JP2001274133A - Substrate-treating apparatus and method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate-treating apparatus and a substrate treating method, whereby evenness can be improved when a treatment solution is supplied to the substrate. SOLUTION: The substrate treating device comprises a plurality of supply pipes 63a, 63b, 63c, and 63d for supplying a treatment solution to a substrate W, which is dipped into a treatment solution stored in a processing chamber 61. The supply pipes 63a, 63b, 63c, and 64d are disposed on different positions of upper left, lower left, upper right, and lower right. As shown in Figs. 6 (a) to 6 (d), one of the plurality of (four) supply pipes are selectively switched, to supply a treatment solution to the substrate W. Since various flows of a treatment solution can be formed, it is possible to suppress the occurrence of 'stagnationβ and the like that cauged by constant rate flows continues.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask,
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate (hereinafter, referred to as a "substrate") such as an optical disk substrate, which can achieve more uniform substrate processing with a processing liquid.

[0002]

2. Description of the Related Art There is a substrate processing apparatus for processing a substrate by immersing the substrate in a processing solution stored in a processing tank. In such a substrate processing apparatus, a lot (a set of a plurality of substrates when performing batch processing) to a chemical solution such as hydrofluoric acid and pure water (hereinafter, the chemical solution and pure water are collectively referred to as a processing solution) Is repeated to remove contaminants on the substrate surface, etch an oxide film on the substrate surface, and peel off the resist film to achieve a series of substrate treatments.

FIG. 13 is a diagram showing an example of such processing, and shows a case where a processing liquid L is supplied in a certain direction from a processing liquid supply pipe 163 arranged below the processing tank 161. ing. In such a substrate processing apparatus, for example, as shown in FIG.
The processing liquid is supplied by forming one kind of flow as represented by

[0004]

However, when the substrate processing is performed by such one kind of flow, there is a portion (for example, a portion P1) where the flow of the processing liquid is stagnant in the processing tank. There is. And
In the portion where the “stagnation” has occurred, particles and reaction products may stay, or a situation may occur in which the concentration distribution of the processing solution becomes non-uniform. That is, such "stagnation"
There is a problem that it becomes a factor that hinders uniform processing of the substrate.

[0005] Further, the above problem that the uniformity of the substrate processing is deteriorated is caused not only by the substrate processing apparatus for immersing the substrate but also by supplying the processing liquid to the substrate held without immersion. This can also occur in a substrate processing apparatus that performs substrate processing by using the above method.

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of improving the uniformity in supplying a processing liquid to a substrate.

[0007]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for performing a substrate immersion process using a processing liquid stored in a processing tank. A plurality of supply means provided at different positions in the processing tank and capable of supplying a processing liquid to a substrate immersed in the processing liquid stored in the processing tank; and Switching means for selectively switching which supply means is used to supply the processing liquid.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the plurality of supply units include at least three supply units, and each of the at least three supply units is It is provided at different positions around the immersion substrate, and it is possible to supply the processing liquid to mutually different positions shifted to a predetermined side relative to the direction toward the center of the main surface of the immersion substrate. It is possible that the switching means selects the at least three supply means in a predetermined order and switches so as to supply the processing liquid from the selected supply means.

According to a third aspect of the present invention, in the substrate processing apparatus of the first or second aspect, the supply unit supplies a processing liquid for performing a peeling process on the substrate surface to the substrate. Accordingly, the substrate is separated.

According to a fourth aspect of the present invention, in the substrate processing apparatus according to any one of the first to third aspects, the substrate processing apparatus is provided at different positions in the processing tank and stored in the processing tank. A plurality of discharge units capable of discharging the processing liquid; and the switching unit selectively switches which of the plurality of discharge units is used to discharge the processing liquid. I do.

Further, the substrate processing method according to the fifth aspect is characterized in that:
A substrate processing method for performing immersion processing of a substrate using a processing liquid stored in a processing tank, the method including at least one supply unit among a plurality of supply units provided at different positions in the processing tank. A first step of supplying a processing liquid to a substrate immersed in the processing liquid in the processing bath using a supply means according to a combination of one or more of the plurality of supply means; A second step of supplying a processing liquid to the substrate using supply means according to a second combination different from the first combination used in the first step. , Is included.

A substrate processing apparatus according to a sixth aspect of the present invention is a substrate processing apparatus for performing processing for supplying a processing liquid to a surface of a substrate. A plurality of supply units capable of discharging and supplying the processing liquid to the surface of the substrate held at a predetermined position in the inside, and which one of the plurality of supply units supplies the processing liquid. And a switching unit for selectively switching between (a) and (b).

Further, the substrate processing apparatus according to claim 7 is
A substrate processing apparatus for performing immersion processing of a substrate using a processing liquid stored in a processing tank, wherein a first flow can be formed by supplying a processing liquid to an immersion substrate in the processing tank. A first supply unit, a second supply unit disposed below the first supply unit in the processing tank, and capable of supplying a processing liquid to the immersion substrate; A rectifier that is provided between the first supply unit and the second supply unit, regulates the flow of the processing liquid supplied from the second supply unit, and forms a second flow different from the first flow; Means and an operation for forming the first flow using the first supply means and an operation for forming the second flow using the second supply means and the rectifying means. Switching means.

According to an eighth aspect of the present invention, in the substrate processing apparatus of the seventh aspect, the switching means supplies the processing liquid having the first flow using the first supply means. After performing, the operation of forming the first flow and the operation of forming the second flow are switched so that the processing liquid having the second flow is supplied using the second supply unit. Is performed.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS <A. First Embodiment><A1. Overall Configuration of Substrate Processing Apparatus> FIG. 1 is a perspective view showing the overall configuration of a substrate processing apparatus 1 according to the present invention. As shown in the drawing, the substrate processing apparatus 1 includes a cassette loading unit 2 into which a cassette CS containing unprocessed substrates is loaded,
A substrate unloading unit 3 on which the cassette CS from the cassette loading unit 2 is placed and a plurality of substrates (lots) are simultaneously extracted from the inside, and a substrate processing unit 5 on which unprocessed substrates unloaded from the cassette CS are sequentially immersed. A substrate storage unit 7 in which a plurality of processed substrates after the immersion processing are simultaneously stored in the cassette CS; and a cassette unloading unit 8 from which the cassette CS storing the processed substrates is discharged. Further, on the front side of the apparatus, a substrate transfer / transportation mechanism 9 is arranged from the substrate unloading section 3 to the substrate storage section 7, and a lot before, during and after the immersion processing can be selected from one place. Convey or transfer to another location.

