JPH083015Y2 - 半導体素子の冷却装置 - Google Patents

半導体素子の冷却装置

Info

Publication number
JPH083015Y2
JPH083015Y2 JP1987138768U JP13876887U JPH083015Y2 JP H083015 Y2 JPH083015 Y2 JP H083015Y2 JP 1987138768 U JP1987138768 U JP 1987138768U JP 13876887 U JP13876887 U JP 13876887U JP H083015 Y2 JPH083015 Y2 JP H083015Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
cooling
melting point
point metal
low melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987138768U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6444644U (US20030220297A1-20031127-C00009.png
Inventor
治彦 山本
明彦 藤▲崎▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1987138768U priority Critical patent/JPH083015Y2/ja
Publication of JPS6444644U publication Critical patent/JPS6444644U/ja
Application granted granted Critical
Publication of JPH083015Y2 publication Critical patent/JPH083015Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1987138768U 1987-09-10 1987-09-10 半導体素子の冷却装置 Expired - Lifetime JPH083015Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987138768U JPH083015Y2 (ja) 1987-09-10 1987-09-10 半導体素子の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987138768U JPH083015Y2 (ja) 1987-09-10 1987-09-10 半導体素子の冷却装置

Publications (2)

Publication Number Publication Date
JPS6444644U JPS6444644U (US20030220297A1-20031127-C00009.png) 1989-03-16
JPH083015Y2 true JPH083015Y2 (ja) 1996-01-29

Family

ID=31401415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987138768U Expired - Lifetime JPH083015Y2 (ja) 1987-09-10 1987-09-10 半導体素子の冷却装置

Country Status (1)

Country Link
JP (1) JPH083015Y2 (US20030220297A1-20031127-C00009.png)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018554U (ja) * 1983-07-15 1985-02-07 株式会社日立製作所 半導体冷却装置
JPH0673364B2 (ja) * 1983-10-28 1994-09-14 株式会社日立製作所 集積回路チップ冷却装置

Also Published As

Publication number Publication date
JPS6444644U (US20030220297A1-20031127-C00009.png) 1989-03-16

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