor line
- FIG. 7C is a plan view of a conventional transmission line substrate for calibration as viewed from the substrate surface.
- FIGS. 1A to 1C show the transmission line substrates 2 and 4 for measurement and calibration of this embodiment corresponding to FIGS. 7A to 7C.
- the measurement and calibration transmission line substrates 2 and 4 of the present embodiment are basically the same as the conventional transmission line substrates 10 and 11 shown in FIGS. 7A to 7C. The following three points are different from the conventional transmission line substrates 10 and 11.
- the configurations other than the following three points in the transmission line substrates 2 and 4 are given the same reference numerals as in FIGS. 7A to 7C in FIGS.
- An effect peculiar to the present embodiment obtained in this way and an experimental result carried out to support the effect will be described.
- the axial ends of the signal conductor wires 16 in the measurement terminal portions 20 are conductive throughs located on both sides of the signal conductor wires 16 as is apparent from FIG. 1C.
- the hole 24 is cut at an intersection position with a line segment that connects the holes 24 (more preferably, the central axes of the conductive through holes 24), and the coplanar probe 50 can be connected to the tip (FIG.
- the signal conductor line 16 is opened at the end opposite to the measurement terminal portion 20 of the microstrip line that is opened so that the high-frequency component 40 that is the measurement object can be connected.
- a matching circuit 28 for matching input / output impedance when the high frequency component 40 is connected to the end by wire bonding 34 is formed.
- the matching circuit 28 is configured by narrowing the pattern width of the signal conductor line 16 and forming the open stub 18 in that portion.
- the bottom surface of the placement portion 32 for placing the high-frequency component 40 is the placement portion 32. It is lower than the surrounding base surface. This is because when the high frequency component 40 is placed on the placement portion 32, the height of the high frequency component 40 from the base 30 and the height of the transmission line substrate 2 from the base 30 are made to coincide with each other. This is because the surface on the side opposite to the base of 2 is made substantially flush.
- the coplanar probe 50 is arranged so that the arrangement direction of each of the 50 electrodes (specifically, the central electrode and the outer electrodes on both sides thereof) and the axial direction of the signal conductor line 16 are orthogonal to each other, and the central electrode of the coplanar probe 50 is signaled. If it is brought into contact with the leading end portion of the conductor wire 16, the outer electrode of the coplanar probe 50 is brought into contact with a position in the vicinity of the conductive through hole 24 of the ground conductor 22.
- the transmission line substrates 2 and 4 of the present embodiment in the ground conductor 22, the distance between the connection point of the coplanar probe 50 and the conductive through hole 24 is shortened, and the high frequency generated in the measurement terminal unit 20. Signal transmission loss can be suppressed, and the signal conductor line 16 can be free from the portion that extends outward from the connection point with the coplanar probe 50 and becomes an open stub, thereby preventing characteristic deterioration due to reflection of a high-frequency signal or the like. .
- the transmission line substrate optimal for measuring the characteristics of the high-frequency components by preventing the transmission characteristics of the high-frequency signal from deteriorating at the measurement terminal portion 20 is prevented. Can be realized.
- the calibration transmission line substrate 4 of the present embodiment in which the measurement terminal portion 20 is configured as shown in FIG. 2A and the measurement terminal portion 20 are also shown in FIG. 2B.
- a high frequency signal (55 GHz to 100 GHz) was input, and an input return loss and a passage loss were measured when the high frequency signal was extracted from the other measurement terminal unit 20.
- the measurement results are shown in FIGS. 3A-3B.
- the thickness of the dielectric substrate 14 used in this measurement is 50 ⁇ m, and the thickness of the signal conductor wire 16, the ground conductor 22, and the ground layer 12 on the front and rear surfaces thereof is 3.3 ⁇ m.
- the conductive through-hole as in this embodiment is used. If the holes 24 are aligned with the line segment position where the holes 24 are connected to each other, the reflection of the high-frequency signal at the measurement terminal portion 20 is suppressed, and the passage loss of the high-frequency signal at the microstrip line is suppressed. It can be seen that a transmission line substrate capable of obtaining excellent transmission characteristics can be realized.
- the width of the signal conductor line 16 and the interval between the signal conductor line 16 and the ground conductor 22 are 50 ⁇ m, and the ground conductor 22 is a square having a side of 400 ⁇ m.
- the transmission line substrates 4 and 11 having the measurement terminal portion 20 in which the conductive through-hole 24 having a diameter of 200 ⁇ m is formed on the same axis as the ground conductor 22 are used. What is necessary is just to set, and the transmission line board
- the tip end portion in the axial direction of the signal conductor wire 16 extends outward by 25 ⁇ m from the line segment connecting the centers of the conductive through holes 24.
- this is due to consideration of slipping when the electrodes of the coplanar probe 50 are pressed during measurement, and the axial end portions of the signal conductor wires 16 connect the centers of the conductive through holes 24 to each other. You may make it correspond to the intersection point position with a line segment, or you may extend further to the outside by the diameter of the conductive through hole 24.
- a matching circuit 28 made of an open stub 18 or the like is formed at the end opposite to the measurement terminal portion 20 of the signal conductor line 16 constituting the microstrip line. Therefore, it is possible to prevent mismatch in transmission impedance that occurs when the high-frequency component 40 is connected to the end portion thereof by wire bonding 34 or the like, and to prevent the transmission characteristics of the high-frequency signal from deteriorating at the connection point. Therefore, if the transmission line substrate 2 of this embodiment is used, the characteristic of the high frequency component 40 can be measured with high accuracy.
- the bottom surface of the mounting portion 32 formed between the pair of transmission line substrates 2 is the base of the high frequency component 40 when the high frequency component 40 is mounted. 30 so that the height from the base 30 of the transmission line substrate 2 coincides (in other words, the surface opposite to the base 30 of these parts 40 and 2 is substantially the same plane. ) Since the height is lower than the base surface around the mounting portion 32, the transmission line substrate 2 of a conductive member such as a wire used to connect the high-frequency component 40 and the transmission line substrate 2 on both sides thereof. The height from can be lowered and the length can be shortened.
- the measuring apparatus of the present embodiment it is possible to suppress the deterioration of the transmission characteristics of the high-frequency signal generated at the connection portion between the high-frequency component 40 and the transmission line substrate 2 and improve the measurement accuracy of the characteristics of the high-frequency component 40.
- the measurement transmission line substrate 2 of the present embodiment configured as shown in FIG. 4A is laminated on the base 30 with a flat surface, It connects with the high frequency component 40 laminated
- the conductive member such as a wire used for connecting the transmission line substrate 2 and the high frequency component 40 on the base 30 has a height H from the transmission line substrate 2 as low as possible, It turns out that it is good to shorten the length.
- the bottom surface of the placement part 32 of the high-frequency component 40 is lowered, and the high-frequency component 40 placed on the placement part 32 and the transmission line substrate 2 on both sides thereof are arranged. It is sufficient to prevent the level difference from occurring.
- each part of the measurement terminal portion 20 of the transmission line substrate 2 used in this measurement and the thickness of the dielectric substrate 14 and the like are the same as those described in the experimental result 1.
- the length and width of the open stub 18 of the matching circuit 28 are 585 ⁇ m and 78 ⁇ m, respectively, and the width of the portion where the open stub 18 is connected in the signal conductor line 16 is 32 ⁇ m.
- the transmission line substrate 2 of this embodiment is not limited to that shown in FIG. 4A.
- the present invention is not limited to the above-described embodiment, and can take various forms without departing from the gist of the present invention.
- the pair of ground conductors 22 have been described as having a rectangular shape in the measurement terminal portion 20 formed on the transmission line substrates 2 and 4.
- a notch 23 may be formed by a circular arc or a straight line at a corner adjacent to the signal conductor line 16.
- the gap between the ground conductor 22 and the signal conductor line 16 can be increased to prevent the ground conductor 22 and the signal conductor line 16 from being coupled at a high frequency. It is possible to prevent the transmission characteristics of the high-frequency signal at the measurement terminal unit 20 from deteriorating.
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Abstract
Provided is a transmission line board comprising a measuring terminal portion, which is constituted by connecting a pair of grounding conductors formed to sandwich a signal conductor line, individually to a grounding layer through a pair of conductive through holes. In the measuring terminal portion, the signal conductor line has its axially leading end cut at the position of an intersection point, at which the pair of conductive through holes are to be connected to each other.
Description
本発明は、ミリ波帯の高周波信号を処理する高周波部品の特性を測定するのに好適な伝送線路基板及び高周波部品の測定装置に関する。
The present invention relates to a transmission line substrate and a high-frequency component measuring apparatus suitable for measuring characteristics of high-frequency components that process high-frequency signals in the millimeter wave band.
従来、ミリ波帯の高周波信号を処理する高周波部品（増幅回路やフィルタ回路、或いはダイオード等の各種半導体素子）の特性を測定する際には、測定対象となる高周波部品と、測定装置から引き出された測定用のコプレーナプローブとを接続するために、マイクロストリップ線路若しくはグランド付きコプレーナ線路を構成する伝送線路基板が用いられる（例えば、特許文献１等参照）。
Conventionally, when measuring the characteristics of high-frequency components (amplifier circuits, filter circuits, or various semiconductor elements such as diodes) that process high-frequency signals in the millimeter wave band, they are extracted from the high-frequency components to be measured and the measuring device. In order to connect the measured coplanar probe, a transmission line substrate constituting a microstrip line or a grounded coplanar line is used (see, for example, Patent Document 1).