The cassette loading section 2 includes a cassette transfer robot C capable of horizontal movement, vertical movement, and rotation about a vertical axis.
R1 is provided, and a pair of cassettes CS mounted at predetermined positions on the cassette stage 2a are transferred to the substrate extracting section 3.

The substrate unloading section 3 includes a pair of holders 3a and 3b which move up and down. A guide groove is formed on the upper surface of each of the holders 3a and 3b, so that unprocessed substrates in the cassette CS can be supported vertically and parallel to each other. Therefore, when the holders 3a and 3b rise,
The substrate is pushed up from inside the cassette CS. Cassette C
The substrate pushed upward S is transferred to the transfer robot TR provided in the substrate transfer / transfer mechanism 9, and is loaded into the substrate processing unit 5 after horizontal movement.

The substrate processing section 5 includes a chemical processing section 52 having a chemical tank CB for storing a chemical such as hydrofluoric acid and performing chemical processing.
And a washing unit 54 having a washing tank WB for storing pure water and performing washing processing, and a multi-function tank MB for storing various chemicals and washing in a single tank by storing chemicals or pure water. And a multifunctional processing unit 56 having the same. In this specification, a chemical solution tank CB and a washing tank W for performing some processing on a substrate are used.
B, the multi-function tank MB is collectively referred to as a processing tank.

In the substrate processing section 5, a first substrate immersion mechanism 5 is provided behind the chemical processing section 52 and the washing processing section 54.
The substrate received from the transport robot TR is immersed in the chemical tank CB of the chemical processing section 52, and the washing tank WB of the water washing section 54 is arranged by the lifter LH1 that can be moved up and down and traversed. Or soak in The lifter LH1 can transfer the substrate between the chemical solution tank CB and the washing tank WB, and raises and lowers the substrate with respect to the processing tanks so that the substrate is stored in the processing tank. It can be immersed in a liquid or separated from the processing liquid.

A second substrate immersion mechanism 57 is disposed behind the multi-function processing unit 56, and is provided with a vertically movable lifter LH2 to transfer the robot TR.
Of the substrate received from the multi-function processing unit 56 in the multi-function tank MB
Support within. The lifter LH2 has a role of holding the substrate, loading the substrate into the multi-function tank MB, and carrying out the substrate from the multi-function tank MB.
By raising and lowering the substrate with respect to the substrate, the substrate can be immersed in or removed from the processing liquid stored in the multi-function tank MB. In addition, 52a, 56a
Indicates a substrate receiving portion for supporting substrates provided on the lifters LH1 and LH2.

The multi-function processing section 56 is provided with a lid 58. The lid 58 has a drive mechanism (not shown) at its lower part, and the multifunction tank MB is driven by the drive mechanism.
Opening / closing operation for opening / closing the upper end portion of the camera. Lid 5
8 prevents the inflow of contaminants into the processing liquid stored in the multi-function tank MB by closing the upper end of the multi-function tank MB, and prevents the atmosphere in the multi-function tank MB from leaking to the outside. Has the role of preventing.

The substrate storage unit 7 has the same structure as the substrate unloading unit 3, and receives the processed substrate held by the transport robot TR by a pair of vertically movable holders 7a and 7b and stores the processed substrate in the cassette CS. I do.

The cassette carry-out section 8 has the same structure as the cassette carry-in section 2 and includes a movable cassette transfer robot CR2, and a pair of cassettes CS mounted on the substrate accommodating section 7. It is transferred to a predetermined position on the stage 8a.

The substrate transfer / transfer mechanism 9 includes a transfer robot TR that can move horizontally and vertically. Then, a pair of rotatable hands 9 provided on the transport robot TR are provided.
By holding the lot by the first and the second 92, the substrate supported by the holders 3a and 3b of the substrate unloading unit 3 is transferred to the lifter LH1 side provided in the first substrate immersion mechanism 55 of the substrate processing unit 5, or The substrate is transferred from the lifter LH1 to the lifter LH2 provided in the adjacent second substrate immersion mechanism 57, or the substrate is transferred from the lifter LH2 to the holders 7a and 7b of the substrate storage unit 7.

<A2. Control mechanism of substrate processing equipment>
A control mechanism of the substrate processing apparatus 1 will be described. FIG.
FIG. 2 is a functional block diagram for explaining a control mechanism of the substrate processing apparatus 1 of FIG. The substrate processing apparatus 1 incorporates a control unit 30 including a desktop computer or the like, and an operator can give commands to the apparatus via the control unit 30 and set processing patterns and processing conditions.

The control unit 30 has a CPU 3 as its main unit.
1, a ROM 32 that is a read-only memory, a RAM 33 that is a readable and writable memory, a magnetic disk 34 that stores control software and recipes (files whose processing procedures have been described), and associated input / output devices An input / output port 35 which is an interface with the substrate processing apparatus 1, a network port 36 which is an interface with an apparatus which directly controls the substrate processing apparatus 1, and a communication port 37 which communicates with a host computer or the like provided outside the substrate processing apparatus 1. And The control unit 30 includes:
A display 38 and a keyboard 39 are additionally provided via the input / output port 35, and the operator can input commands and parameters from the keyboard 39 while checking the display on the display 38.

The command input to the control unit 30 is processed based on processing software, and is transmitted from the control unit 30 to the master controller 40 and the tank controller 50 via the network port 36 as necessary. The master controller 40 includes the transfer robot TR
(See FIG. 1). Further, the tank controller 50 transmits a command to the tank control device 51 to control liquid injection into and out of each processing tank. The tank controller 50
The control of supply and discharge to and from the processing tank by the control unit 30 via the control unit 30 will be described later in detail.

