JPH08107095A - Processing device, cleaning processing device and image processing device thereof - Google Patents

Abstract

PURPOSE: To minimize an input error even by an operator who does not have any skill by displaying a parameter in accordance with the vicinity of the individual information of a graphical processing recipe and performing the setting/ changing of the parameter on the screen. CONSTITUTION: The information relating to a primary washing tank is graphically represented along a processing flow. The information relating to the primary washing tank is displayed in time sequence by expressing the information relating to respective items of processings as a time chart and a numeral with a circle; the processing flow of supplying pure water into a processing tank from a pure water supply port is represented by <pure water supply> processing, the processing of performing drainage from a drain valve <drainage> processing and the processing of performing water spray from a watering pipe <water spray> processing. The parameter of the information, in this case, processing time is displayed in the vicinity of the information. An operator understands the processings only by following the displayed time sequence to perform the setting/correction of the processing recipe.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for cleaning an object to be processed such as a semiconductor wafer, a cleaning processing apparatus and a screen processing method thereof.

[0002]

2. Description of the Related Art A cleaning process in a manufacturing process of a semiconductor device such as an LSI will be described as an example. Conventionally, in order to remove contamination such as particles, organic contaminants and metal impurities on the surface of a semiconductor wafer, Cleaning treatment equipment is used. Among them, the wet type cleaning treatment equipment can remove particles effectively and can perform batch treatment,
Widely used.

In this type of cleaning processing apparatus, a carrier, which stores a predetermined number of semiconductor wafers, for example, 25 semiconductor wafers, is carried into a loader section of the processing apparatus by a transfer robot to perform orientation flat alignment. After that, in the wafer holding unit, the housed semiconductor wafer is taken out of the carrier by the holding tool and placed in a transfer standby state. Then, the semiconductor wafer in the transfer standby state is
A transfer device having a gripping device called a wafer chuck transfers the wafer to a cleaning processing unit where various cleaning processes are performed, and a predetermined cleaning process is performed in the cleaning processing unit.

The cleaning processing section is equipped with SC1 cleaning, SC2 cleaning,
One or more cleaning units for cleaning various chemicals such as HF cleaning and SPM cleaning are sequentially arranged,
Each cleaning unit is composed of a chemical tank for chemical cleaning and a water cleaning tank for pure water cleaning. The processing object transferred to a certain cleaning unit by the transfer device is
First, the chemical solution is washed in the chemical solution tank, and then transferred to a water washing tank disposed downstream of the chemical solution tank. Then, in the water washing tank, the chemical liquid adhering to the surface of the semiconductor wafer is washed away with pure water and then transferred to a cleaning unit using another type of chemical liquid. In this way, the semiconductor wafer that has undergone a series of cleaning processes is finally cleaned with pure water, dried, and carried out of the processing apparatus via the unloader unit.

[0005]

By the way, the cleaning process in the above-mentioned processing apparatus and cleaning processing apparatus is usually preset by an operator in a controller composed of a personal computer, a workstation or the like. , According to the stored processing recipe. The setting or correction of the processing recipe is performed by the operator himself setting or correcting the processing recipe program displayed on the image display device such as the operator display through the input means such as the keyboard. . However, in the conventional device, in order to set or modify the processing recipe program, it has very specialized knowledge and is apt to make an input error, which is a problem. Also, a method of displaying the processing recipes in a table and setting or modifying the processing recipes by filling the table has been proposed, but those tables are merely a list of input items and parameter values and are arranged in time series. Because it is not, it was difficult to understand and it was easy to make a mistake in input.

The present invention has been made in view of the problems of the conventional cleaning processing apparatus and the screen display method thereof, and an object of the present invention is to display on a display screen corresponding to an actual processing flow. , Create processing recipes and /
Or it can be corrected, so that even an operator who does not have a high degree of specialized knowledge can make an input, and it is possible to minimize input errors.
The present invention provides a new and improved cleaning apparatus and its screen display method.

[0007]

In order to solve the above-mentioned problems, according to a first aspect of the present invention, a loader section for loading an object to be processed into the apparatus and an object to be processed are carried out of the apparatus. A plurality of treatment tanks each including an unloader unit for cleaning the object to be treated with a chemical solution, and at least one washing tank for cleaning the object to be purified water with pure water; A dryer for drying a treatment object is a method of displaying an operator screen for controlling a cleaning treatment apparatus which is sequentially arranged between the loader section and the unloader section,
A step of charting information related to each treatment tank in time series along the treatment flow, and on the operator screen, for each treatment tank, displaying the tabulated information,
In the step of displaying the parameters corresponding to the vicinity of each displayed information, in the displayed operator screen,
Setting and / or changing the parameters,
A screen processing method for a cleaning processing apparatus is provided.

In this case, it is possible to set / change the parameter corresponding to the information by pointing the pointer near each of the information arranged in time series. Further, it is possible to display the information about the parameter corresponding to the information by pointing the pointer near the information related to each of the displayed processing tanks. In particular, it is preferable that the processing recipe setting / changing screen is displayed as one screen.

Further, according to a second aspect of the present invention, there is provided a loader section for carrying in the object to be processed into the apparatus, and an unloader section for carrying out the object to be processed outside the apparatus. The loader unit includes a plurality of treatment tanks including at least one or more chemical solution tanks to be washed, one or more water washing tanks to wash the object to be purified with pure water, and a dryer to dry the object to be treated. In the cleaning processing apparatus sequentially arranged between the unloader unit and the unloader unit, according to each processing recipe that is preset and stored, the controller that drives and controls each component of the cleaning processing apparatus, and the processing recipe, A charting means for charting as information related to each treatment tank in time series along the treatment flow, and displaying the charted information on the screen for each treatment tank, and a parameter corresponding to each information The above information And an operator interface means for setting and / or changing the parameters on the displayed operator screen. Provided.