このうち、マイクロストリップ線路を構成する伝送線路基板１０は、図７Ａ－７Ｂに例示するように、裏面にグランド層１２が形成された誘電体基板１４の表面に、高周波信号伝送用の信号導体線１６を形成した構成となっている。
Among these, the transmission line substrate 10 constituting the microstrip line is a signal conductor line for high-frequency signal transmission on the surface of the dielectric substrate 14 having the ground layer 12 formed on the back surface, as illustrated in FIGS. 7A-7B. 16 is formed.
また、伝送線路基板１０において、信号導体線１６にて構成されるマイクロストリップ線路の一端側には、信号導体線１６（詳しくはその端部）と、誘電体基板１４の信号導体線１６と同一面上に信号導体線１６（詳しくはその端部）を挟むように形成された一対のグランド導体２２と、この一対のグランド導体２２と誘電体基板１４裏面のグランド層１２とを各々接続する一対の導電性スルーホール２４と、からなる測定用端子部２０が設けられている。
Further, in the transmission line substrate 10, the signal conductor wire 16 (specifically, its end portion) and the signal conductor wire 16 of the dielectric substrate 14 are the same on one end side of the microstrip line constituted by the signal conductor wire 16. A pair of ground conductors 22 formed so as to sandwich the signal conductor wire 16 (specifically, an end thereof) on the surface, and a pair of the pair of ground conductors 22 and the ground layer 12 on the back surface of the dielectric substrate 14 are connected to each other. The measurement terminal portion 20 is provided.
そして、このように構成された伝送線路基板１０を用いて、高周波部品４０の特性を測定する際には、通常、上記のように構成された一対の伝送線路基板１０と、導電性金属からなる基台３０が使用される。
And when measuring the characteristic of the high frequency component 40 using the transmission line board | substrate 10 comprised in this way, it usually consists of a pair of transmission line board | substrates 10 comprised as mentioned above, and an electroconductive metal. A base 30 is used.
この基台３０は、測定対象となる高周波部品４０と一対の伝送線路基板１０とを同時に載置して、一対の伝送線路基板１０を高周波部品４０への高周波信号の入出力経路として利用するためのものである。
The base 30 is configured to simultaneously mount the high-frequency component 40 to be measured and the pair of transmission line substrates 10 and use the pair of transmission line substrates 10 as an input / output path for high-frequency signals to the high-frequency components 40. belongs to.
そして、一対の伝送線路基板１０は、裏面側のグランド層１２が基台に接触（詳しくは導通）し、且つ、各伝送線路基板１０に形成されたマイクロストリップ線路の測定用端子部２０とは反対側端部が、基台３０における高周波部品４０の載置部３２を挟んで互いに対向するよう、基台３０に積層される。
The pair of transmission line substrates 10 has the ground layer 12 on the back side in contact with the base (specifically, conductive), and the microstrip line measurement terminal 20 formed on each transmission line substrate 10. The opposite end portions are stacked on the base 30 so as to face each other with the mounting portion 32 of the high-frequency component 40 in the base 30 interposed therebetween.
また、高周波部品４０の特性を実際に測定する際には、各伝送線路基板１０に形成されたマイクロストリップ線路の測定用端子部２０とは反対側端部と、基台３０上の高周波部品４０の高周波信号の入／出力端子とを、ワイヤボンディング３４等で電気的に接続し、更に、各伝送線路基板１０に形成された測定用端子部２０における信号導体線１６と一対のグランド導体２２とに、夫々、測定用のコプレーナプローブ５０の電極を押し当てることで、各コプレーナプローブ５０に接続された測定装置に、一対の伝送線路基板１０を介して、高周波部品４０を接続する。
When actually measuring the characteristics of the high-frequency component 40, the end of the microstrip line on the opposite side of the measurement strip 20 formed on each transmission line substrate 10 and the high-frequency component 40 on the base 30. The high frequency signal input / output terminals are electrically connected by wire bonding 34 or the like, and the signal conductor lines 16 and the pair of ground conductors 22 in the measurement terminal portions 20 formed on each transmission line substrate 10 are connected to each other. In addition, the high frequency component 40 is connected to the measuring device connected to each coplanar probe 50 via the pair of transmission line substrates 10 by pressing the electrodes of the measuring coplanar probes 50 respectively.
また、このように一対の伝送線路基板１０を使って高周波部品４０の特性を測定する際には、測定装置で得られた測定結果から、伝送線路基板１０の特性を相殺できるように測定装置を校正する必要がある。そして、測定装置を校正する際には、図７Ｃに示す校正用の伝送線路基板１１が使用される。
Further, when measuring the characteristics of the high-frequency component 40 using the pair of transmission line substrates 10 as described above, the measurement apparatus is arranged so that the characteristics of the transmission line substrate 10 can be offset from the measurement results obtained by the measurement apparatus. It is necessary to calibrate. And when calibrating a measuring apparatus, the transmission line board | substrate 11 for a calibration shown to FIG. 7C is used.
この校正用の伝送線路基板１１は、高周波部品４０を測定する際に一対の測定用端子２０間に形成される伝送経路と同じ長さのマイクロストリップ線路を形成するものであり、上述した測定用の伝送線路基板１０と略同様に構成される。
The calibration transmission line substrate 11 forms a microstrip line having the same length as the transmission path formed between the pair of measurement terminals 20 when the high-frequency component 40 is measured. The transmission line substrate 10 is configured in substantially the same manner.
つまり、校正用の伝送線路基板１１は、裏面にグランド層１２が形成された誘電体基板１４の表面に上記長さの信号導体線１６を形成することで、マイクロストリップ線路を形成し、その両端に、夫々、信号導体線１６を挟んで一対のグランド導体２２と一対の導電性スルーホール２４を設けることで、測定用端子部２０を形成した構成（換言すれば、高周波部品４０の測定時に測定用端子部２０間に形成される伝送線路における高周波部品４０をマイクロストリップ線路に置き換えた構成）となっている。
That is, the transmission line substrate 11 for calibration forms a microstrip line by forming the signal conductor wire 16 having the above length on the surface of the dielectric substrate 14 having the ground layer 12 formed on the back surface, and both ends thereof. In addition, a configuration in which the measurement terminal portion 20 is formed by providing a pair of ground conductors 22 and a pair of conductive through holes 24 with the signal conductor wire 16 interposed therebetween (in other words, measured when measuring the high-frequency component 40). The high frequency component 40 in the transmission line formed between the terminal portions 20 for use is replaced with a microstrip line).
従って、この伝送線路基板１１の両端の測定用端子部２０に、測定用プローブであるコプレーナプローブ５０を押し当てて、伝送線路基板１１の伝送特性を測定装置で測定すれば、高周波部品４０を設けていない基準伝送線路の伝送特性を測定できることになり、その測定した伝送特性を基準として高周波部品４０の特性を測定すれば、高周波部品４０単独の特性を測定できることになる。
特許第３８２７４８５号公報
Therefore, if the coplanar probe 50 that is a measurement probe is pressed against the measurement terminal portions 20 at both ends of the transmission line substrate 11 and the transmission characteristics of the transmission line substrate 11 are measured by the measurement device, the high frequency component 40 is provided. It is possible to measure the transmission characteristics of the reference transmission line that is not, and if the characteristics of the high-frequency component 40 are measured with reference to the measured transmission characteristics, the characteristics of the high-frequency component 40 alone can be measured.
Japanese Patent No. 3827485
このように、高周波部品の特性を、マイクロストリップ線路を介して測定する際には、マイクロストリップ線路が形成された伝送線路基板１０、１１が使用され、伝送線路基板１０、１１には、コプレーナプローブ５０を接続するための測定用端子部２０が形成されている。
As described above, when measuring the characteristics of the high-frequency component through the microstrip line, the transmission line substrates 10 and 11 on which the microstrip line is formed are used, and the transmission line substrates 10 and 11 include a coplanar probe. A measurement terminal portion 20 for connecting 50 is formed.
ところで、従来、測定用端子部２０は、図７Ｃから明らかなように、信号導体線１６の軸方向先端位置と、グランド導体２２の同方向先端位置とを一致させて、測定時には、その先端部分（図に示す黒色部分）にコプレーナプローブ５０の各電極を接続するように構成されていた。
By the way, as is apparent from FIG. 7C, conventionally, the measurement terminal portion 20 has the tip end portion in the axial direction of the signal conductor line 16 and the tip end position in the same direction of the ground conductor 22 aligned. Each electrode of the coplanar probe 50 is configured to be connected to the black portion shown in the drawing.
このため、グランド導体２２において、コプレーナプローブ５０の接続点と導電性スルーホール２４とが離れ、コプレーナプローブ５０から誘電体基板１４裏面のグランド層１２までの距離がミリ波帯の高周波信号にとっては長くなり、伝送損失が増加するという問題があった。
Therefore, the connection point of the coplanar probe 50 and the conductive through hole 24 are separated from each other in the ground conductor 22, and the distance from the coplanar probe 50 to the ground layer 12 on the back surface of the dielectric substrate 14 is long for a high frequency signal in the millimeter wave band. Thus, there is a problem that transmission loss increases.