<A3. Configuration of Processing Tank> Next, the configuration of the processing tank provided in the substrate processing apparatus 1 will be described. Here, as an example of the processing tank, the multifunctional processing unit 56
The multi-function tank MB will be described. FIG. 3 shows a multi-function tank M
FIG. 3 is a diagram showing a configuration of B (MB1). Multi-function tank MB
It is mainly composed of a processing tank 61, a recovery section 62, and a liquid injection / drainage mechanism associated therewith. Processing tank 61
Is a main part of the multi-function tank MB, can store pure water or a chemical solution (hydrofluoric acid or the like), and advances the surface treatment of the substrate W by immersing the substrate W in the treatment liquid. It is a tank.

On the inner wall surface of the processing tank 61, supply pipes 63a, 63b, 6
3c and 63d are provided. These supply pipes 63
Each of a, 63b, 63c, and 63d has a cylindrical shape (the cross-sectional shape is shown in the figure), and has a hole (not shown) for supplying a processing liquid to the cylindrical surface. I have. In addition, each supply pipe 63a, 63b, 63c, 63d
Are arranged at upper left, lower left, upper right, and lower right positions of the processing tank 61 in FIG. 3, respectively, and the valves 64a, 64b, 64c, 64d are respectively provided.
Through the processing liquid supply sources 65a, 65b, 65c, 6
5d.

The supply pipe 63a is connected to the processing liquid supply source 65 by opening the valve 64a.
The processing liquid stored in a can be supplied to the processing tank 61 from a hole provided on the surface of the supply pipe 63a. Although not shown for simplicity, the source 6
5a has a selection valve or the like for selecting a plurality of types of processing liquids, and a desired processing liquid can be supplied using the selection valve and the valve 64. Further, the other supply pipes 63b, 63c, 63
The same applies to d, where the valves 64b, 6
4c and 64d, supply sources 65b,
The processing liquid stored in 65c and 65d can be supplied. Further, the processing liquid supplied from the supply pipe 63 of the processing tank 61 eventually overflows (overflows) from above, is recovered by the recovery unit 62, and is then discharged.

At the bottom of the processing tank 61, a discharge valve 66e and a liquid discharge section 67e are provided. By closing the discharge valve 66e, the overflow process described above can be performed. Also,
By opening the discharge valve 66e, the processing liquid stored in the processing tank 61 can be discharged to the drainage section 67e in a short time, and the like. It is possible to perform operations such as a total replacement.

Here, in the processing tank 61, an etching process or a stripping process of a resist film can be performed. For example, a chemical solution such as hydrofluoric acid is used for etching the substrate, and (1) ozone (O 2 O) is used for the stripping process for removing unnecessary substances such as a resist film on the substrate.
₃ ) Ozone (O ₃ ) water dissolved in pure water, (2) a mixture of ozone (O ₃ ) water and an additive containing bicarbonate ions such as sodium hydrogen carbonate (NaHCO ₃ ), (3) sulfuric acid (H
Mixed solution of ₂ SO ₄ ) and hydrogen peroxide solution (H ₂ O), (4)
A rinsing liquid such as a mixed liquid of sulfuric acid (H ₂ SO ₄ ) and ozone, (5) an organic stripping liquid, or (6) an isopropyl alcohol liquid for cleaning a substrate after being treated with the organic stripping liquid is used.

Among them, examples of the organic stripping solution include 1-methyl-2-pyrrolidone, tetrahydrothiophene 1.1-dioxide, isopropanolamine, dimethyl sulfoxide, monoethanolamine, 2- (2aminoethoxy) ethanol, A chemical solution containing hydroxyamine, catechol, N-methylpyrrolidone, aromatic diol, perfrene, and phenol as main components is used. More specifically, for example, 1-methyl-2
A mixture of pyrrolidone, tetrahydrothiophene 1.1-dioxide and isopropanolamine, a mixture of dimethyl sulfoxide and monoethanolamine,
A mixed solution of (2aminoethoxy) ethanol, hydroxyamine and catechol, a mixed solution of 2- (2aminoethoxy) ethanol and N-methylpyrrolidone, a mixed solution of monoethanolamine, water and aromatic diol, perfrene Each of the (six types) of mixed solutions of phenol and phenol is used as an organic release agent.

The supply amount (flow rate) of the processing liquid supplied from the supply pipes 63a, 63b, 63c, 63d changes depending on the type of processing in the processing tank 61 and the like. This is performed by controlling the opening / closing amounts of the valves 64a, 64b, 64c, 64d and the pressure of a processing liquid supply pump (not shown). In particular, in the above-described stripping treatment, unnecessary resist films and the like adhering to the surface of the substrate can be stripped by supplying a large flow rate of the processing liquid (therefore, a processing liquid having a large liquid pressure) to the substrate. Will be possible.

Further, a plurality of substrates W to be processed are
In a state of being immersed in the processing liquid stored in the processing tank 61, it is held upright. Then, as shown in FIG. 3, the supply pipe 63a supplies the processing liquid from the upper left of the substrate W, the supply pipe 63b supplies the processing liquid from the lower left of the substrate W, and the supply pipe 63c supplies the processing liquid from the upper right of the substrate W. The supply pipe 63d supplies the processing liquid from the lower right of the substrate W. Next, these supply pipes 63a, 63b, 6
The processing operation using 3c and 63d will be described in detail.

<A4. Operation><FirstOperation> Here, the four supply pipes 63a,
The case where the processing liquid is selectively supplied to the substrate by using 63b, 63c, and 63d will be described. FIG. 4 is a schematic diagram showing the supply direction of the processing liquid from each supply pipe 63a, 63b, 63c, 63d, and FIG.
It is an operation | movement figure (timing chart) which shows the supply operation of the processing liquid from 63b, 63c, 63d. Also, FIG.
Supply pipes 63a, 63b, 63 at different times
It is a figure which shows the supply situation of the processing liquid from c, 63d.