In this case, the operator interface means is configured so that the pointers near the information related to each of the displayed processing tanks can set / change the parameter corresponding to the information. It is possible to Further, the operator interface means can be configured to display the information about the parameter corresponding to the information by pointing the pointer near the information related to each of the displayed processing tanks. In particular, it is preferable that the processing recipe setting / changing screen is displayed as one screen.

According to another aspect of the present invention, a method for displaying an operator screen for controlling a processing apparatus for performing processing including a plurality of steps on an object to be processed is not limited to the cleaning apparatus. Will be provided. That is, the screen processing method includes a step of charting information related to each step in time series along a processing flow, and displaying the charted information for each step on the operator screen. At the same time, it includes a step of displaying a parameter corresponding to the vicinity of each displayed information, and a step of setting and / or changing the parameter on the displayed operator screen.

In this case, it is possible to set / change the parameter corresponding to the information by pointing the pointer near each of the information arranged in time series. It is also possible to display the information related to the parameter corresponding to the information by pointing the pointer near the displayed information related to each process. In particular, it is preferable that the processing recipe setting / changing screen is displayed as one screen.

According to another aspect of the present invention, there is provided a processing apparatus for performing a process including a plurality of steps on an object to be processed, wherein the processing apparatus is configured according to a preset processing recipe of each step. A controller for driving and controlling each component of the processing apparatus, a charting means for charting the processing recipe as information related to each step in time series along the processing flow, and the charted means. A screen display means for displaying information on a screen for each step and displaying a parameter corresponding to each information in the vicinity of the information,
An operator interface means for setting and / or changing the parameters on the displayed operator screen is provided.

Also in this case, the operator interface means can be set / changed by pointing the pointer near the information related to each of the displayed steps so as to set / change the parameter corresponding to the information. It is possible to Further, it is possible to configure the operator interface means so that by pointing a pointer near the information related to each of the displayed steps, the information about the parameter corresponding to the information is displayed. In particular, it is preferable that the processing recipe setting / changing screen is displayed as one screen.

As described above, according to the present invention, the information related to each processing tank, for example, the processing recipe is tabulated in time series along the processing flow, and the tabulated processing recipe is displayed on the operator screen. While being displayed, the parameters corresponding to the individual information of the tabulated processing recipe are displayed, and the parameters can be set / changed on the screen. As a result, even an operator who does not have a high degree of specialized knowledge can easily and minimize input errors by sequentially setting / changing parameters in accordance with the time-series charted information. Since the operation can be performed while suppressing the operation, a user-friendly processing recipe setting / changing environment can be provided.

In operating the operator, a pointer or the like is used to point near each piece of information arranged in time series on the operator's screen by an interface means such as a keyboard or a mouse, thereby setting parameters corresponding to the information. The operability can be improved by configuring such that it can be changed.

Further, at the same time when the pointer is designated, the information about the parameter corresponding to the information is automatically displayed on the screen, so that even an operator who does not have a high degree of specialized knowledge can operate it. Also, it becomes possible to minimize input errors.

Further, when the processing recipe setting / changing screen is displayed on one screen, the processing recipe for the processing tank can be grasped at a glance, so that the operability can be further improved.

Furthermore, the present invention is not limited to the cleaning processing apparatus, but various processing apparatuses for performing processing including a plurality of steps on a processing object such as a semiconductor wafer or LCD substrate, for example, etching processing or film formation. It can also be applied to an operator screen for controlling a multi-chamber processing device that performs multiple processes such as processing, and even in that case, processing by an operator who does not have a high degree of specialized knowledge It is possible to provide a user-friendly interface environment that enables input errors and minimizes input errors.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment in which the present invention is applied to a cleaning processing apparatus will be described in detail below with reference to the accompanying drawings.

First, the overall structure of a cleaning processing apparatus 1 to which the present invention can be applied will be described with reference to FIGS. As shown in FIG. 1, the cleaning apparatus 1 as a whole includes a loader section 100 for accommodating an object to be processed before cleaning, for example, a semiconductor wafer in carrier units, a cleaning section 200 for cleaning the wafer, and a cleaning section. It is composed of three zones, namely, an unloader unit 300 for carrying the processed wafer out of the apparatus in carrier units.

The loader section 100 includes a mounting section 110 for loading and mounting a carrier C containing a predetermined number, for example, 25 unwashed wafers, and a mounted carrier C.
Is mainly composed of a transfer device 120 for transferring the wafer to the holding parts 133 and 135 shown in an enlarged scale in FIG. 2 and a relay part 130 for taking out the wafer from the carrier C and transferring it to the wafer transfer device 140. . This placing part 110
As shown in FIG. 2, a plurality of stations 112a, 112b, ..., 1 each of which has a hollow mounting table 111 and has an opening on the upper surface through which the lower part of the carrier C can be inserted.
12n are arranged in two rows.