一方、この問題を防止するために、図７Ｃに斜線で示すように、グランド導体２２へのコプレーナプローブ５０の接続点を、導電性スルーホール２４に近づけることが考えられる。
On the other hand, in order to prevent this problem, it is conceivable that the connection point of the coplanar probe 50 to the ground conductor 22 is brought close to the conductive through-hole 24 as shown by hatching in FIG. 7C.
しかし、このようにすると、信号導体線１６とコプレーナプローブ５０との接続点が、信号導体線１６の先端から内側に移動するので、その接続点から先端までがオープンスタブとなって、高周波信号の反射等が発生し、伝送特性を劣化させてしまうという問題がある。
However, in this case, the connection point between the signal conductor line 16 and the coplanar probe 50 moves inward from the tip of the signal conductor line 16, so that the connection point to the tip becomes an open stub, and the high-frequency signal is transmitted. There is a problem that reflection or the like occurs and the transmission characteristics deteriorate.
本発明は、こうした問題に鑑みなされたものであり、マイクロストリップ線路を構成する伝送線路基板を用いて高周波部品の特性を測定する際に、伝送線路基板とコプレーナプローブとの接続部分で高周波信号の伝送特性が劣化するのを防止することのできる伝送線路基板及び高周波部品の測定装置を提供することを目的とする。
The present invention has been made in view of these problems. When measuring characteristics of a high-frequency component using a transmission line substrate constituting a microstrip line, a high-frequency signal is connected at a connection portion between the transmission line substrate and a coplanar probe. It is an object of the present invention to provide a transmission line substrate and a high-frequency component measuring device capable of preventing the transmission characteristics from deteriorating.
かかる目的を達成するためになされた本願発明の第１局面における伝送線路基板は、
誘電体基板と、該誘電体基板の表面に形成された信号導体線と、前記誘電体基板の前記信号導体線とは反対側の裏面に形成されたグランド層とからなるマイクロストリップ線路を備えると共に、
前記マイクロストリップ線路の少なくとも一方の端部位置に、
前記信号導体線と、前記誘電体基板の前記信号導体線と同一面上で前記信号導体線を挟むように形成された一対のグランド導体と、前記誘電体基板を貫通して前記一対のグランド導体と前記グランド層とを各々接続する一対の導電性スルーホールとからなる測定用端子部を備え、
該測定用端子部を構成する前記信号導体線と一対のグランド導体とに測定用のコプレーナプローブを押し当て、高周波信号の伝送特性を測定するのに使用される伝送線路基板であって、
前記測定用端子部において、前記信号導体線の軸方向先端は、前記一対の導電性スルーホール同士を接続する線分との交点位置で切断されていることを特徴とする。 The transmission line substrate according to the first aspect of the present invention made to achieve such an object,
A microstrip line comprising a dielectric substrate, a signal conductor line formed on the surface of the dielectric substrate, and a ground layer formed on the back surface of the dielectric substrate opposite to the signal conductor line; ,
At least one end position of the microstrip line,
The signal conductor line, a pair of ground conductors formed so as to sandwich the signal conductor line on the same plane as the signal conductor line of the dielectric substrate, and the pair of ground conductors penetrating the dielectric substrate And a measurement terminal portion comprising a pair of conductive through holes connecting the ground layer and the ground layer,
A transmission line substrate used to measure a transmission characteristic of a high-frequency signal by pressing a measurement coplanar probe against the signal conductor wire and the pair of ground conductors constituting the measurement terminal portion,
In the measurement terminal portion, the tip end in the axial direction of the signal conductor wire is cut at an intersection position with a line segment connecting the pair of conductive through holes.
誘電体基板と、該誘電体基板の表面に形成された信号導体線と、前記誘電体基板の前記信号導体線とは反対側の裏面に形成されたグランド層とからなるマイクロストリップ線路を備えると共に、
前記マイクロストリップ線路の少なくとも一方の端部位置に、
前記信号導体線と、前記誘電体基板の前記信号導体線と同一面上で前記信号導体線を挟むように形成された一対のグランド導体と、前記誘電体基板を貫通して前記一対のグランド導体と前記グランド層とを各々接続する一対の導電性スルーホールとからなる測定用端子部を備え、
該測定用端子部を構成する前記信号導体線と一対のグランド導体とに測定用のコプレーナプローブを押し当て、高周波信号の伝送特性を測定するのに使用される伝送線路基板であって、
前記測定用端子部において、前記信号導体線の軸方向先端は、前記一対の導電性スルーホール同士を接続する線分との交点位置で切断されていることを特徴とする。 The transmission line substrate according to the first aspect of the present invention made to achieve such an object,
A microstrip line comprising a dielectric substrate, a signal conductor line formed on the surface of the dielectric substrate, and a ground layer formed on the back surface of the dielectric substrate opposite to the signal conductor line; ,
At least one end position of the microstrip line,
The signal conductor line, a pair of ground conductors formed so as to sandwich the signal conductor line on the same plane as the signal conductor line of the dielectric substrate, and the pair of ground conductors penetrating the dielectric substrate And a measurement terminal portion comprising a pair of conductive through holes connecting the ground layer and the ground layer,
A transmission line substrate used to measure a transmission characteristic of a high-frequency signal by pressing a measurement coplanar probe against the signal conductor wire and the pair of ground conductors constituting the measurement terminal portion,
In the measurement terminal portion, the tip end in the axial direction of the signal conductor wire is cut at an intersection position with a line segment connecting the pair of conductive through holes.
また、本願発明の第２局面は、本願発明の第１局面の伝送線路基板において、前記測定用端子部における一対のグランド導体は、前記一対の導電性スルーホールと略同心の矩形形状であり、前記信号導体線と隣接する角部には、信号導体線との間隔が大きくなるよう切り欠きが形成されていることを特徴とする。
Further, the second aspect of the present invention is the transmission line substrate according to the first aspect of the present invention, wherein the pair of ground conductors in the measurement terminal portion has a rectangular shape substantially concentric with the pair of conductive through holes, A notch is formed in a corner adjacent to the signal conductor line so as to increase a distance from the signal conductor line.
また次に、本願発明の第３局面は、本願発明の第１局面または第２局面の伝送線路基板において、前記マイクロストリップ線路の両端に、前記測定用端子部を備えたことを特徴とする。
Next, a third aspect of the present invention is characterized in that, in the transmission line substrate of the first aspect or the second aspect of the present invention, the measurement terminal portions are provided at both ends of the microstrip line.
また、本願発明の第４局面は、本願発明の第１局面または第２局面の伝送線路基板において、前記測定用端子部は、前記マイクロストリップ線路の一端側に設けられ、前記マイクロストリップ線路の他端側は、導電部材を介して測定対象物を接続できるように開放されていることを特徴とする。
According to a fourth aspect of the present invention, there is provided the transmission line substrate according to the first aspect or the second aspect of the present invention, wherein the measurement terminal portion is provided on one end side of the microstrip line. The end side is characterized in that it is open so that a measurement object can be connected via a conductive member.
また更に、本願発明の第５局面は、本願発明の第４局面の伝送線路基板において、測定対象物を接続可能に開放された前記マイクロストリップ線路の他端側には、導電部材を介して測定対象物を接続したときの入出力インピーダンスを整合させる整合回路が形成されていることを特徴とする。
Still further, a fifth aspect of the present invention is the transmission line substrate according to the fourth aspect of the present invention, wherein the other end side of the microstrip line that is open so that the measurement object can be connected is measured via a conductive member. A matching circuit for matching input / output impedance when an object is connected is formed.
一方、本願発明の第６局面における高周波部品の測定装置は、測定対象物である高周波部品を載置可能な導電性の基台を備えると共に、第４局面または第５局面の伝送線路基板を一対備え、
前記各伝送線路基板のグランド層が前記基台に接触し、且つ、前記各伝送線路基板に形成されたマイクロストリップ線路の測定用端子部とは反対側端部が、前記基台における前記高周波部品の載置部を挟んで互いに対向するよう、前記各伝送線路基板を前記基台に積層してなる高周波部品の測定装置であって、
前記載置部に載置された高周波部品の前記基台とは反対側面と、前記各伝送線路基板の前記基台とは反対側面とが、略同一平面上となるよう、前記載置部の底面を前記載置部周囲の基台表面よりも低くしたことを特徴とする。 On the other hand, the high-frequency component measuring apparatus according to the sixth aspect of the present invention includes a conductive base on which a high-frequency component that is a measurement object can be placed, and a pair of transmission line substrates according to the fourth or fifth aspect. Prepared,
The ground layer of each transmission line substrate is in contact with the base, and the end opposite to the measurement terminal portion of the microstrip line formed on each transmission line substrate is the high-frequency component on the base. A measuring apparatus for high-frequency components formed by laminating each transmission line substrate on the base so as to face each other across the mounting portion of
The side surface opposite to the base of the high-frequency component placed on the mounting portion and the side surface opposite to the base of each transmission line substrate are on substantially the same plane. The bottom surface is lower than the surface of the base around the mounting portion.