As shown in FIG. 4, each of these four supply pipes is provided at different positions on the periphery of a substrate (immersion substrate) W immersed (in a processing solution in a processing tank). The processing liquid is supplied to mutually different positions shifted to a predetermined side (the left side in the figure) relative to the direction toward the center C of the main surface (the circular surface in the figure). . For example, the supply pipe 63a supplies the processing liquid to a position shifted to the left of the center C toward the center C of the substrate, and the supply pipe 63b also shifts to a position shifted to the left of the center C toward the center C of the substrate. The processing liquid is supplied to the processing liquid. The same applies to the other supply pipes 63c and 63d.
The processing liquid is supplied to a position shifted to the (same) left side toward.

In this embodiment, the processing liquid is not supplied from all of the four supply pipes 63a, 63b, 63c and 63d at the same time.
The case where the supply of the processing liquid from each of a, 63b, 63c, and 63d is performed by switching in a predetermined order will be exemplified. Such a switching operation is performed by the valves 64 through the tank controller 50 based on the command from the control unit 30.
a, 64b, 64c, 64d.

Next, referring also to the operation diagram of FIG.
Such a switching operation will be described. As shown in the operation diagram of FIG. 5, first, at time t0, supply from the supply pipe 63a is started. FIG. 6A shows a state where the processing liquid is supplied only from the supply pipe 63a. Then, after a predetermined time Δt has elapsed, at time t1, the supply from the supply pipe 63a is stopped, and the supply from the supply pipe 63c is started instead of the supply pipe 63a. FIG. 6B shows a state in which the processing liquid is supplied only from the supply pipe 63c. Next, at time t2, the supply from the supply pipe 63c is stopped, and the supply from the supply pipe 63d is started. FIG.
(C) shows a state where the processing liquid is supplied only from the supply pipe 63d. Further, at time t3, the supply from the supply pipe 63d is stopped, and the supply from the supply pipe 63b is started. FIG. 6D shows a state where the processing liquid is supplied only from the supply pipe 63b. Thereafter, at time t4, the supply of the processing liquid from the supply pipe 63b is stopped. Further, the processing liquid supply time Δt (= t1−t) from each supply pipe 63
0, t2-t1,...) Is, for example, several seconds to several tens of seconds. The supply time is set to an appropriate value according to the size of the processing tank 61 and the flow rate of the processing liquid.

Thereafter, the supply from the supply pipes 63a, 63b is started sequentially at times t4, t5,... And the supply pipes 63c, 6 at times t5, t6,.
The supply from 3d is stopped. That is, FIG.
By repeating each operation shown in (d) in this order, an operation of supplying the processing liquid from the four supply pipes is performed.

Here, the four supply pipes 63a, 63
Since the processing liquid supply operation is performed by selectively switching which of the supply pipes b, 63c, and 63d is used to supply the processing liquid, the processing liquid supply operation is performed, as shown in FIGS. Various flows (here, four types of flows) of the processing liquid can be formed. Therefore, the occurrence of “stagnation” or the like due to the continuation of a constant flow can be suppressed, and the uniformity of the processing liquid when it is supplied to the substrate can be improved.

Further, four supply pipes 63 for supplying the processing liquid to mutually different positions shifted to a predetermined side (the same side) with respect to the direction toward the center C of the main surface of the immersion substrate W.
The processing liquid is supplied in a predetermined order (here, the clockwise order with respect to the arrangement position of the supply pipes) by a, 63b, 63c, and 63d.
At the time of supply by each of 3c and 63d, the unique flow shown in each of FIGS. 6A to 6D is formed, while considering in a larger time unit, ( It is possible to form a flow of the processing liquid that rotates (clockwise). Therefore, uniform processing can be performed on the substrate.

The four supply pipes 63a, 63b, 63
When the processing liquids are supplied simultaneously from c and 63d, the flow of the processing liquid supplied from the separate supply pipes 63a, 63b, 63c and 63d interferes with each other. When it is difficult to form a flow of the processing liquid, when the processing liquid is supplied from each supply pipe at different timings as described above,
Since such mutual interference is suppressed, it is possible to efficiently form a flow of the processing liquid that rotates with respect to the center C of the substrate. In particular, in the case of performing the above-described stripping process, when supplying a large flow rate of the processing liquid (therefore, a processing liquid having a high liquid pressure) to the substrate W, the supply pipes 63a, 63b, 63c, and 63d are used to supply the processing liquid. It is possible to supply the processing liquid after sufficiently utilizing the pressure of the processing liquid supplied from each supply pipe over each supply time without the supplied processing liquids interfering with each other. . This makes it possible to more effectively remove unnecessary resist films and the like adhering to the surface of the substrate.

Since the substrate W is held in a fixed state without being rotated, generation of particles from the substrate W and the like can be minimized.

Further, in the above description, the processing liquid is supplied through the four supply pipes. However, the same processing can be performed by supplying the processing liquid through at least three supply pipes. For example, three supply pipes provided at three different positions around the substrate W (for example, a total of three positions including an upper left position of the substrate W, an upper right position of the substrate W, and a position immediately below the substrate W) may be used. Similar processing can be performed.

<Other Operations> In the above, the four supply pipes for supplying the processing liquid to a position shifted to a predetermined side (left side) with respect to the direction toward the center C of the main surface of the immersion substrate W are provided. When used, the clockwise order (that is, the supply pipes 63a, 63c,
Although the case where the processing liquid is supplied in the order of (d, 63b) is illustrated, the invention is not limited to this. For example, using four supply pipes for supplying the processing liquid to a position shifted to the right with respect to the center C of the main surface of the immersion substrate W, a counterclockwise order (that is, the supply Tubes 63a, 63
b, 63d, and 63c in this order).
The supply order of the processing liquid from these four supply pipes is as follows.
Still another order (for example, supply pipes 63a, 63b, 6)
3c, 63d).