Further, the loader section 100 includes a moving mechanism 11
5, the moving mechanism 115 can be freely driven in the vertical and horizontal directions by a driving mechanism (not shown), and the carrier C held by the clamp member 111 is moved to desired stations 112a, 112b, ..., 112n. It is possible to move up to. This moving mechanism 1
15 also includes an aligning device 117 for aligning the orientation flats of the wafers W stored in the carrier C, so that the orientation flats of the wafers W stored in the carrier C can be aligned.

Further, as shown in FIG. 2, the transfer device 120 is provided behind the loader unit 100. The transfer device 120 includes a pair of arms 121 a and 121 b configured to be movable toward and away from each other and the arms 1 a and 121 b.
21a and 121b are horizontally directed, a Z base 123 for moving the lifter in the vertical direction (Z direction), and the Z base 123 itself is moved in the longitudinal direction (X direction) of the cleaning processing apparatus. And an X base 124 for moving the arms 121a, 1
21b with the upper side edges of the carrier C placed on the arms 121a, 121b.
It is configured so that it can be pinched and transferred to the relay section 140 shown in FIG.

The relay unit 130, as shown in FIG.
The holding unit 1 fixed on the top plate 132 via the columns 131
33, and a holding portion 135 supported by a movable column 134 that is movable in the Y direction with respect to the top plate 132, respectively, connected in the Y direction. Each of these holding portions 13
Reference numerals 3 and 135 have a shape that allows them to pass through the lower opening of the carrier C. Further, a part of the peripheral edge of the wafer W is inserted into the upper surfaces of the holding portions 133 and 135, respectively, and they are erected substantially vertically. As described above, a predetermined number of arcuate holding grooves 136 are formed, for example, 25 corresponding to the number of wafers of the carrier C stored. On the top plate 132 near the bases of the support column 131 and the moving column 134, locking members 137 for locking the corners of the lower end of the carrier C are provided at four locations. There is.

Then, the wafer transfer device 140 for holding the wafers W held by the holding parts 133 and 135 all together and transferring the wafers W to the cleaning processing part 200.
Are configured as shown in FIG. That is, the wafer transfer device 140 includes, for example, a pair of left and right gripping members 141a and 141 for collectively gripping 50 wafers.
The wafer chuck 142 configured by b, the support body 143 that supports the wafer chuck 142, and the support body 143 are moved up and down in the vertical direction (Z direction).
A drive mechanism 144 that moves in the front-back direction (Y direction),
This drive mechanism 144 is connected to the longitudinal direction (X
And a transfer base 145 (see FIG. 2) for moving along the direction.

The gripping members 141a and 141b in the wafer chuck 142 are bilaterally symmetrical.
The rotation shafts 146a and 146b are rotatably supported by the support body 143, and can be opened and closed.
Further, the upper ends of the aluminum gripping members 141a and 141b are fixed to the rotating shafts 146a and 146b, and between the lower ends of the gripping members 141a and 141b, upper and lower quartz grips are provided. Bars 147a, 147b, 1
48a and 148b are passed in parallel. On the surface of each of the gripping rods 147a, 147b, 148a, 148b,
For example, 50 holding grooves 149 into which the peripheral portion of the wafer W is inserted are formed. Then, each gripping member 141a,
By rotating the rotary shafts 146a and 146b, the 141b has gripping bars 147a, 147b, 148a,
The wafer W is gripped at 148b and can be transferred to a desired position in the vertical direction (Z direction) and the longitudinal direction (X direction).

The transporting device 140 includes cleaning units 201a, 201b, ..., 201n, which will be described later.
Is installed corresponding to the above, and by moving the transfer base 145, a lot consisting of a predetermined number of wafers can be transferred.
For example, the wafer transfer device 140a may be used to load the loader unit 100.
And the primary cleaning unit 201a of the cleaning processing unit 200
, Between the primary cleaning unit 201a and the secondary cleaning unit 201b, or between the primary cleaning unit and the secondary cleaning unit by the wafer transfer device 140b, or by the wafer transfer device 140n, the (n-1) th cleaning unit 201n and the n-th order cleaning unit Wafers can be transferred in lot units between the cleaning tanks 140n and between the nth cleaning unit 201n and the unloader unit 300. Then, via a secondary washing tank (interface tank) 204 described later,
Wafers are transferred between the adjacent cleaning units 140, and a predetermined chemical solution tank 202 or water cleaning tank 2 is used.
Wafer auxiliary jig 21 to be described later, which is provided in 04 and 205.
2 (see FIG. 4) so that the wafer can be transferred.

Next, the cleaning processing unit 200 will be described. In the cleaning processing unit 200, as shown in FIG. 1, a plurality of cleaning units 201a, 201b, ..., 201n are sequentially arranged from a primary cleaning unit to an n-th cleaning unit. Is configured. Each cleaning unit 201 is composed of, for example, a chemical solution tank 202, a primary water cleaning tank 203, and a secondary water cleaning tank 204. After chemical solution cleaning in the chemical solution tank 202, pure water is applied to the wafer W in the primary water cleaning tank 203 and the secondary water cleaning tank 204. After cleaning the attached chemical liquid, the wafer transfer device 140 described above can transfer the chemical liquid to a cleaning unit further downstream. Further, at the most downstream side of the cleaning processing section 200, a final water washing tank 205 for performing final cleaning with pure water and a drying processing tank 206 for vapor-drying the cleaned wafer with, for example, IPA (isopropyl alcohol). Are sequentially arranged so that a series of cleaning processes can be performed.