前記各伝送線路基板のグランド層が前記基台に接触し、且つ、前記各伝送線路基板に形成されたマイクロストリップ線路の測定用端子部とは反対側端部が、前記基台における前記高周波部品の載置部を挟んで互いに対向するよう、前記各伝送線路基板を前記基台に積層してなる高周波部品の測定装置であって、
前記載置部に載置された高周波部品の前記基台とは反対側面と、前記各伝送線路基板の前記基台とは反対側面とが、略同一平面上となるよう、前記載置部の底面を前記載置部周囲の基台表面よりも低くしたことを特徴とする。 On the other hand, the high-frequency component measuring apparatus according to the sixth aspect of the present invention includes a conductive base on which a high-frequency component that is a measurement object can be placed, and a pair of transmission line substrates according to the fourth or fifth aspect. Prepared,
The ground layer of each transmission line substrate is in contact with the base, and the end opposite to the measurement terminal portion of the microstrip line formed on each transmission line substrate is the high-frequency component on the base. A measuring apparatus for high-frequency components formed by laminating each transmission line substrate on the base so as to face each other across the mounting portion of
The side surface opposite to the base of the high-frequency component placed on the mounting portion and the side surface opposite to the base of each transmission line substrate are on substantially the same plane. The bottom surface is lower than the surface of the base around the mounting portion.
本願発明の第１局面の伝送線路基板には、上述した従来の伝送線路基板と同様、マイクロストリップ線路が形成されており、マイクロストリップ線路の少なくとも一方の端部位置には、信号導体線と、一対のグランド導体と、導電性スルーホールとからなる測定用端子部が設けられている。
In the transmission line substrate of the first aspect of the present invention, a microstrip line is formed as in the conventional transmission line substrate described above, and at least one end position of the microstrip line has a signal conductor line, A measurement terminal portion including a pair of ground conductors and a conductive through hole is provided.
そして、この測定用端子部において、信号導体線の軸方向先端は、一対の導電性スルーホール同士を接続する線分との交点位置で切断されている。
このため、本願発明の第１局面の伝送線路基板によれば、コプレーナプローブの各電極（詳しくは中心電極とその両側の外側電極）の配列方向と信号導体線の軸心方向とが直交するようにコプレーナプローブを配置して、コプレーナプローブの中心電極を信号導体線の先端部分に当接させれば、コプレーナプローブの外側電極は、グランド導体の導電性スルーホールとの近傍位置に当接されることになる。 In this measurement terminal portion, the tip end in the axial direction of the signal conductor wire is cut at the intersection point with the line segment connecting the pair of conductive through holes.
For this reason, according to the transmission line substrate of the first aspect of the present invention, the arrangement direction of the electrodes of the coplanar probe (specifically, the center electrode and the outer electrodes on both sides thereof) and the axial direction of the signal conductor line are orthogonal to each other. If the coplanar probe is disposed on the center electrode and the center electrode of the coplanar probe is brought into contact with the tip end portion of the signal conductor wire, the outer electrode of the coplanar probe is brought into contact with a position near the conductive through hole of the ground conductor. It will be.
このため、本願発明の第１局面の伝送線路基板によれば、コプレーナプローブの各電極（詳しくは中心電極とその両側の外側電極）の配列方向と信号導体線の軸心方向とが直交するようにコプレーナプローブを配置して、コプレーナプローブの中心電極を信号導体線の先端部分に当接させれば、コプレーナプローブの外側電極は、グランド導体の導電性スルーホールとの近傍位置に当接されることになる。 In this measurement terminal portion, the tip end in the axial direction of the signal conductor wire is cut at the intersection point with the line segment connecting the pair of conductive through holes.
For this reason, according to the transmission line substrate of the first aspect of the present invention, the arrangement direction of the electrodes of the coplanar probe (specifically, the center electrode and the outer electrodes on both sides thereof) and the axial direction of the signal conductor line are orthogonal to each other. If the coplanar probe is disposed on the center electrode and the center electrode of the coplanar probe is brought into contact with the tip end portion of the signal conductor wire, the outer electrode of the coplanar probe is brought into contact with a position near the conductive through hole of the ground conductor. It will be.
よって、本願発明の第１局面の伝送線路基板によれば、グランド導体において、コプレーナプローブの接続点と導電性スルーホールとの間を短くして、測定用端子部において生じる高周波信号の伝送損失を抑えることができ、しかも、信号導体線においては、コプレーナプローブとの接続点から外側に延びてオープンスタブとなる部分をなくし、高周波信号の反射等による特性劣化を防止できる。
Therefore, according to the transmission line substrate of the first aspect of the present invention, in the ground conductor, the distance between the connection point of the coplanar probe and the conductive through hole is shortened to reduce the transmission loss of the high-frequency signal generated in the measurement terminal portion. Moreover, in the signal conductor line, the portion that extends outward from the connection point with the coplanar probe and becomes an open stub can be eliminated, and characteristic deterioration due to reflection of a high-frequency signal or the like can be prevented.
従って、本願発明の第１局面の伝送線路基板によれば、測定用端子部での高周波信号の伝送特性が劣化するのを防止し、高周波部品の特性を測定するのに最適な伝送線路基板を実現できる。
Therefore, according to the transmission line substrate of the first aspect of the present invention, it is possible to prevent the transmission characteristic of the high frequency signal at the measurement terminal portion from being deteriorated, and to provide an optimum transmission line substrate for measuring the characteristics of the high frequency component. realizable.
次に、本願発明の第２局面の伝送線路基板においては、グランド導体が導電性スルーホールと略同心の矩形形状になっており、信号導体線と隣接する角部には、信号導体線との間隔が大きくなるよう切り欠きが形成されている。
Next, in the transmission line substrate according to the second aspect of the present invention, the ground conductor has a rectangular shape substantially concentric with the conductive through hole, and the signal conductor line is connected to the corner adjacent to the signal conductor line. Cutouts are formed to increase the spacing.
このため、本願発明の第２局面の伝送線路基板によれば、グランド導体と信号導体線との結合を防止して、測定用端子部での高周波信号の伝送特性が劣化するのを防止できる。
また次に、本願発明の第３局面の伝送線路基板においては、マイクロストリップ線路の両端に、測定用端子部が設けられている。従って、この第３局面の伝送線路基板は、図７Ｃに例示した校正用の伝送線路基板として使用することができる。 For this reason, according to the transmission line substrate of the second aspect of the present invention, it is possible to prevent the ground conductor and the signal conductor line from being coupled to each other and prevent the transmission characteristics of the high-frequency signal from being deteriorated at the measurement terminal portion.
Next, in the transmission line substrate of the third aspect of the present invention, measurement terminal portions are provided at both ends of the microstrip line. Therefore, the transmission line substrate of the third aspect can be used as the transmission line substrate for calibration illustrated in FIG. 7C.
また次に、本願発明の第３局面の伝送線路基板においては、マイクロストリップ線路の両端に、測定用端子部が設けられている。従って、この第３局面の伝送線路基板は、図７Ｃに例示した校正用の伝送線路基板として使用することができる。 For this reason, according to the transmission line substrate of the second aspect of the present invention, it is possible to prevent the ground conductor and the signal conductor line from being coupled to each other and prevent the transmission characteristics of the high-frequency signal from being deteriorated at the measurement terminal portion.
Next, in the transmission line substrate of the third aspect of the present invention, measurement terminal portions are provided at both ends of the microstrip line. Therefore, the transmission line substrate of the third aspect can be used as the transmission line substrate for calibration illustrated in FIG. 7C.
一方、本願発明の第４局面の伝送線路基板においては、測定用端子部がマイクロストリップ線路の一端側に設けられており、マイクロストリップ線路の他端側は、導電部材を介して測定対象物を接続できるように開放されている。従って、この第４局面の伝送線路基板は、図７Ａ－７Ｂに例示した測定用の伝送線路基板として使用することができる。
On the other hand, in the transmission line substrate of the fourth aspect of the present invention, the measurement terminal portion is provided on one end side of the microstrip line, and the other end side of the microstrip line is connected to the measurement object via the conductive member. Open for connection. Therefore, the transmission line substrate of the fourth aspect can be used as the transmission line substrate for measurement illustrated in FIGS. 7A-7B.
また次に、本願発明の第５局面の伝送線路基板においては、測定対象物を接続可能に開放されたマイクロストリップ線路の他端側には、導電部材を介して測定対象物を接続したときの入出力インピーダンスを整合させる整合回路が形成されている。
Next, in the transmission line substrate according to the fifth aspect of the present invention, when the measurement object is connected to the other end of the microstrip line that can be connected to the measurement object via a conductive member. A matching circuit for matching input / output impedances is formed.
このため、マイクロストリップ線路の測定用端子部とは反対側端部にワイヤボンディング等で測定対象物を接続する際、その接続部で生じる伝送インピーダンスの不整合を防止し、高周波信号の伝送特性が劣化するのを防止できる。
For this reason, when connecting the object to be measured to the end of the microstrip line opposite to the measurement terminal by wire bonding or the like, it prevents the mismatch of transmission impedance that occurs at the connection, and the transmission characteristics of the high frequency signal Deterioration can be prevented.