Further, at a predetermined time, two or more of the four supply pipes may be combined to supply the processing liquid. That is, it may be selected that two or more supply pipes should simultaneously supply the processing liquid. For example, (1) an operation in which the operation of supplying the processing liquid using the supply pipes 63a and 63c simultaneously and the operation of supplying the processing liquid using the supply pipes 63b and 63d simultaneously are performed alternately. (2) At a predetermined time, supply of the processing liquid is performed simultaneously using the supply pipes 63a and 63b, and at another time, the supply pipes 63a and 63b are supplied.
b and 63c are simultaneously used to supply the processing liquid, and at another time, the supply pipes 63a, 63b, 63c and 6 are supplied.
The operation may be such that the operation of supplying the processing liquid using 3d simultaneously is repeated. Even in such a case, the processing liquid supply operation is performed by selectively switching which of the four supply pipes 63a, 63b, 63c, 63d is used to supply the processing liquid. Therefore, it is possible to form various flows of the processing liquid.

<A5. Modifications> In the first embodiment described above, the case where the processing liquid stored in the processing tank 61 is discharged via the recovery unit 62 due to overflow has been described, but the present invention is not limited to this. For example, as shown in FIG. 7, a closed multifunctional tank MB (MB
The present invention can also be applied to a substrate processing apparatus having the method 4).

In FIG. 7, the same elements as those of the multi-function tank MB1 of FIG. 3 are denoted by the same reference numerals. The multi-function tank MB4 in FIG. 7 has the same configuration as the multi-function tank MB1, and further includes discharge valves 66a, 66b,
66c, 66d, and drainage sections 67a, 67b, 67c, 6
7d. These discharge valves 66a, 6
By using 6b, 66c, 66d and the like, the processing liquid supplied from the supply pipes 63a, 63b, 63c, 63d can be recovered from the processing tank 61.

Here, a plurality of supply pipes 63 a, 63 b, provided at different positions in the processing tank 61 and capable of discharging the processing liquid stored in the processing tank 61.
The case where the processing liquid is discharged by sharing the discharge pipes 63c and 63d is shown.
A discharge pipe dedicated to discharge may be provided separately from 63c and 63d.

Then, these supply pipes 63a, 63b,
The discharge of the processing liquid is performed from either of 63c and 63d. This discharge operation may be performed before or after the supply operation (that is, the discharge operation and the supply operation are performed sequentially), or may be performed simultaneously with the supply operation. When the supply operation and the discharge operation are performed simultaneously while the supply tube and the discharge tube are shared, a supply tube other than the supply tube performing the supply operation at that time is selected as the discharge tube performing the discharge operation. .

In this discharging operation, any of the supply pipes 6
Whether to discharge from 3a, 63b, 63c, 63d is selectively switched by a procedure predetermined by the control unit 30 or the like. Accordingly, since various flows of the processing liquid can be formed, the uniformity of the processing liquid when supplying the processing liquid to the substrate can be improved.

Here, in the closed multi-function tank MB, a case is shown in which discharge pipes for discharging the processing liquid (shared with the supply pipe) are provided at a plurality of positions in the processing tank 61. Multifunctional tank MB using overflow without limitation
In, a discharge pipe as described above may be provided.

<B. Second Embodiment> Next, a second embodiment will be described. FIG. 8 is a schematic diagram illustrating a multi-function tank MB (MB2) of the substrate processing apparatus according to the second embodiment. The substrate processing apparatus according to the second embodiment has the same configuration as that of the substrate processing apparatus according to the first embodiment, and the following description will focus on differences.

In the substrate processing according to the second embodiment, the substrate W is immersed in the processing liquid stored in the processing tank 61 in that the processing of the substrate W is performed without storing the processing liquid in the processing tank 61. This is significantly different from the first embodiment in which substrate processing is performed. In the second embodiment, a hole h as shown in FIG.
The processing of the substrate surface can be performed by spraying (discharging and supplying) the processing liquid to the substrate W (FIG. 8) held in the space using the supply pipe 63 having
This supply pipe has a plurality of holes H functioning as a discharge portion in an arc portion extending over a predetermined angle θ in the cylindrical cross section. Then, the processing liquid is ejected (discharged) from the hole H.
By doing so, it is possible to spray (discharge and supply) the processing liquid onto the substrate W.

Here, the substrate W is connected to the lifter LH (LH2
And the like, it is possible to reach a predetermined position (position shown in the drawing) in the space of the processing tank 61, and is held at the predetermined position during substrate processing. The supply pipes 63a, 63b, 63c, and 63d eject the processing liquid from a plurality of holes H provided on the cylindrical surface in an arc, thereby forming the substrate W held at a predetermined position in the processing tank space. Supply the treatment liquid to the surface. Then, by selectively switching which of the plurality of supply pipes is used to supply the processing liquid, the same processing as described above can be performed.

Here, the entire main surface of the substrate W is divided into several (here, four) regions, and the processing liquid is supplied to each of the plurality of supply pipes 63a, 63b, 63c, 63d. Is assigned as a discharge target region for each supply pipe. And
By sequentially discharging the processing liquid from the supply pipes corresponding to the respective discharge target areas in a predetermined order, the processing liquid can be uniformly supplied to the substrate. Also, 1
As compared with the case where the processing liquid is supplied to the entire surface of the substrate W by the discharge supply by one supply pipe, it is possible to set a smaller discharge area to be handled by each supply pipe.

The supply pipes 63a, 63b, 6
When the processing liquid is ejected simultaneously from 3c and 63d,
When the processing liquid supplied from each of the plurality of supply pipes collides with each other, the flow direction and strength of each processing liquid are attenuated, and the liquid pressure of the processing liquid when contacting the substrate is reduced. descend. However, in the second embodiment, as in the first embodiment, the supply of the processing liquid from the plurality of supply pipes is performed not at the same time but at different times.
In other words, when supplying the processing liquid to the substrate from the supply pipes provided at different positions in the processing tank 61, which of the plurality of supply pipes is used to supply the processing liquid is determined. Selectively switch. Therefore,
It is possible to prevent a decrease in the liquid pressure on the substrate due to the collision of the processing liquids supplied from the plurality of supply pipes with each other. Therefore, uniform supply of the processing liquid to the substrate can be efficiently performed.