In each chemical solution tank 201, a predetermined chemical solution is introduced and a chemical solution cleaning process is performed in accordance with the type of contamination adhering to the wafer surface, such as organic impurities and metal impurities. For example, so-called SC1 cleaning can be performed with a mixed solution of ammonia water and hydrogen peroxide water with respect to organic matter contamination. In addition, the so-called H
It is possible to remove the natural oxide film and metal impurities by F cleaning. Further, by performing so-called SC2 cleaning with a mixed solution of hydrochloric acid and hydrogen peroxide, it is possible to grow a clean natural oxide film while removing metal impurities attached to bare silicon. And a typical cleaning method based on hydrogen peroxide, so-called RC
Speaking of A cleaning, SC1 cleaning → HF cleaning → SC2
It is possible to wash the wafer by sequentially performing the washing by the corresponding washing unit.

Next, referring to FIGS. 4 to 6, the structure of a typical processing tank that can be used in the cleaning processing apparatus constructed according to the present invention will be described by taking the chemical solution tank 210 as an example. . The basic structures of other types of chemical liquid tanks and washing tanks are substantially the same as those of the chemical liquid tanks described here, and thus detailed description thereof will be omitted.

As shown in the figure, the processing bath 210 includes a box-shaped processing bath 211 for containing a chemical solution, and a wafer holder 212 arranged in the processing bath 211 for vertically holding, for example, 50 wafers W. Is equipped with. Furthermore, the processing tank 211
The chemical solution supply port 214 is opened at the bottom portion 213 of the
The chemical liquid introduced into the tank through the supply port 214 is evenly distributed around the wafer W without generating turbulent flow through the rectifying means 220 interposed between the holder 212 and the bottom portion 213. Supplied.

That is, the rectifying means 220 is provided with the rectifying plate 221 arranged so as to divide the processing bath 211 into upper and lower parts.
And a diffusion plate 222 disposed above the supply port 214. This rectifying plate 221 has a large number of small holes 2
23 is provided, and the chemical liquid introduced from the supply port 214 first collides with the back surface of the diffusion plate 222, and the diffusion plate 2
Diffused from the peripheral edge of 22 to the entire back surface of the straightening plate 221
After that, it passes through the small holes 223 of the straightening plate 221 and is supplied to the periphery of the wafer W held by the wafer holder 212, so that the wafer W is wrapped at a uniform flow rate without causing turbulent flow, and the entire wafer W is covered. It is configured so that the chemical solution can be evenly cleaned evenly.

Further, the processing bath 210 receives the inner bath 215 in which the wafer holder 212 is housed and the wafer W can be immersed in the processing liquid, and the processing bath overflowing from the upper end of the inner bath 215. A chemical solution circulation path 218 is connected between the supply port 214 provided at the bottom 213 of the inner tank 215 and the discharge port 217 provided at the bottom of the outer tank 216. It
A circulating pump P, a filter F, and a drainage valve V are provided in the chemical liquid circulation path 218, and the outer tank 21 is provided.
The chemical liquid overflowing from No. 6 is cleaned and circulated and supplied to the inner tank 215 again, and the drain valve V can be opened to drain the liquid if necessary. Further, a chemical liquid supply line 219 is connected to the chemical liquid circulation pump P, and a new chemical liquid can be supplied to the processing tank 210 as needed.

Further, an openable lid 240 is inserted in the upper opening of the processing bath 210.
By closing 0, it is possible to prevent vaporization and diffusion of the processing liquid during processing, and also to prevent contaminants and dust from mixing into the processing tank 210 from the outside. As shown in FIGS. 5 and 6, the lid 240 is fixed to a pair of fixed open / close arms 242 projecting from two rotary shafts 241 pivotally mounted on the side wall of the processing bath 210. It is composed of a lid body 243, and the pair of lid bodies 243 can be opened and closed by rotating the rotary shaft 241 with a predetermined time delay by a drive motor (not shown).

The cleaning processing section 200 is configured as described above, and further downstream of the cleaning processing section 200, the unloader section for carrying out the wafer W returned to the carrier C after completion of the cleaning processing to the outside of the apparatus. Although the unloader unit 300 is provided, the unloader unit 300 has the same basic configuration as the loader unit 100, and the processed wafer W is carried out of the apparatus by reversing the steps performed in the loader unit 100. It is possible to Therefore, detailed description is omitted here.

The cleaning processing apparatus 1 to which this embodiment is applied is
A series of operations for cleaning a certain lot, which is configured as described above, will be described. First, the carriers C1 and C2, which store 25 unprocessed wafers W each, are placed on the loading position of the station 112 of the placing unit 110 of the loader unit 100 by a transfer robot (not shown).

Then, the carrier C is moved by the moving mechanism 115.
While sequentially clamping C1 and C2 and aligning the orientation flat,
The station 112 is sequentially moved to the transfer position. The transfer device 12 is placed at the transfer position.
The arms 121a and 121b of the carrier C1 and C
The Z base 123 is moved in the X direction to the relay section 130 while holding the two at the same time, and the holding section 13 of the relay section 130 is held.
3, 135 is moved upward in the Z direction, and carriers C1 and C
The wafer W in 2 is transferred onto the holders 133 and 135.
After that, the transferred wafers W are aligned by the orientation flat aligning unit provided with the aligning device 116, and a predetermined number of wafers W, for example, a row of wafers W, is set as one lot, and the subsequent cleaning process is awaited.