よって、本願発明の第５局面の伝送線路基板によれば、測定対象物である高周波部品の特性をより高精度に測定できることになる。
一方、本願発明の第６局面は、本願発明の第４局面または第５局面の伝送線路基板を用いて、高周波部品の特性を測定するための測定装置であり、図７Ａ－７Ｂに示した従来装置と同様、高周波部品を載置（換言すれば固定）するための導電性の基台を備える。 Therefore, according to the transmission line substrate of the fifth aspect of the present invention, the characteristics of the high-frequency component that is the measurement object can be measured with higher accuracy.
On the other hand, the sixth aspect of the present invention is a measuring apparatus for measuring the characteristics of a high-frequency component using the transmission line substrate according to the fourth or fifth aspect of the present invention, and is a conventional apparatus shown in FIGS. 7A-7B. As with the apparatus, a conductive base for mounting (in other words, fixing) high-frequency components is provided.
一方、本願発明の第６局面は、本願発明の第４局面または第５局面の伝送線路基板を用いて、高周波部品の特性を測定するための測定装置であり、図７Ａ－７Ｂに示した従来装置と同様、高周波部品を載置（換言すれば固定）するための導電性の基台を備える。 Therefore, according to the transmission line substrate of the fifth aspect of the present invention, the characteristics of the high-frequency component that is the measurement object can be measured with higher accuracy.
On the other hand, the sixth aspect of the present invention is a measuring apparatus for measuring the characteristics of a high-frequency component using the transmission line substrate according to the fourth or fifth aspect of the present invention, and is a conventional apparatus shown in FIGS. 7A-7B. As with the apparatus, a conductive base for mounting (in other words, fixing) high-frequency components is provided.
この基台には、高周波部品の載置部が形成されており、その載置部を挟んで一対の伝送線路基板が積層される。つまり、この一対の伝送線路基板は、グランド層が基台に接触し、且つ、マイクロストリップ線路の測定用端子部とは反対側端部が高周波部品の載置部を挟んで互いに対向するよう、基台に積層される。
The base is provided with a placement portion for high-frequency components, and a pair of transmission line substrates are stacked with the placement portion interposed therebetween. That is, in this pair of transmission line substrates, the ground layer is in contact with the base, and the end portion on the opposite side to the measurement terminal portion of the microstrip line is opposed to each other across the placement portion of the high-frequency component. Laminated on the base.
そして、特に、高周波部品が搭載される載置部の底部は、高周波部品の基台とは反対側面と、伝送線路基板の基台とは反対側面とが、略同一平面上となるように、載置部周囲の基台表面よりも低く形成されている。
And, in particular, the bottom of the mounting portion on which the high-frequency component is mounted is such that the side surface opposite to the base of the high-frequency component and the side surface opposite to the base of the transmission line substrate are substantially on the same plane. It is formed lower than the base surface around the mounting portion.
この結果、高周波部品とその両側の伝送線路基板とを接続するのに用いられるワイヤ等の導電性部材の伝送線路基板からの高さを低くし、その長さを短くすることができる。よって、本願発明の第６局面の測定装置によれば、高周波部品と伝送線路基板との接続部で生じる高周波信号の伝送特性の劣化を抑えて、高周波部品の特性の測定精度を向上できる。
As a result, the height of the conductive member such as a wire used for connecting the high-frequency component and the transmission line substrates on both sides thereof from the transmission line substrate can be reduced, and the length thereof can be shortened. Therefore, according to the measuring apparatus of the sixth aspect of the present invention, it is possible to improve the measurement accuracy of the characteristics of the high-frequency components by suppressing the deterioration of the transmission characteristics of the high-frequency signal generated at the connection portion between the high-frequency components and the transmission line substrate.
２，４，１０，１１…伝送線路基板、１２…グランド層、１４…誘電体基板、１６…信号導体線、１８…オープンスタブ、２０…測定用端子部、２２…グランド導体、２３…切り欠き部、２４…導電性スルーホール、２８…整合回路、３０…基台、３２…載置部、３４…ワイヤボンディング、４０…高周波部品、５０…コプレーナプローブ。
2, 4, 10, 11 ... transmission line substrate, 12 ... ground layer, 14 ... dielectric substrate, 16 ... signal conductor wire, 18 ... open stub, 20 ... measurement terminal, 22 ... ground conductor, 23 ... notch 24: conductive through hole, 28: matching circuit, 30: base, 32: mounting part, 34: wire bonding, 40: high-frequency component, 50: coplanar probe.
2, 4, 10, 11 ... transmission line substrate, 12 ... ground layer, 14 ... dielectric substrate, 16 ... signal conductor wire, 18 ... open stub, 20 ... measurement terminal, 22 ... ground conductor, 23 ... notch 24: conductive through hole, 28: matching circuit, 30: base, 32: mounting part, 34: wire bonding, 40: high-frequency component, 50: coplanar probe.
以下に本発明の実施形態について説明する。
図１Ａ－１Ｃは、図７Ａ－７Ｃに対応して本実施形態の測定用及び校正用の伝送線路基板２、４を示したものである。
これら図１Ａ－１Ｃから明らかなように、本実施形態の測定用及び校正用の伝送線路基板２、４は、基本的には図７Ａ－７Ｃに示した従来の伝送線路基板１０、１１と同様に構成されており、従来の伝送線路基板１０、１１と異なる点は、下記の３点である。 Embodiments of the present invention will be described below.
FIGS. 1A to 1C show thetransmission line substrates 2 and 4 for measurement and calibration of this embodiment corresponding to FIGS. 7A to 7C.
As is apparent from FIGS. 1A to 1C, the measurement and calibrationtransmission line substrates 2 and 4 of the present embodiment are basically the same as the conventional transmission line substrates 10 and 11 shown in FIGS. 7A to 7C. The following three points are different from the conventional transmission line substrates 10 and 11.
図１Ａ－１Ｃは、図７Ａ－７Ｃに対応して本実施形態の測定用及び校正用の伝送線路基板２、４を示したものである。
これら図１Ａ－１Ｃから明らかなように、本実施形態の測定用及び校正用の伝送線路基板２、４は、基本的には図７Ａ－７Ｃに示した従来の伝送線路基板１０、１１と同様に構成されており、従来の伝送線路基板１０、１１と異なる点は、下記の３点である。 Embodiments of the present invention will be described below.
FIGS. 1A to 1C show the
As is apparent from FIGS. 1A to 1C, the measurement and calibration
そこで、本実施形態では、伝送線路基板２、４における下記の３点以外の構成については、図１Ａ－１Ｃに図７Ａ－７Ｃと同一符号を付与して説明を省略し、下記の３点にて得られる本実施形態特有の効果及びその効果を裏付けるために行った実験結果について説明する。
（従来との相違点１）
測定用及び校正用の伝送線路基板２、４において、測定用端子部２０における信号導体線１６の軸方向先端は、図１Ｃから明らかなように、信号導体線１６の両側に位置する導電性スルーホール２４同士（より好ましくは導電性スルーホール２４の中心軸同士）を接続する線分との交点位置で切断されており、その先端部分にコプレーナプローブ５０を接続できるようにされている（図１Ｃの黒色部分参照）。
（従来との相違点２）
測定用の伝送線路基板２において、測定対象物である高周波部品４０を接続できるように開放された、マイクロストリップ線路の測定用端子部２０とは反対側端部には、信号導体線１６の開放端にワイヤボンディング３４で高周波部品４０を接続したときの入出力インピーダンスを整合させるための整合回路２８が形成されている。そして、この整合回路２８は、信号導体線１６のパターン幅を狭くし、その部分にオープンスタブ１８を形成することで、構成されている。
（従来との相違点３）
一対の伝送線路基板２が積層され、その間に高周波部品４０が載置される、測定装置の基台３０において、高周波部品４０を載置するための載置部３２の底面が、載置部３２周囲の基台表面よりも低くなっている。これは、載置部３２に高周波部品４０を載置した際に、高周波部品４０の基台３０からの高さと、伝送線路基板２の基台３０からの高さとを一致させて、これら各部４０、２の基台とは反対側の面を略同一平面上にするためである。
（相違点１による効果）
本実施形態のように、測定用端子部２０における信号導体線１６の軸方向先端を、その両側の導電性スルーホール２４同士を接続する線分との交点位置までにした際には、コプレーナプローブ５０の各電極（詳しくは中心電極とその両側の外側電極）の配列方向と信号導体線１６の軸心方向とが直交するようにコプレーナプローブ５０を配置して、コプレーナプローブ５０の中心電極を信号導体線１６の先端部分に当接させれば、コプレーナプローブ５０の外側電極が、グランド導体２２の導電性スルーホール２４との近傍位置に当接されることになる。 Therefore, in this embodiment, the configurations other than the following three points in thetransmission line substrates 2 and 4 are given the same reference numerals as in FIGS. 7A to 7C in FIGS. An effect peculiar to the present embodiment obtained in this way and an experimental result carried out to support the effect will be described.
(Difference from the previous 1)
In thetransmission line substrates 2 and 4 for measurement and calibration, the axial ends of the signal conductor wires 16 in the measurement terminal portions 20 are conductive throughs located on both sides of the signal conductor wires 16 as is apparent from FIG. 1C. The hole 24 is cut at an intersection position with a line segment that connects the holes 24 (more preferably, the central axes of the conductive through holes 24), and the coplanar probe 50 can be connected to the tip (FIG. 1C). (See the black part).