<C. Third Embodiment><C1.Configuration> Next, a third embodiment will be described. The substrate processing apparatus of the third embodiment has the same configuration as that of the substrate processing apparatus of the first embodiment except for the configuration of each processing tank. A multifunctional tank will be described as an example.

FIG. 10 is a schematic diagram showing a multi-function tank MB (MB3) of the substrate processing apparatus according to the third embodiment. As shown below, the multifunctional tank MB3 of the third embodiment is different from the first and second embodiments in the arrangement of the supply pipes and the flow of the processing liquid between the supply pipes arranged vertically. This is different in that a rectifying plate for adjusting the pressure is provided.

First, the multi-function tank MB mainly includes the processing tank 6.
1, a collection unit 62 and a liquid supply / drainage mechanism attached thereto. The processing tank 61 is a main part of the multi-function tank MB, and can store pure water or a chemical solution (such as hydrofluoric acid). The surface processing of the substrate W is performed by immersing the substrate W in the processing liquid. Is a tank for proceeding.

On the inner wall surface of the processing tank 61, supply pipes 63g, 63h, 6
3i and 63j are provided. These supply pipes 63
Each of g, 63h, 63i, and 63j has a cylindrical shape (the cross-sectional shape is shown in the figure), and has a hole (not shown) for supplying a processing liquid to the cylindrical surface. I have. These supply pipes 63g, 63h, 63i, 63j
Are arranged in two lower and upper stages below the processing tank 61. More specifically, the supply pipes 63g and 63i are arranged at an upper position (upper side), and the supply pipes 63h and 63j are It is arranged at a lower position (a position below the supply pipes 63g and 63i).

The supply pipes 63g, 63h, 6
3i and 63j are valves 64g, 64h and 6 respectively.
4i and 64j, supply sources 65g and 65
h, 65i, 65j. For example, the supply pipe 63g opens the valve 64g to allow the processing liquid stored in the processing liquid supply source 65g to pass through the hole provided on the surface of the supply pipe 63g into the processing tank 61g.
Can be supplied. Although not shown for simplicity, in the supply source 65g,
A selection valve for selecting a plurality of types of processing solutions is provided, and a desired processing solution can be supplied using the selection valve and the valve 64. The same applies to the other supply pipes 63h, 63i, 63j,
The processing liquid stored in the similar processing liquid supply sources 65h, 65i, 65j can be supplied via the valves 64h, 64i, 64j, respectively. Further, the processing tank 61
The processing liquid supplied from the supply pipe 63 soon overflows from above (overflows), is recovered by the recovery unit 62, and is then discharged.

At the bottom of the processing tank 61, a discharge valve 66k and a liquid discharge section 67k are provided. The overflow process described above can be performed by closing the discharge valve 66k. Also,
By opening the discharge valve 66k, the processing liquid stored in the processing tank 61 can be discharged to the drainage section 67k in a short time, and the like. It is possible to perform operations such as a total replacement.

Here, in this processing tank, an etching treatment and a resist film peeling treatment can be performed. As the treatment liquid, those described in detail in the first embodiment can be used.

The supply amount (flow rate) of the processing liquid supplied from the supply pipes 63g, 63h, 63i, 63j changes depending on the type of processing in the processing tank 61 and the like. This is performed by controlling the opening / closing amounts of the valves 64g, 64h, 64i, 64j and the pressure of a processing liquid supply pump (not shown). In particular, in the above-described stripping process, a large flow rate of a processing liquid is supplied, and a processing liquid having a large liquid pressure is supplied to the substrate, thereby removing an unnecessary resist film or the like attached to the surface of the substrate. Becomes possible.

Further, a plurality of substrates W to be processed are:
In a state of being immersed in the processing liquid stored in the processing tank 61, it is held upright. As described later, the supply pipe 6 arranged on the upper side
By switching between the operation of forming the first flow of the processing liquid using 3g and 63i and the operation of forming the second flow using the supply pipes 63h and 63j and the rectifying plate 68 arranged below. The substrate processing is performed by forming two different flows in the processing tank 61.

Therefore, the supply pipe 63 arranged on the upper side
A flow straightening plate 68 is provided between g, 63i and supply pipes 63h, 63j arranged on the lower side. This current plate 6
8 has a large number of micro holes HL over the entire surface of the thin plate member.
.

The processing liquid supplied from the supply pipes 63h and 63j (lower stage) disposed below the current plate 68 is supplied to the micro holes HL existing at all positions below the substrate W.
(Rectifier plate 68), the substrate W is directed toward the substrate W, so that the substrate W is moved from the lower side to the upper side (in a certain direction).
A heading flow (translational flow) (see FIG. 12B) is formed. That is, the current plate 68 has a function of adjusting the flow of the processing liquid supplied from the lower supply pipes 63h and 63j.

On the other hand, the processing liquid supplied from the supply pipes 63g and 63i disposed above the rectifying plate 68
The flow is directly supplied to the substrate W without passing through the processing tank 61, and a flow (circulation flow) (see FIG. 12A) that circulates largely symmetrically in the processing tank 61 is formed. Thereby, in the surface treatment of the substrate W in the processing tank 61, it is possible to have a highly efficient particle discharging effect.

The supply of the processing liquid using the upper supply pipes 63g and 63i and the supply of the processing liquid using the lower supply pipes 63h and 63j and the rectifying plate 68 form different flows. Therefore, by switching and operating these two types of flows, more appropriate supply of the processing liquid can be performed.

Next, the plurality of supply pipes 63g, 6
Processing operations using 3h, 63i, 63j, etc. will be described in detail.

<C2. Operation> FIG. 11 is a flowchart showing the operation in the third embodiment. As shown in FIG. 11, after performing the chemical solution treatment A (step SP10), a first pure water rinsing process (step SP20),
The case of performing the pure water rinsing process (step SP30) and the chemical solution process C (step SP40) will be described.