Subsequently, the primary wafer transfer device 1 shown in FIG.
40a moves to the relay unit 130, holds the wafers W aligned by the wafer chuck 142 shown in FIG. 3 in lot units, and conveys them to the SC1 cleaning tank 202a of the primary cleaning unit 201a. Processing tank 21 shown in
The treatment liquid in 0 is placed on a holding unit 212 provided in advance in lot units. Then, after introducing a predetermined chemical solution into the processing bath 210 and performing a predetermined SC1 cleaning on the wafer W, the wafer W is taken out again by the wafer chuck 142 and transferred to the primary water washing bath 203a, where It is transferred to the holding part 212 provided in the cleaning tank 203, and primary cleaning with pure water is performed. Then, by the same method, the wafer W after cleaning with pure water is sent to the secondary water cleaning tank 204a (FIG. 1), and secondary cleaning with pure water is performed to completely clean the chemical liquid adhering to the wafer W. The secondary rinsing tank 204 is also called an interface tank, and is located between adjacent cleaning units where cleaning is performed with another type of chemical solution, and has a function as a buffer for preventing mixing of both chemical solutions. According to the embodiment shown in the drawings, the wafer W that has undergone SC1 cleaning in the chemical solution tank 201a has undergone the primary water rinsing and then the subsequent secondary cleaning in the secondary water rinsing tank 204a which is the interface tank. Wait for HF cleaning in the unit 201b.

Then, the wafer W is taken out from the secondary water washing tank 203a of the primary cleaning unit 201b by the secondary wafer transfer device 140b which is in charge of the secondary cleaning unit 201b, and the HF of the secondary cleaning unit 201b for HF cleaning is taken out.
It is transported to the chemical liquid tank 202b. After the predetermined chemical solution treatment, primary cleaning is performed in the primary water washing tank 203b, and further, in the secondary water washing tank 204b which is the interface tank, the emptying of the cleaning process of the subsequent process is waited. Hereinafter, similar steps are repeated to perform SC2 cleaning and other necessary cleaning processing. Next, the wafer W is sent to the final washing tank 205 by the n-th wafer transfer device 140n, where it is subjected to the final washing treatment with pure water, and then to the drying treatment tank 206, where it is subjected to vapor drying treatment with IPA. After that, it is carried out of the apparatus via the unloader unit 300.

The above is the flow of the cleaning processing for a certain lot by the cleaning processing apparatus 1 to which the present invention can be applied. In general, the processing flow as described above is performed by the controller 26.
It is performed according to the processing recipe preset and input to 0.
As shown in FIG. 1, the controller 260 includes an operator screen 261 and input means 2 such as a keyboard and a mouse.
It is composed of a personal computer or a workstation equipped with 62, and the operator operates the cleaning device in the manual mode or the automatic mode by inputting a predetermined command according to the operation screen as shown below. It is possible.

FIG. 7 shows a main menu screen displayed when the controller 260 is powered on. As shown, by selecting a desired process in the main menu and inputting its number, it is possible to execute a hierarchical control flow as shown in FIGS. 8 to 10.

As shown in FIG. 8, the operator screen shown in the main menu is divided into a general operator menu and an engineer menu, and is composed of a recipe creation menu, a maintenance menu, and a service menu. The engineer's menu, which is protected by a password, is constructed so that a general operator who does not have knowledge of the device cannot inadvertently access it.

As shown in FIGS. 7 and 9, the general operator menu includes a wafer flow start menu, an apparatus information menu, a standby processing menu, a mainizing menu, a processing end menu, and a payout processing menu. It is mainly composed.

When a general cleaning process is executed, first, as shown in FIG. 11, a mainizing menu is selected to confirm whether or not a wafer is present in the apparatus. After confirmation, the apparatus is transferred. System, for example, loader unit 10
The transfer device 120 of 0, the transfer device 140 of each cleaning unit 201, and the like are returned to the initial positions so that a new lot can be accepted.

Then, as shown in FIG. 12, a standby menu is selected, and based on a table as shown in FIG. 13, a predetermined chemical solution or pure water is injected / exchanged into each processing tank, and a predetermined temperature is set. The temperature of the washing machine is set to standby so that the treatment can be started at any time.

As described above, in the present embodiment, it is possible to select the wafer flow start menu as shown in FIG. 14 for the first time by executing the mainizing process and the standby process. In the present embodiment, the wafer flow start menu is identified by identifying whether or not the mainizing process and the standby process have been executed by the “*” mark, and deleting the “*” mark by executing each process. Is configured to accept input regarding. In this way, select the wafer flow start menu,
After confirming the lot ID of the wafer and each processing recipe on the screen shown in FIG. 15, by pressing the lot start key, the general cleaning processing as described above is started in the auto mode, and a series of cleaning is performed. After the process is finished
The processed lot is automatically carried out of the unloader unit 300 by the transfer robot.

Then, when the series of processing is completed,
In FIG. 16, the treatment end menu is selected and, if necessary, the chemical treatment liquid or pure water in each treatment tank is subjected to waste liquid / drainage treatment, and then the cleaning treatment device is stopped.

Of the general operator menu,
The device information menu shown in FIG. 17 is a screen for displaying and confirming information on each device constituting the cleaning device such as a chemical liquid tank and a water washing tank, a processing recipe, and lot information on the screen for confirmation. Further, the payout processing menu shown in FIG. 18 is a menu required when a trouble occurs in any one of the processing tanks of the apparatus during the processing.
According to the screen as shown in FIG. 9, the wafer is forcibly discharged from the treatment tank in which the trouble has occurred to the downstream washing tank, and if necessary, is forcibly carried out of the apparatus after the final cleaning and / or drying processing. It is for issuing orders.