(Difference from the previous 2)
In thetransmission line substrate 2 for measurement, the signal conductor line 16 is opened at the end opposite to the measurement terminal portion 20 of the microstrip line that is opened so that the high-frequency component 40 that is the measurement object can be connected. A matching circuit 28 for matching input / output impedance when the high frequency component 40 is connected to the end by wire bonding 34 is formed. The matching circuit 28 is configured by narrowing the pattern width of the signal conductor line 16 and forming the open stub 18 in that portion.
(Difference from the previous 3)
In thebase 30 of the measuring apparatus on which the pair of transmission line substrates 2 are stacked and the high-frequency component 40 is placed therebetween, the bottom surface of the placement portion 32 for placing the high-frequency component 40 is the placement portion 32. It is lower than the surrounding base surface. This is because when the high frequency component 40 is placed on the placement portion 32, the height of the high frequency component 40 from the base 30 and the height of the transmission line substrate 2 from the base 30 are made to coincide with each other. This is because the surface on the side opposite to the base of 2 is made substantially flush.
(Effects of Difference 1)
As in the present embodiment, when the axial end of thesignal conductor wire 16 in the measurement terminal portion 20 is set to the intersection point with the line segment connecting the conductive through holes 24 on both sides thereof, the coplanar probe is used. The coplanar probe 50 is arranged so that the arrangement direction of each of the 50 electrodes (specifically, the central electrode and the outer electrodes on both sides thereof) and the axial direction of the signal conductor line 16 are orthogonal to each other, and the central electrode of the coplanar probe 50 is signaled. If it is brought into contact with the leading end portion of the conductor wire 16, the outer electrode of the coplanar probe 50 is brought into contact with a position in the vicinity of the conductive through hole 24 of the ground conductor 22.
（従来との相違点１）
測定用及び校正用の伝送線路基板２、４において、測定用端子部２０における信号導体線１６の軸方向先端は、図１Ｃから明らかなように、信号導体線１６の両側に位置する導電性スルーホール２４同士（より好ましくは導電性スルーホール２４の中心軸同士）を接続する線分との交点位置で切断されており、その先端部分にコプレーナプローブ５０を接続できるようにされている（図１Ｃの黒色部分参照）。
（従来との相違点２）
測定用の伝送線路基板２において、測定対象物である高周波部品４０を接続できるように開放された、マイクロストリップ線路の測定用端子部２０とは反対側端部には、信号導体線１６の開放端にワイヤボンディング３４で高周波部品４０を接続したときの入出力インピーダンスを整合させるための整合回路２８が形成されている。そして、この整合回路２８は、信号導体線１６のパターン幅を狭くし、その部分にオープンスタブ１８を形成することで、構成されている。
（従来との相違点３）
一対の伝送線路基板２が積層され、その間に高周波部品４０が載置される、測定装置の基台３０において、高周波部品４０を載置するための載置部３２の底面が、載置部３２周囲の基台表面よりも低くなっている。これは、載置部３２に高周波部品４０を載置した際に、高周波部品４０の基台３０からの高さと、伝送線路基板２の基台３０からの高さとを一致させて、これら各部４０、２の基台とは反対側の面を略同一平面上にするためである。
（相違点１による効果）
本実施形態のように、測定用端子部２０における信号導体線１６の軸方向先端を、その両側の導電性スルーホール２４同士を接続する線分との交点位置までにした際には、コプレーナプローブ５０の各電極（詳しくは中心電極とその両側の外側電極）の配列方向と信号導体線１６の軸心方向とが直交するようにコプレーナプローブ５０を配置して、コプレーナプローブ５０の中心電極を信号導体線１６の先端部分に当接させれば、コプレーナプローブ５０の外側電極が、グランド導体２２の導電性スルーホール２４との近傍位置に当接されることになる。 Therefore, in this embodiment, the configurations other than the following three points in the
(Difference from the previous 1)
In the
(Difference from the previous 2)
In the
(Difference from the previous 3)
In the
(Effects of Difference 1)
As in the present embodiment, when the axial end of the
このため、本実施形態の伝送線路基板２、４によれば、グランド導体２２において、コプレーナプローブ５０の接続点と導電性スルーホール２４との間を短くして、測定用端子部２０において生じる高周波信号の伝送損失を抑えることができ、しかも、信号導体線１６においては、コプレーナプローブ５０との接続点から外側に延びてオープンスタブとなる部分をなくし、高周波信号の反射等による特性劣化を防止できる。
For this reason, according to the transmission line substrates 2 and 4 of the present embodiment, in the ground conductor 22, the distance between the connection point of the coplanar probe 50 and the conductive through hole 24 is shortened, and the high frequency generated in the measurement terminal unit 20. Signal transmission loss can be suppressed, and the signal conductor line 16 can be free from the portion that extends outward from the connection point with the coplanar probe 50 and becomes an open stub, thereby preventing characteristic deterioration due to reflection of a high-frequency signal or the like. .
従って、本実施形態の伝送線路基板２、４によれば、測定用端子部２０での高周波信号の伝送特性が劣化するのを防止し、高周波部品の特性を測定するのに最適な伝送線路基板を実現できる。
（実験結果１）
次に、この相違点１による効果を裏付けるために、測定用端子部２０を図２Ａに示すように構成した本実施形態の校正用伝送線路基板４と、同じく測定用端子部２０を図２Ｂに示すように構成した従来の校正用伝送線路基板１１とを使用し、両端の測定用端子部２０へコプレーナプローブ５０を介して測定装置を接続して、一方の測定用端子部２０からミリ波帯（５５ＧＨｚ～１００ＧＨｚ）の高周波信号を入力し、他方の測定用端子部２０から高周波信号を取り出したときの入力リターンロス及び通過ロスを測定した。 Therefore, according to thetransmission line substrates 2 and 4 of the present embodiment, the transmission line substrate optimal for measuring the characteristics of the high-frequency components by preventing the transmission characteristics of the high-frequency signal from deteriorating at the measurement terminal portion 20 is prevented. Can be realized.
(Experimental result 1)
Next, in order to support the effect of thedifference 1, the calibration transmission line substrate 4 of the present embodiment in which the measurement terminal portion 20 is configured as shown in FIG. 2A and the measurement terminal portion 20 are also shown in FIG. 2B. And a conventional calibration transmission line substrate 11 configured as shown in the figure, connecting a measurement device to the measurement terminal portions 20 at both ends via the coplanar probe 50, and from one measurement terminal portion 20 to the millimeter wave band. A high frequency signal (55 GHz to 100 GHz) was input, and an input return loss and a passage loss were measured when the high frequency signal was extracted from the other measurement terminal unit 20.
（実験結果１）
次に、この相違点１による効果を裏付けるために、測定用端子部２０を図２Ａに示すように構成した本実施形態の校正用伝送線路基板４と、同じく測定用端子部２０を図２Ｂに示すように構成した従来の校正用伝送線路基板１１とを使用し、両端の測定用端子部２０へコプレーナプローブ５０を介して測定装置を接続して、一方の測定用端子部２０からミリ波帯（５５ＧＨｚ～１００ＧＨｚ）の高周波信号を入力し、他方の測定用端子部２０から高周波信号を取り出したときの入力リターンロス及び通過ロスを測定した。 Therefore, according to the
(Experimental result 1)
Next, in order to support the effect of the
その測定結果を、図３Ａ－３Ｂに示す。なお、この測定に用いた誘電体基板１４の厚みは、５０μｍであり、その表裏面の信号導体線１６、グランド導体２２、グランド層１２の厚みは、３．３μｍである。
The measurement results are shown in FIGS. 3A-3B. The thickness of the dielectric substrate 14 used in this measurement is 50 μm, and the thickness of the signal conductor wire 16, the ground conductor 22, and the ground layer 12 on the front and rear surfaces thereof is 3.3 μm.
そして、この測定結果から、測定用端子部２０における信号導体線１６の軸方向先端部分を、従来のようにグランド導体２２の端部位置に合わせるのではなく、本実施形態のように導電性スルーホール２４同士を接続する線分位置に合わせるようにすれば、測定用端子部２０での高周波信号の反射を抑え、且つ、マイクロストリップ線路での高周波信号の通過ロスを抑えて、高周波信号の良好な伝送特性が得られる伝送線路基板を実現できることが判る。
Then, from this measurement result, instead of aligning the end portion of the signal conductor wire 16 in the measurement terminal portion 20 in the axial direction with the end position of the ground conductor 22 as in the prior art, the conductive through-hole as in this embodiment is used. If the holes 24 are aligned with the line segment position where the holes 24 are connected to each other, the reflection of the high-frequency signal at the measurement terminal portion 20 is suppressed, and the passage loss of the high-frequency signal at the microstrip line is suppressed. It can be seen that a transmission line substrate capable of obtaining excellent transmission characteristics can be realized.