First, in step SP10, a processing liquid (chemical liquid) for performing the chemical liquid processing A is supplied using the upper supply pipes 63g and 63i. Thereby, the processing on the surface of the substrate W and the like by the predetermined chemical solution is advanced.

Next, in step SP20, the first
Of pure water rinse B1. Prior to that, when shifting from the chemical treatment A to the pure water rinsing treatment B1, the chemical stored in the treatment tank 61 is rapidly discharged by opening the discharge valve 66k, and then pure water is supplied. Is possible. Alternatively, when it is not preferable to expose the substrate W to the atmosphere, it is possible to gradually discharge the chemical solution by additionally supplying pure water.

In the pure water rinsing process B1, a processing liquid at a predetermined flow rate (for example, 22 liters / minute) is supplied using the upper supply pipes 63g and 63i.
Thereby, as shown by the arrow AR1 in FIG.
A flow (circulation flow) that largely circulates symmetrically in the processing tank 61 is formed, and a pure water rinsing process is performed on the surface of the substrate W or the like. In the pure water rinsing process B1, the supply of the processing liquid from the lower supply pipes 63h and 63j is performed only at zero (that is, stopped) or at a small amount.

After performing the first pure water rinsing process B1 for a predetermined time, the process proceeds to the next second pure water rinsing process B2.

The next pure water rinsing process B2 (step SP3
In 0), the processing liquid is supplied at a predetermined flow rate (for example, 22 liters / minute) using the lower supply pipes 63h and 63j. Thus, as shown in FIG. 12B, a flow (translational flow) from the lower side to the upper side is formed on the substrate W, and the pure water rinsing process is performed on the surface of the substrate W and the like. In the pure water rinsing process B1, the supply of the processing liquid from the upper supply pipes 63g and 63i is performed only at zero (that is, stopped) or at a small amount.

Here, the first pure water rinsing treatment B1
In FIG. 12A, as shown by an arrow in FIG. 12A, a flow (arrow AR1) that largely symmetrically circulates in the processing tank 61 is formed, thereby performing a very efficient particle discharge process. Although it is possible to continue the processing by such one kind of flow,
“Stagnation” may occur in a predetermined portion in the processing tank 61. For example, in FIG. 12A, a case where “stagnation” occurs in a portion P1 sandwiched between the flow overflowing from above the processing tank 61 to the collection unit 62 and the flow indicated by the arrow AR1. Is shown.

However, in the third embodiment, in the next second pure water rinsing process B2,
As shown by the arrow AR2 in (b), the supply pipes 63h, 63
The processing is performed by forming a flow (AR2) from the lower side to the upper side of the immersion substrate by supplying the processing liquid using j. Therefore, a flow different from the circulation flow (AR1) can be generated in the processing tank. This makes it possible to discharge even the stagnant matter that tends to stay at a predetermined position such as the portion P1 when only the circulating flow is used, so that more efficient substrate processing can be performed.

As described above, by appropriately using the two types of flows, it is possible to supply an appropriate processing liquid (pure water), and it is possible to efficiently perform the pure water rinsing processing.

Then, after such pure water rinsing treatment,
The next chemical solution processing C is performed on these substrates W (step SP40). Chemical treatment C is performed using the same or different chemicals as chemical treatment A.

Here, the first pure water rinsing process B
Although the case of performing the second pure water rinsing process B2 after the first process has been described, the present invention is not limited to this, and may be reversed, for example. Even in this case, it is possible to appropriately supply the processing liquid by appropriately using the two types of flows.

<D. Others> In the above description, the substrate processing apparatus according to the first embodiment and the substrate processing apparatus according to the second embodiment are respectively described as separate embodiments. However, the present invention is not limited thereto. , Second
A substrate processing apparatus having a multi-function tank capable of sequentially performing the processing liquid discharge and supply processing described in the embodiment may be used. For example, first, after performing a chemical treatment by the immersion treatment shown in the first embodiment, the treatment liquid (chemical solution) in the treatment tank 61 is discharged, and the treatment liquid (pure water) shown in the second embodiment is discharged. A pure water rinsing process may be performed by a discharge supply process.

[0085]

As described above, claims 1 to 4 are as described above.
According to the substrate processing apparatus described in (1), it is possible to selectively switch which of the plurality of supply units is used to supply the processing liquid, so that various flows of the processing liquid can be formed. Can be. Therefore, the occurrence of “stagnation” or the like due to the continuation of a constant flow can be suppressed, and the uniformity of the processing liquid when it is supplied to the substrate can be improved.

[0086] In particular, according to the substrate processing apparatus of the second aspect, each of the at least three supply means is mutually shifted to a predetermined side with respect to the direction toward the center of the main surface of the immersion substrate. Since the processing liquid is supplied to the different positions in a predetermined order, it is possible to form a flow of the processing liquid that rotates with respect to the center of the substrate, thereby enabling uniform processing of the substrate. become.

According to the substrate processing apparatus of the fourth aspect, which of the plurality of discharging means is used to selectively discharge the processing liquid is used, so that various types of processing liquid can be used. A flow can be formed. Therefore,
In supplying the processing liquid to the substrate, the uniformity can be improved.

Further, according to the substrate processing method of the present invention, in the first step and the second step, different flows of the processing liquid are formed by using the supply means according to different combinations. be able to. Therefore, the occurrence of “stagnation” or the like due to the continuation of a constant flow can be suppressed, and the uniformity of the processing liquid when it is supplied to the substrate can be improved.

Further, according to the substrate processing apparatus of the present invention, it is possible to selectively switch which of the plurality of supply units is used to supply and discharge the processing liquid. This can prevent the processing liquids supplied from the supply means from colliding with each other and thereby lowering the liquid pressure on the substrate. Therefore, when supplying the processing liquid to the substrate, the uniformity can be improved.