As described above, in order to display the recipe creation screen as shown in FIGS. 7 to 10, it is necessary to enter the password, and the engineer who knows the password, that is, the recipe creation / correction. Only those with the knowledge that can do the wafer flow recipe menu,
It is possible to display a device parameter menu, a fixed parameter menu, and a tank parameter menu. About the contents included in these menus, unnecessarily,
Or because it is not preferable to change it carelessly,
In some cases, as shown in FIG. 10, it is possible to set a password for each menu and protect the contents.

The wafer flow recipe menu is a menu for creating a processing flow necessary for performing processing by the wafer flow start menu in the above general operator menu, that is, a file for recording a processing recipe, and FIG. As shown in FIG.
It is possible to manage individual files.

Then, on the screen shown in FIG. 20, by designating a certain file and selecting "1. New creation, edit", a table showing a list of processes corresponding to each processing unit as shown in FIG. Can be displayed. Then, if the processing conditions are set in advance in each parameter menu to be described later and detailed instructions according to the processing recipe are not necessary, the table is displayed by simply inputting the processing time on the screen shown in FIG. When completed and detailed instructions according to the processing recipe are required, the processing recipe number is input and the table is completed.

If it is necessary to create / correct a processing recipe for each processing unit, the "recipe edit" key is pressed to display a list of registered processing recipes as shown in FIG. By selecting the processing recipe to be corrected, it is possible to display the recipe edit screen as shown in FIG. In the following description, a recipe editing screen processing method configured according to the present invention will be described, taking recipe editing for a primary cleaning tank with pure water as an example.

As shown in the figure, on this screen, the information related to this primary washing tank is tabulated along the processing flow. In the example shown in FIG. 23, the information relating to this primary water washing tank indicates the processing flow for supplying pure water into the processing tank 211 from the pure water supply port 214 as shown in FIGS. > Information regarding each item of <treatment>, drainage from the drainage valve V <drainage> treatment, and sprinkling from the sprinkling pipe 230 <sprinkling> treatment is shown in timing chart and circled numbers in chronological order. . Then, a parameter related to the information, in this case, the processing time is displayed near the information.

That is, in the illustrated example, pure water is supplied into the tank for 30 seconds, the wafer is loaded, and pure water is supplied for another 60 seconds.
After 0 seconds, the cleaning cycle was started, pure water was supplied while water was sprayed again, and the water was stopped 30 seconds after the water was sprayed. A very complicated process of performing the cleaning cycle, which is completed by sprinkling water three times, and then carrying out the wafer and then draining the water, is a very complicated process that is visualized at a glance. It is possible to grasp.
As a result, even an operator who does not have a high degree of specialized knowledge can understand the process simply by following the displayed time series, and easily set / correct the process recipe. You can Further, since it is possible to visually grasp at a glance, it is possible to set / correct the processing recipe while minimizing an input error.

Further, according to the present invention, by bringing the cursor to the vicinity of each piece of information arranged in time series, that is, the portion of the circled number "1" in the illustrated example, the processing time relating to that information can be obtained. Since the parameters can be set / changed, the processing can be easily performed and the operability is good. Then, in that case, information indicating that parameter, that is, in the illustrated example, the parameter currently being changed is “preparation time for pure water supply” is displayed.
Even an operator who does not have a high level of knowledge can perform editing work while checking, and input errors can be minimized. Further, in the illustrated example, all of the above processing recipes are displayed as one screen, so that it is easy to visually grasp at a glance, and the operability is further improved.

As described above, the processing recipe edited on the screens time-series based on the present invention is
A desired cleaning process can be executed by selecting the wafer flow start menu on the general operator screen described above.

Returning to FIGS. 7 to 10 again, the recipe creation menu will be described. In the apparatus parameter menu, parameters such as the temperature of each processing tank, the temperature of the pure water tank, and the warning temperature at which an alarm is issued are set. Is possible. Further, in the fixed parameter menu, it is possible to set parameters such as liquid exchange in each tank, tank cleaning conditions, and overflow time. In the tank parameter menu, it is possible to set parameters such as waste liquid conditions and supply conditions for each processing tank. in this way,
Optimal cleaning processing is performed based on the parameters set in these parameter menus and the processing recipe set in the wafer flow recipe menu described above.

Next, the maintenance menu shown in FIGS. 7 to 10 will be explained. This menu includes a teaching control menu, a sensor status menu, and
It consists of an alarm logging menu. Among these, in the teaching control menu, the transport device 14
0, loader unit 100, unloader unit 300, transfer device 1
It is a screen for adjusting the position of the transport system such as 20
Displayed when fine-tuning is required regarding the initial position and operation of the device. The sensor status menu is a screen necessary for displaying the state of the sensor installed in each part of the cleaning processing apparatus and adjusting the state of the sensor if necessary. In the cleaning apparatus according to the present embodiment, the time, code,
Information such as status is recorded, and the information can be displayed in the alarm logging menu and is referred to during maintenance.

Next, the service menu shown in FIGS. 7 to 10 will be described. This menu is composed of a steady screen setting menu, a password setting menu, and a time setting menu. The cleaning apparatus according to the present embodiment has a function of automatically displaying the specified screen when the key operation is not performed for a certain period of time. In this stationary screen setting menu, items to be displayed on the stationary screen are displayed. It is possible to set the time required for switching and the like. Also, as already explained, the engineer menu screen and recipe creation screen are protected by passwords from careless operators, but if these passwords need to be changed, they can be changed on this password setting menu screen. It is possible to work. Further, the system is provided with a time setting menu screen, and the time of the clock built in the device can be changed if necessary.