なお、図２Ａに示すように、この実験例では、信号導体線１６の幅、及び、信号導体線１６とグランド導体２２との間隔を、５０μｍとし、グランド導体２２を１辺が４００μｍの正方形とし、このグランド導体２２と同軸上に、直径２００μｍの導電性スルーホール２４を形成した測定用端子部２０を有する伝送線路基板４、１１を使用したが、これら各部の寸法等は用途に合わせて適宜設定すればよく、本実施形態の伝送線路基板２、４は、図２Ａに示すものに限定されるものではない。
As shown in FIG. 2A, in this experimental example, the width of the signal conductor line 16 and the interval between the signal conductor line 16 and the ground conductor 22 are 50 μm, and the ground conductor 22 is a square having a side of 400 μm. The transmission line substrates 4 and 11 having the measurement terminal portion 20 in which the conductive through-hole 24 having a diameter of 200 μm is formed on the same axis as the ground conductor 22 are used. What is necessary is just to set, and the transmission line board | substrates 2 and 4 of this embodiment are not limited to what is shown to FIG. 2A.
また、図２Ａにおいて、本実施形態の測定用端子部２０では、信号導体線１６の軸方向先端部分を、導電性スルーホール２４の中心同士を接続する線分よりも２５μｍだけ外側に延ばしているが、これは、測定時にコプレーナプローブ５０の電極を押し当てた際の滑りを考慮してのことであり、信号導体線１６の軸方向先端部分は、導電性スルーホール２４の中心同士を接続する線分との交点位置に一致させてもよく、或いは、導電性スルーホール２４の径の分だけ、更に外側に延ばしてもよい。
（相違点２による効果）
本実施形態の測定用の伝送線路基板２においては、マイクロストリップ線路を構成する信号導体線１６の測定用端子部２０とは反対側端部に、オープンスタブ１８等からなる整合回路２８が形成されていることから、その端部にワイヤボンディング３４等によって高周波部品４０を接続したときに生じる伝送インピーダンスの不整合を防止し、その接続点で高周波信号の伝送特性が劣化するのを防止できる。よって、本実施形態の伝送線路基板２を使用すれば、高周波部品４０の特性を高精度に測定できる。
（相違点３による効果）
本実施形態の測定装置を構成する基台３０においては、一対の伝送線路基板２の間に形成される載置部３２の底面が、高周波部品４０を載置した際に高周波部品４０の基台３０からの高さと、伝送線路基板２の基台３０からの高さとが一致するように（換言すればこれら各部４０、２の基台３０とは反対側の面が略同一平面となるように）、載置部３２周囲の基台表面よりも低くなっていることから、高周波部品４０とその両側の伝送線路基板２とを接続するのに用いられるワイヤ等の導電性部材の伝送線路基板２からの高さを低くし、その長さを短くすることができる。 In FIG. 2A, in themeasurement terminal portion 20 of the present embodiment, the tip end portion in the axial direction of the signal conductor wire 16 extends outward by 25 μm from the line segment connecting the centers of the conductive through holes 24. However, this is due to consideration of slipping when the electrodes of the coplanar probe 50 are pressed during measurement, and the axial end portions of the signal conductor wires 16 connect the centers of the conductive through holes 24 to each other. You may make it correspond to the intersection point position with a line segment, or you may extend further to the outside by the diameter of the conductive through hole 24.
(Effects of difference 2)
In the measurementtransmission line substrate 2 of the present embodiment, a matching circuit 28 made of an open stub 18 or the like is formed at the end opposite to the measurement terminal portion 20 of the signal conductor line 16 constituting the microstrip line. Therefore, it is possible to prevent mismatch in transmission impedance that occurs when the high-frequency component 40 is connected to the end portion thereof by wire bonding 34 or the like, and to prevent the transmission characteristics of the high-frequency signal from deteriorating at the connection point. Therefore, if the transmission line substrate 2 of this embodiment is used, the characteristic of the high frequency component 40 can be measured with high accuracy.
(Effects of difference 3)
In the base 30 constituting the measuring apparatus of the present embodiment, the bottom surface of the mountingportion 32 formed between the pair of transmission line substrates 2 is the base of the high frequency component 40 when the high frequency component 40 is mounted. 30 so that the height from the base 30 of the transmission line substrate 2 coincides (in other words, the surface opposite to the base 30 of these parts 40 and 2 is substantially the same plane. ) Since the height is lower than the base surface around the mounting portion 32, the transmission line substrate 2 of a conductive member such as a wire used to connect the high-frequency component 40 and the transmission line substrate 2 on both sides thereof. The height from can be lowered and the length can be shortened.
（相違点２による効果）
本実施形態の測定用の伝送線路基板２においては、マイクロストリップ線路を構成する信号導体線１６の測定用端子部２０とは反対側端部に、オープンスタブ１８等からなる整合回路２８が形成されていることから、その端部にワイヤボンディング３４等によって高周波部品４０を接続したときに生じる伝送インピーダンスの不整合を防止し、その接続点で高周波信号の伝送特性が劣化するのを防止できる。よって、本実施形態の伝送線路基板２を使用すれば、高周波部品４０の特性を高精度に測定できる。
（相違点３による効果）
本実施形態の測定装置を構成する基台３０においては、一対の伝送線路基板２の間に形成される載置部３２の底面が、高周波部品４０を載置した際に高周波部品４０の基台３０からの高さと、伝送線路基板２の基台３０からの高さとが一致するように（換言すればこれら各部４０、２の基台３０とは反対側の面が略同一平面となるように）、載置部３２周囲の基台表面よりも低くなっていることから、高周波部品４０とその両側の伝送線路基板２とを接続するのに用いられるワイヤ等の導電性部材の伝送線路基板２からの高さを低くし、その長さを短くすることができる。 In FIG. 2A, in the
(Effects of difference 2)
In the measurement
(Effects of difference 3)
In the base 30 constituting the measuring apparatus of the present embodiment, the bottom surface of the mounting
このため、本実施形態の測定装置によれば、高周波部品４０と伝送線路基板２との接続部で生じる高周波信号の伝送特性の劣化を抑えて、高周波部品４０の特性の測定精度を向上できる。
（実験結果２）
次に、この相違点３による効果を裏付けるために、図４Ａに示すように構成した本実施形態の測定用伝送線路基板２を、表面が平坦な基台３０に積層して、基台３０に別途積層された高周波部品４０とワイヤボンディング３４で接続し、図４Ｂに示すように、そのワイヤボンディング３４によるワイヤの伝送線路基板２表面からの高さＨを、８０μｍ、１１５μｍ、１５０μｍと変化させて、その接続部でのミリ波帯（６０ＧＨｚ～９０ＧＨｚ）の高周波信号の入力リターンロス及び通過ロスを測定した。 For this reason, according to the measuring apparatus of the present embodiment, it is possible to suppress the deterioration of the transmission characteristics of the high-frequency signal generated at the connection portion between the high-frequency component 40 and the transmission line substrate 2 and improve the measurement accuracy of the characteristics of the high-frequency component 40.
(Experimental result 2)
Next, in order to support the effect of the difference 3, the measurementtransmission line substrate 2 of the present embodiment configured as shown in FIG. 4A is laminated on the base 30 with a flat surface, It connects with the high frequency component 40 laminated | stacked separately by the wire bonding 34, and as shown to FIG. 4B, the height H from the transmission line board | substrate 2 surface of the wire by the wire bonding 34 is changed with 80 micrometers, 115 micrometers, and 150 micrometers. Then, the input return loss and the passage loss of the high frequency signal in the millimeter wave band (60 GHz to 90 GHz) at the connection portion were measured.
（実験結果２）
次に、この相違点３による効果を裏付けるために、図４Ａに示すように構成した本実施形態の測定用伝送線路基板２を、表面が平坦な基台３０に積層して、基台３０に別途積層された高周波部品４０とワイヤボンディング３４で接続し、図４Ｂに示すように、そのワイヤボンディング３４によるワイヤの伝送線路基板２表面からの高さＨを、８０μｍ、１１５μｍ、１５０μｍと変化させて、その接続部でのミリ波帯（６０ＧＨｚ～９０ＧＨｚ）の高周波信号の入力リターンロス及び通過ロスを測定した。 For this reason, according to the measuring apparatus of the present embodiment, it is possible to suppress the deterioration of the transmission characteristics of the high-frequency signal generated at the connection portion between the high-
(Experimental result 2)
Next, in order to support the effect of the difference 3, the measurement
その測定結果を、図５Ａ－５Ｂに示す。
そして、この測定結果から、基台３０上で伝送線路基板２と高周波部品４０とを接続するのに用いられるワイヤ等の導電部材は、伝送線路基板２からの高さＨをできるだけ低くして、その長さを短くするとよいことが判る。 The measurement results are shown in FIGS. 5A-5B.
And from this measurement result, the conductive member such as a wire used for connecting thetransmission line substrate 2 and the high frequency component 40 on the base 30 has a height H from the transmission line substrate 2 as low as possible, It turns out that it is good to shorten the length.
そして、この測定結果から、基台３０上で伝送線路基板２と高周波部品４０とを接続するのに用いられるワイヤ等の導電部材は、伝送線路基板２からの高さＨをできるだけ低くして、その長さを短くするとよいことが判る。 The measurement results are shown in FIGS. 5A-5B.
