JPH08774Y2 - 放熱板付混成集積回路基板 - Google Patents

放熱板付混成集積回路基板

Info

Publication number
JPH08774Y2
JPH08774Y2 JP7674990U JP7674990U JPH08774Y2 JP H08774 Y2 JPH08774 Y2 JP H08774Y2 JP 7674990 U JP7674990 U JP 7674990U JP 7674990 U JP7674990 U JP 7674990U JP H08774 Y2 JPH08774 Y2 JP H08774Y2
Authority
JP
Japan
Prior art keywords
circuit board
recess
insulating substrate
heat sink
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7674990U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0493191U (enExample
Inventor
孝雄 栄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP7674990U priority Critical patent/JPH08774Y2/ja
Publication of JPH0493191U publication Critical patent/JPH0493191U/ja
Application granted granted Critical
Publication of JPH08774Y2 publication Critical patent/JPH08774Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP7674990U 1990-07-19 1990-07-19 放熱板付混成集積回路基板 Expired - Lifetime JPH08774Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7674990U JPH08774Y2 (ja) 1990-07-19 1990-07-19 放熱板付混成集積回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7674990U JPH08774Y2 (ja) 1990-07-19 1990-07-19 放熱板付混成集積回路基板

Publications (2)

Publication Number Publication Date
JPH0493191U JPH0493191U (enExample) 1992-08-13
JPH08774Y2 true JPH08774Y2 (ja) 1996-01-10

Family

ID=31808618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7674990U Expired - Lifetime JPH08774Y2 (ja) 1990-07-19 1990-07-19 放熱板付混成集積回路基板

Country Status (1)

Country Link
JP (1) JPH08774Y2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4941724B2 (ja) 2004-06-24 2012-05-30 株式会社安川電機 モータ制御装置
JP5631268B2 (ja) * 2011-06-30 2014-11-26 京セラ株式会社 配線基板
JP6146337B2 (ja) * 2014-02-21 2017-06-14 株式会社オートネットワーク技術研究所 回路構成体

Also Published As

Publication number Publication date
JPH0493191U (enExample) 1992-08-13

Similar Documents

Publication Publication Date Title
JP3611548B2 (ja) スイッチング電源とその製造方法
JPH11345921A (ja) プリント基板上に配置された、熱を発生する構成素子のための冷却装置
JP2586098Y2 (ja) 電子部品およびその実装構造
JP2904050B2 (ja) 電子回路ユニット
JPH10303522A (ja) 回路基板
JPH08774Y2 (ja) 放熱板付混成集積回路基板
JP3104749B2 (ja) 回路装置及びその製造方法
JP4510975B2 (ja) 回路基板
JP2734318B2 (ja) 混成集積回路装置の製造方法
JP3232723B2 (ja) 電子回路装置およびその製造方法
JP2612455B2 (ja) 半導体素子搭載用基板
JP2003304039A (ja) 電気回路基板
JPH11195747A (ja) 電子回路モジュール
JPH07307533A (ja) プリント配線基板
JP2778790B2 (ja) 半導体装置の実装構造及び実装方法
JP2019197848A (ja) 回路構成体、及び電気接続箱
JPH114050A (ja) 回路基板
JPH05315778A (ja) ヒートシンクを備えた電子部品搭載用基板
JP2715957B2 (ja) 混成集積回路装置
JP2771567B2 (ja) 混成集積回路
JPS598364Y2 (ja) 電子機器用絶縁ケ−ス
JP3009176U (ja) プリント回路基板
JP2761273B2 (ja) プリント配線板
JPS6142880B2 (enExample)
JPH0543556U (ja) 混成集積回路基板