As described above, the cleaning processing apparatus 1 is
The operator can drive in various modes by instructing a predetermined processing flow based on various menus displayed on the operator screen 261 of the controller 260.

In the above embodiments, the cleaning processing apparatus in which the cleaning unit composed of one chemical liquid tank and two water cleaning tanks is combined has been described, but the present invention is not limited to such an example, and, for example, the same type of chemical liquid can be used. The present invention can be applied to a cleaning device that combines various processing tanks, such as a cleaning unit including a plurality of chemical liquid tanks for performing the treatment according to 1.

In the above description, one embodiment of the present invention has been described by taking the cleaning processing apparatus for semiconductor wafers as an example. However, the present invention is not limited to this and, for example, LCD substrates and other parts and members. Of course, it can be applied to a cleaning processing device for cleaning the. Furthermore, the present invention is not limited to the cleaning processing apparatus, and various processing apparatuses for performing processing including a plurality of steps on an object to be processed such as a semiconductor wafer and an LCD substrate, such as etching processing and film forming processing. It is also possible to apply it to the operator's screen for controlling the multi-chamber processing device that performs multiple steps, and even in that case, it enables processing by an operator who does not have high specialized knowledge. Moreover, it is possible to provide a user-friendly interface environment in which input errors can be minimized.

[0064]

As described above, according to the present invention,
Information related to each processing tank of the cleaning processing apparatus, for example, a processing recipe is tabulated in time series along the processing flow,
The tabulated processing recipe is displayed on the operator screen, and the parameters corresponding to the individual information of the tabulated processing recipe are displayed, and the parameters can be set / changed on the screen. . As a result, even an operator who does not have a high degree of specialized knowledge can easily and minimize input errors by sequentially setting / changing parameters in accordance with the time-series charted information. Since the operation can be performed while suppressing the operation, a user-friendly processing recipe setting / changing environment can be provided.

In operating the operator, the interface means such as a keyboard and a mouse is used to set a parameter corresponding to the information by pointing a pointer near each piece of information arranged in time series on the operator screen with a cursor or the like. The operability can be improved by configuring such that it can be changed.

Further, at the same time when the pointer is designated, the information about the parameter corresponding to the information is automatically displayed on the screen, so that even an operator who does not have a high degree of specialized knowledge can operate it. Also, it becomes possible to minimize input errors.

Further, when the processing recipe setting / changing screen is displayed on one screen, the processing recipe for the processing tank can be grasped at a glance, so that the operability can be further improved.

Furthermore, the present invention is not limited to the cleaning processing apparatus, but is more versatile for various processing apparatuses for performing processing including a plurality of steps on an object to be processed such as a semiconductor wafer and an LCD substrate, for example, etching. By applying to the operator screen for controlling the multi-chamber type processing apparatus that performs multiple steps such as processing and film forming processing, processing by an operator without advanced specialized knowledge is possible, It is also possible to provide a user-friendly interface environment that can minimize input errors even in more general situations.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an embodiment of a cleaning processing apparatus configured according to the present invention.

FIG. 2 is an enlarged perspective view showing an example of a loader section of the cleaning processing apparatus shown in FIG.

FIG. 3 is an enlarged perspective view showing an example of a wafer transfer device of the cleaning processing apparatus shown in FIG.

FIG. 4 is a perspective view schematically showing an example of a part of the cleaning processing tank of the cleaning processing apparatus shown in FIG.

5 is a schematic cross-sectional view showing a state of the cleaning treatment tank shown in FIG.

FIG. 6 is a perspective view schematically showing a state in which the lid of the cleaning treatment tank shown in FIG. 4 is closed.

FIG. 7 is an explanatory diagram showing an example of a main menu screen among operator screens adopted according to the present invention.

FIG. 8 is a first hierarchical system diagram showing a hierarchical structure of an operator screen adopted according to the present invention.

FIG. 9 is a second hierarchical system diagram showing a hierarchical structure of an operator screen adopted according to the present invention.

FIG. 10 is a third hierarchical system diagram showing a hierarchical structure of an operator screen adopted according to the present invention.

FIG. 11 is an explanatory diagram showing an example of a main menu specialization menu selection screen of the operator screen adopted according to the present invention.

FIG. 12 is an explanatory diagram showing an example of a standby processing menu selection screen of a main menu among operator screens adopted according to the present invention.

FIG. 13 is an explanatory diagram showing an example of a standby processing menu screen among operator screens adopted based on the present invention.

FIG. 14 is an explanatory diagram showing an example of a wafer flow start menu selection screen of a main menu among operator screens adopted according to the present invention.

FIG. 15 is an explanatory diagram showing an example of a wafer flow start menu screen among operator screens adopted according to the present invention.

FIG. 16 is an explanatory diagram showing an example of a processing end menu selection screen of a main menu among operator screens adopted based on the present invention.

FIG. 17 is an explanatory diagram showing an example of the device information menu selection screen of the main menu among the operator screens adopted according to the present invention.

FIG. 18 is an explanatory view showing an example of a main menu start / stop process menu selection screen of operator screens adopted according to the present invention.

FIG. 19 is an explanatory diagram showing an example of a payout menu screen among operator screens adopted according to the present invention.

FIG. 20 is an explanatory diagram showing an example of a wafer flow recipe screen among operator screens adopted according to the present invention.