Further, according to the substrate processing apparatus of the seventh aspect, the operation of forming the first flow by using the first supply means and the second operation by using the second supply means and the rectification means. By switching between the flow forming operation and the flow forming operation, two types of flows relating to the processing liquid can be formed. Therefore, by switching and using these two types of flows, it is possible to eliminate “stagnation” and perform appropriate substrate processing.

Further, according to the substrate processing apparatus of the eighth aspect, the first processing means supplies the processing liquid by using the first supply means.
After the flow is formed and the processing is performed efficiently, by supplying the processing liquid using the second supply means, a second flow different from the first flow can be generated in the processing tank. it can. Therefore, after performing a predetermined process by the first flow, by using the second flow, it is also possible to discharge a stagnant substance that easily stays at a predetermined position when only the first flow is used. Therefore, more efficient substrate processing can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an overall configuration of a substrate processing apparatus 1 according to the present invention.

FIG. 2 is a functional block diagram for explaining a control mechanism of the substrate processing apparatus 1.

FIG. 3 is a diagram showing a configuration of a multi-function tank MB (MB1).

FIG. 4 is a schematic diagram showing a supply direction of a processing liquid from each supply pipe 63a, 63b, 63c, 63d.

FIG. 5 is an operation diagram (timing chart) illustrating an operation of supplying a processing liquid from each supply pipe 63a, 63b, 63c, 63d.

FIG. 6 shows supply pipes 63a and 63 at different times.
It is a figure which shows the supply situation of the processing liquid from b, 63c, 63d.

FIG. 7 is a view showing a multi-function tank MB (MB4) according to a modification.

FIG. 8 is a multifunctional tank M of the substrate processing apparatus according to the second embodiment.
It is a schematic diagram which shows B (MB2).

FIG. 9 is a perspective view showing a supply pipe 63.

FIG. 10 is a schematic diagram showing a multi-function tank MB (MB3) of the substrate processing apparatus according to the third embodiment.

FIG. 11 is a flowchart showing an operation in the third embodiment.

FIG. 12 is a schematic diagram showing a first flow (circulating flow) and a second flow (translational flow).

FIG. 13 is a diagram illustrating a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 5 Substrate processing part 56 Multifunctional processing part 61 Processing tank 62 Collection part 63, 63a-63d, 63g-63j Supply pipe 64, 64a-64d, 64g-64j Valve 65a-65d, 65g-65j Supply source 66a -66e, 66g-66k Discharge valve 67a-67e, 67g-67k Drainage part 68 Rectifying plate H, HL hole L Treatment liquid MB, MB1-MB4 Multifunctional tank W Substrate

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/306 H01L 21/306 J (72) Inventor Masayoshi Imai 4 1-chome Tenjin Kitamachi 1 Dainippon Screen Mfg. Co., Ltd. F-term (reference) 3B201 AA02 AA03 AB42 BB02 BB05 BB24 BB25 BB33 BB62 BB87 BB93 BB95 CB15 CC01 CD41 5F043 AA01 CC16 EE02 EE04 EE27 5F046 MA10

Claims (8)

[Claims] 1. A substrate processing apparatus for performing immersion processing of a substrate with a processing liquid stored in a processing tank, provided at different positions in the processing tank, and immersed in the processing liquid stored in the processing tank. A plurality of supply means capable of supplying the processing liquid to the substrate, and a switching means for selectively switching which of the plurality of supply means is used to supply the processing liquid. ,
A substrate processing apparatus comprising: 2. The substrate processing apparatus according to claim 1, wherein the plurality of supply units include at least three supply units, and each of the at least three supply units is different from each other around an immersion substrate. It is possible to supply the processing liquid to mutually different positions shifted to a predetermined side relatively to the direction toward the center of the main surface of the immersion substrate, the switching means, A substrate processing apparatus, wherein the at least three supply units are selected in a predetermined order, and switching is performed so as to supply a processing liquid from the selected supply unit. 3. The substrate processing apparatus according to claim 1, wherein the supply unit performs the substrate peeling process by supplying a processing liquid for performing the substrate surface peeling process to the substrate. A substrate processing apparatus characterized by the above-mentioned. 4. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is provided at different positions in the processing tank and can discharge the processing liquid stored in the processing tank. A substrate processing apparatus, wherein: a plurality of discharge units; and the switching unit selectively switches which one of the plurality of discharge units is used to discharge the processing liquid. 5. A substrate processing method for performing immersion processing of a substrate by using a processing liquid stored in a processing tank, wherein at least one of a plurality of supply units provided at different positions in the processing tank is provided. A first step of supplying a processing liquid to a substrate immersed in the processing liquid in the processing tank using a supply unit according to a first combination including a supply unit; A processing liquid is supplied to the substrate by using a supply unit according to a second combination that is different from the first combination used in the first step and is a combination including one or more supply units. And a second step. 6. A substrate processing apparatus for performing processing for supplying a processing liquid to a substrate surface, wherein the substrate processing apparatus is provided at different positions in a processing tank and is provided at a predetermined position in a processing tank space. A plurality of supply units capable of discharging and supplying the processing liquid, and a switching unit for selectively switching which of the plurality of supply units is used to supply the processing liquid;
A substrate processing apparatus comprising: 7. A substrate processing apparatus for performing immersion processing of a substrate using a processing liquid stored in a processing tank, wherein the first flow is performed by supplying the processing liquid to the immersion substrate in the processing tank. A first supply unit that can be formed; and a second supply unit that is disposed below the first supply unit in the processing tank and that can supply a processing liquid to the immersion substrate. Means, provided between the first supply means and the second supply means, for regulating the flow of the processing liquid supplied from the second supply means, and providing a second processing liquid different from the first flow. Rectification means for forming a flow; operation for forming the first flow using the first supply means; operation for forming the second flow using the second supply means and rectification means; Switching means for selectively switching between the substrates. Management apparatus. 8. The substrate processing apparatus according to claim 7, wherein the switching unit supplies the processing liquid having the first flow using the first supply unit, and then performs the second supply. Substrate processing, wherein the operation of forming the first flow and the operation of forming the second flow are switched so as to supply the processing liquid having the second flow using the means. apparatus.