And from this measurement result, the conductive member such as a wire used for connecting the
そして、このためには、本実施形態のように、高周波部品４０の載置部３２の底面を低くして、載置部３２に載置された高周波部品４０とその両側の伝送線路基板２とに段差ができないようにすればよいことになる。
For this purpose, as in the present embodiment, the bottom surface of the placement part 32 of the high-frequency component 40 is lowered, and the high-frequency component 40 placed on the placement part 32 and the transmission line substrate 2 on both sides thereof are arranged. It is sufficient to prevent the level difference from occurring.
なお、図４Ａから明らかなように、この測定に用いた伝送線路基板２の測定用端子部２０各部の寸法、及び、誘電体基板１４等の厚みは、実験結果１で説明したものと同じであり、整合回路２８のオープンスタブ１８の長さ及び幅は、夫々、５８５μｍ、７８μｍであり、信号導体線１６においてオープンスタブ１８が接続される部分の幅は３２μｍであるが、これら各部の寸法等は用途に合わせて適宜設定すればよく、本実施形態の伝送線路基板２は、図４Ａに示すものに限定されるものではない。
As is clear from FIG. 4A, the dimensions of each part of the measurement terminal portion 20 of the transmission line substrate 2 used in this measurement and the thickness of the dielectric substrate 14 and the like are the same as those described in the experimental result 1. The length and width of the open stub 18 of the matching circuit 28 are 585 μm and 78 μm, respectively, and the width of the portion where the open stub 18 is connected in the signal conductor line 16 is 32 μm. The transmission line substrate 2 of this embodiment is not limited to that shown in FIG. 4A.
以上本発明の一実施形態について説明したが、本発明は上記実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内にて、種々の態様をとることができる。
例えば、上記実施形態では、伝送線路基板２、４に形成される測定用端子部２０において、一対のグランド導体２２は矩形形状であるものとして説明したが、例えば、図６に示すように、４つの角部のうち、信号導体線１６と隣接する角部には、円弧或いは直線で切り欠き部２３を形成するようにしてもよい。 Although one embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and can take various forms without departing from the gist of the present invention.
For example, in the above-described embodiment, the pair ofground conductors 22 have been described as having a rectangular shape in the measurement terminal portion 20 formed on the transmission line substrates 2 and 4. For example, as illustrated in FIG. Of the two corners, a notch 23 may be formed by a circular arc or a straight line at a corner adjacent to the signal conductor line 16.
例えば、上記実施形態では、伝送線路基板２、４に形成される測定用端子部２０において、一対のグランド導体２２は矩形形状であるものとして説明したが、例えば、図６に示すように、４つの角部のうち、信号導体線１６と隣接する角部には、円弧或いは直線で切り欠き部２３を形成するようにしてもよい。 Although one embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and can take various forms without departing from the gist of the present invention.
For example, in the above-described embodiment, the pair of
そして、このようにすれば、グランド導体２２と信号導体線１６との間隔を大きくして、グランド導体２２と信号導体線１６とが高周波的に結合するのを防止することができ、延いては、測定用端子部２０での高周波信号の伝送特性が劣化するのを防止できる。
In this way, the gap between the ground conductor 22 and the signal conductor line 16 can be increased to prevent the ground conductor 22 and the signal conductor line 16 from being coupled at a high frequency. It is possible to prevent the transmission characteristics of the high-frequency signal at the measurement terminal unit 20 from deteriorating.
Claims (6)
- 誘電体基板と、該誘電体基板の表面に形成された信号導体線と、前記誘電体基板の前記信号導体線とは反対側の裏面に形成されたグランド層とからなるマイクロストリップ線路を備えると共に、
前記マイクロストリップ線路の少なくとも一方の端部位置に、
前記信号導体線と、前記誘電体基板の前記信号導体線と同一面上で前記信号導体線を挟むように形成された一対のグランド導体と、前記誘電体基板を貫通して前記一対のグランド導体と前記グランド層とを各々接続する一対の導電性スルーホールとからなる測定用端子部を備え、
該測定用端子部を構成する前記信号導体線と一対のグランド導体とに測定用のコプレーナプローブを押し当て、高周波信号の伝送特性を測定するのに使用される伝送線路基板であって、
前記測定用端子部において、前記信号導体線の軸方向先端は、前記一対の導電性スルーホール同士を接続する線分との交点位置で切断されていることを特徴とする伝送線路基板。 A microstrip line comprising a dielectric substrate, a signal conductor line formed on the surface of the dielectric substrate, and a ground layer formed on the back surface of the dielectric substrate opposite to the signal conductor line; ,
At least one end position of the microstrip line,
The signal conductor line, a pair of ground conductors formed so as to sandwich the signal conductor line on the same plane as the signal conductor line of the dielectric substrate, and the pair of ground conductors penetrating the dielectric substrate And a measurement terminal portion comprising a pair of conductive through holes connecting the ground layer and the ground layer,
A transmission line substrate used to measure a transmission characteristic of a high-frequency signal by pressing a measurement coplanar probe against the signal conductor wire and the pair of ground conductors constituting the measurement terminal portion,
In the measurement terminal section, the axial end of the signal conductor wire is cut at an intersection position with a line segment connecting the pair of conductive through holes. - 前記測定用端子部において、前記一対のグランド導体は、前記一対の導電性スルーホールと略同心の矩形形状であり、前記信号導体線と隣接する角部には、信号導体線との間隔が大きくなるよう切り欠きが形成されていることを特徴とする請求項１に記載の伝送線路基板。 In the measurement terminal portion, the pair of ground conductors has a rectangular shape that is substantially concentric with the pair of conductive through holes, and a corner between the signal conductor line and the signal conductor line has a large interval. The transmission line substrate according to claim 1, wherein a notch is formed so as to become.
- 前記マイクロストリップ線路の両端に、前記測定用端子部を備えたことを特徴とする請求項１又は請求項２に記載の伝送線路基板。 The transmission line substrate according to claim 1 or 2, wherein the measurement terminal portions are provided at both ends of the microstrip line.
- 前記測定用端子部は、前記マイクロストリップ線路の一端側に設けられ、前記マイクロストリップ線路の他端側は、導電部材を介して測定対象物を接続できるように開放されていることを特徴とする請求項１又は請求項２に記載の伝送線路基板。 The measurement terminal portion is provided on one end side of the microstrip line, and the other end side of the microstrip line is open so that a measurement object can be connected via a conductive member. The transmission line substrate according to claim 1 or 2.
- 測定対象物を接続可能に開放された前記マイクロストリップ線路の他端側には、導電部材を介して測定対象物を接続したときの入出力インピーダンスを整合させる整合回路が形成されていることを特徴とする請求項４に記載の伝送線路基板。 A matching circuit is formed on the other end of the microstrip line that is open so that the measurement object can be connected to match the input / output impedance when the measurement object is connected via a conductive member. The transmission line substrate according to claim 4.
- 測定対象物である高周波部品を載置可能な導電性の基台を備えると共に、請求項４又は請求項５に記載の伝送線路基板を一対備え、
前記各伝送線路基板のグランド層が前記基台に接触し、且つ、前記各伝送線路基板に形成されたマイクロストリップ線路の測定用端子部とは反対側端部が、前記基台における前記高周波部品の載置部を挟んで互いに対向するよう、前記各伝送線路基板を前記基台に積層してなる高周波部品の測定装置であって、
前記載置部に載置された高周波部品の前記基台とは反対側面と、前記各伝送線路基板の前記基台とは反対側面とが、略同一平面上となるよう、前記載置部の底面を前記載置部周囲の基台表面よりも低くしたことを特徴とする高周波部品の測定装置。 A conductive base on which a high-frequency component that is a measurement target can be placed, and a pair of transmission line substrates according to claim 4 or 5,
The ground layer of each transmission line substrate is in contact with the base, and the end opposite to the measurement terminal portion of the microstrip line formed on each transmission line substrate is the high-frequency component on the base. A measuring apparatus for high-frequency components formed by laminating each transmission line substrate on the base so as to face each other across the mounting portion of
The side surface opposite to the base of the high-frequency component placed on the mounting portion and the side surface opposite to the base of each transmission line substrate are on substantially the same plane. An apparatus for measuring high-frequency components, characterized in that the bottom surface is lower than the base surface around the mounting portion.
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| JPH03139895A (en) * | 1989-10-25 | 1991-06-14 | Shinko Electric Ind Co Ltd | Board for high-speed electronic component |
| JPH0466582U (en) * | 1990-10-19 | 1992-06-11 | ||
| JP2002368561A (en) * | 2001-06-04 | 2002-12-20 | Hitachi Ltd | Waveguide mmic module |
| JP2003140099A (en) * | 2001-11-01 | 2003-05-14 | Opnext Japan Inc | Optical transmission device |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03139895A (en) * | 1989-10-25 | 1991-06-14 | Shinko Electric Ind Co Ltd | Board for high-speed electronic component |
| JPH0466582U (en) * | 1990-10-19 | 1992-06-11 | ||
| JP2002368561A (en) * | 2001-06-04 | 2002-12-20 | Hitachi Ltd | Waveguide mmic module |
| JP2003140099A (en) * | 2001-11-01 | 2003-05-14 | Opnext Japan Inc | Optical transmission device |
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