FIG. 21 is an explanatory diagram showing an example of a wafer flow edit screen of the operator screens adopted according to the present invention.

FIG. 22 is an explanatory diagram showing an example of a file selection menu selection screen for the primary washing recipe of the main menu among the operator screens adopted according to the present invention.

FIG. 23 is an explanatory diagram showing an example of a primary water washing recipe menu selection screen of the main menu among the operator screens adopted according to the present invention.

[Explanation of symbols]

 1 Cleaning Treatment Device 100 Loader Unit 110 Placement Unit 130 Relay Unit 140 Wafer Transfer Device 200 Cleaning Treatment Unit 201 Cleaning Unit 202 Chemical Solution Tank 203 Primary Water Wash Tank 204 Secondary Water Wash Tank (Interface Tank) 260 Controller 261 Operator's Screen 262 Keyboard 300 Unloader section

Claims (16)

[Claims] 1. A one or more chemical liquid tank for cleaning a target object with a loader section for carrying the target object into the apparatus and an unloader section for carrying the target object out of the apparatus. A plurality of treatment tanks including at least one or more water washing tanks for washing the object to be purified with pure water, and a dryer for drying the object to be treated are sequentially provided between the loader section and the unloader section. A method of displaying an operator screen for controlling an array of cleaning treatment devices, comprising a step of charting information related to each treatment tank in time series along a processing flow, and the operator screen. , A step of displaying the tabulated information for each processing tank and displaying parameters corresponding to the vicinity of each displayed information, and setting and / or setting the parameters on the displayed operator screen. Well Screen processing method of is characterized in that it consists a step of changing, cleaning apparatus. 2. The cleaning according to claim 1, wherein a parameter corresponding to the information can be set / changed by pointing a pointer near each of the pieces of information arranged in time series. Screen processing method of processing device. 3. The information relating to the parameter corresponding to the information is displayed by pointing the pointer near the information related to each of the displayed processing tanks. Screen processing method for cleaning processing equipment. 4. The process recipe setting / changing screen is displayed as one screen.
Alternatively, the screen processing method of the cleaning processing apparatus according to any one of 3 and 4. 5. One or more chemical solution tanks, each of which comprises a loader section for loading the object to be processed into the apparatus, and an unloader section for unloading the object to be processed to the outside of the apparatus A plurality of processing tanks including at least one or two or more water washing tanks for cleaning the object to be purified water, and a dryer for drying the object to be processed are sequentially arranged between the loader section and the unloader section. In the cleaning processing apparatus, the controller for driving and controlling the respective constituent elements of the cleaning processing apparatus according to the preset and stored processing recipes, and the processing recipe, each in time series along the processing flow. A charting means for charting as information relating to the treatment tank, and an operator for displaying the charted information on a screen for each treatment tank and displaying a parameter corresponding to each information in the vicinity of the information. for A flat-panel display unit, the displayed operator screen, characterized in that and a operator interface means for setting and / or changing the parameters, cleaning apparatus. 6. The operator interface means is configured to set / change a parameter corresponding to the information by pointing a pointer near the information related to each of the displayed processing tanks. The cleaning processing apparatus according to claim 5, wherein 7. The operator interface means is configured to display information regarding a parameter corresponding to the information by pointing a pointer near the information related to each of the displayed processing tanks. The cleaning apparatus according to claim 5 or 6, characterized in that. 8. The process recipe setting / changing screen is displayed as one screen.
Or the cleaning processing apparatus according to any one of 7 above. 9. A method of displaying an operator screen for controlling a processing apparatus for performing a process including a plurality of steps on an object to be processed, wherein the steps are performed in time series in accordance with a processing flow. A step of charting related information, a step of displaying the charted information for each step on the operator screen, and a step of displaying a parameter corresponding to the vicinity of each displayed information, And a step of setting and / or changing the parameter on the operator screen that has been performed. 10. A parameter corresponding to the information can be set / changed by pointing a pointer near each of the information arranged in time series.
The screen processing method of the cleaning processing apparatus according to claim 9. 11. The cleaning method according to claim 9, wherein information on a parameter corresponding to the information is displayed by pointing a pointer near the displayed information related to each step. Screen processing method of processing device. 12. The processing recipe setting / changing screen is
10. Displayed as one screen, 10.
12. A screen processing method for the cleaning processing apparatus according to any one of 10 and 11. 13. A processing apparatus for performing a process including a plurality of steps on an object to be processed according to a processing recipe of each step set and stored in advance.
A controller for driving and controlling each component of the processing apparatus, a charting means for charting the processing recipe as information related to each step in time series along the processing flow, and An operator screen display means for displaying the information on a screen for each step and displaying a parameter corresponding to each information in the vicinity of the information, and setting and / or changing the parameter on the displayed operator screen. An interface device for an operator for operating the processing device, and a processing device. 14. The operator interface means is configured to be able to set / change a parameter corresponding to the information by pointing a pointer near the information related to each displayed process. The cleaning treatment apparatus according to claim 13, wherein the cleaning treatment apparatus is a cleaning treatment apparatus. 15. The operator interface means is configured to display information about a parameter corresponding to the information by pointing a pointer near the information related to each of the displayed steps. 15. The cleaning treatment apparatus according to claim 13 or 14, which is characterized. 16. The processing recipe setting / changing screen is
The screen is displayed as a single screen.
The cleaning apparatus according to any one of 3, 14, and 15.