JPS5855671Y2 - wiring board - Google Patents
wiring boardInfo
- Publication number
- JPS5855671Y2 JPS5855671Y2 JP15535479U JP15535479U JPS5855671Y2 JP S5855671 Y2 JPS5855671 Y2 JP S5855671Y2 JP 15535479 U JP15535479 U JP 15535479U JP 15535479 U JP15535479 U JP 15535479U JP S5855671 Y2 JPS5855671 Y2 JP S5855671Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductive plate
- wiring board
- small hole
- insulating material
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
本考案は配線基板に関するものであり、その目的とする
ところは、衝撃力による導電板の破損を防止することに
ある。[Detailed Description of the Invention] The present invention relates to a wiring board, and its purpose is to prevent damage to a conductive plate due to impact force.
従来の配線基板は、電気絶縁材に埋設した平板状の導電
板にトランスのような重量が重い電気部品を接続してお
り、配線基板に衝撃力が加わった際の電気部品の引張り
荷重を導電板で吸収することができず導電板は第６図に
示すように破損するという問題点があった。Conventional wiring boards connect heavy electrical components, such as transformers, to a flat conductive plate embedded in an electrically insulating material, and conduct the tensile load of the electrical components when an impact force is applied to the wiring board. There was a problem that the conductive plate could not be absorbed by the plate and was damaged as shown in FIG.
本考案は上記の問題点に鑑みてなされたものであり、以
下本考案の実施例を示す図面を参照して説明する。The present invention has been devised in view of the above-mentioned problems, and will be described below with reference to the drawings showing embodiments of the present invention.
第１図乃至第３図において、導電板１は導電性の高い金
属製薄板でできており、絞り加工による塑性変形により
凸状の段部２を形成するとともに、該段部２の中央に小
孔３を穿設している。In FIGS. 1 to 3, a conductive plate 1 is made of a thin metal plate with high conductivity, and has a convex step 2 formed by plastic deformation through drawing, and a small portion in the center of the step 2. Hole 3 is bored.
電気絶縁材４は合成樹脂でできており、段部２及び小孔
３を露出した状態に導電板１を埋設している。The electrical insulating material 4 is made of synthetic resin, and the conductive plate 1 is buried with the stepped portion 2 and the small hole 3 exposed.
小孔３にはトランスのような重量が重い電気部品５の端
子６を挿入後半田付けすることにより固定している。A terminal 6 of a heavy electric component 5 such as a transformer is inserted into the small hole 3 and fixed by soldering.
次に動作状態について説明すると、落下等により導電板
１に加えられた衝撃力を第４図に示すように段部２が変
形することにより吸収し、導電板１は破損せず変形だけ
にとどまる。Next, to explain the operating state, the impact force applied to the conductive plate 1 due to a fall, etc. is absorbed by the deformation of the stepped portion 2 as shown in Fig. 4, and the conductive plate 1 remains only deformed without being damaged. .
第５図は本考案の他の実施例を示すものであり、電気絶
縁材４から露出した導電板１に小孔３及び該小孔３の周
囲に該小孔３と同心状の２個の凸状の段部２が凹状の段
部２を介して形成しており、落下等により導電板１に与
えられた衝撃力を吸収しやすくしている。FIG. 5 shows another embodiment of the present invention, in which a small hole 3 is formed in the conductive plate 1 exposed from the electrically insulating material 4, and two holes concentric with the small hole 3 are formed around the small hole 3. A convex step portion 2 is formed with a concave step portion 2 interposed therebetween, making it easier to absorb the impact force applied to the conductive plate 1 due to a fall or the like.
このように、本考案に係る配線基板は、電気絶縁材に導
電板を埋設した配線基板において、導電板の一部を電気
絶縁材から露出するとともに、該露出した導電板に小孔
及び該小孔の周囲に該小孔と略同心状の１個又は複数個
の段部を形成したことを特徴とするものであるから、落
下等により導電板に衝撃力が加わるとその衝撃を段部に
て吸収するために導電板は破損せず段部が変形するだけ
にとどまり電気部品ががたついたり断線したすせず性能
に影響がないという効果がある。As described above, the wiring board according to the present invention is a wiring board in which a conductive plate is embedded in an electrically insulating material, in which a part of the electrically conductive plate is exposed from the electrically insulating material, and a small hole and a small hole are formed in the exposed electrically conductive plate. It is characterized by forming one or more step portions around the hole that are approximately concentric with the small hole, so that when an impact force is applied to the conductive plate due to a fall, etc., the impact is transferred to the step portion. Since the conductive plate absorbs the heat, the conductive plate is not damaged, only the stepped portion is deformed, and the electrical parts are not rattled or disconnected, and the performance is not affected.
図面の第１図乃至第５図は本考案の配線基板の実施例を
示すものであり、第１図は電気部品と配線基板との分解
斜視図、第２図は電気部品を配線基板に接続した断面図
、第３図は第２図の要部拡大図、第４図は落下等による
衝撃力を配線基板に加えた後の断面図、第５図は本考案
の他の実施例における第３図と対応した断面図、第６図
は従来例における第４図と対応した断面図である。
１・・・・・・導電板、２，７・・・・・・段部、３・
・・・・・小孔、４・・・・・・電気絶縁材。Figures 1 to 5 of the drawings show an embodiment of the wiring board of the present invention. Figure 1 is an exploded perspective view of electrical components and the wiring board, and Figure 2 is a diagram showing the connection of the electrical components to the wiring board. 3 is an enlarged view of the main part of FIG. 2, FIG. 4 is a sectional view after applying impact force to the wiring board due to a drop, etc., and FIG. 5 is a cross-sectional view of another embodiment of the present invention. FIG. 6 is a sectional view corresponding to FIG. 3, and FIG. 6 is a sectional view corresponding to FIG. 4 in the conventional example. 1... Conductive plate, 2, 7... Step portion, 3.
...Small hole, 4...Electrical insulation material.
Claims (1)
板の一部を電気絶縁材から露出するとともに、該露出し
た導電板に小孔及び該小孔の周囲に該小孔と略同心状の
１個又は複数個の段部を形成したことを特徴とする配線
基板。In a wiring board in which a conductive plate is embedded in an electrically insulating material, a part of the conductive plate is exposed from the electrically insulating material, and a small hole is formed in the exposed conductive plate and a hole approximately concentric with the small hole is formed around the small hole. A wiring board characterized in that one or more step portions are formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15535479U JPS5855671Y2 (en) | 1979-11-08 | 1979-11-08 | wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15535479U JPS5855671Y2 (en) | 1979-11-08 | 1979-11-08 | wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5678273U JPS5678273U (en) | 1981-06-25 |
| JPS5855671Y2 true JPS5855671Y2 (en) | 1983-12-20 |
Family
ID=29667336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15535479U Expired JPS5855671Y2 (en) | 1979-11-08 | 1979-11-08 | wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5855671Y2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61150396A (en) * | 1984-12-25 | 1986-07-09 | 松下電工株式会社 | Electric wiring board |
| JPH085577Y2 (en) * | 1990-05-17 | 1996-02-14 | アルプス電気株式会社 | Magnetic head |
| JPH08724Y2 (en) * | 1990-11-14 | 1996-01-10 | 北陸電気工業株式会社 | Electronic device |
-
1979
- 1979-11-08 JP JP15535479U patent/JPS5855671Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5678273U (en) | 1981-06-25 |
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