JP2003115473A - Liquid processor and its setting control method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To display only connectable pipings at setting data of a liquid processor on a graphical recipe forming screen, allowing the data to be selectively set, thereby visually forming a recipe. SOLUTION: The method comprises the slepss of: designating a nozzle in a monitor screen to display graphical images of all connectable feed lines from the nozzle to treating liquid feed sources; selecting one of the feed lines, deleting images of other feed lines, specifying the selected feed line, and selecting a drain port; displaying all images of the connectable drain lines allowed to combine with the selected feed line, selecting one of the drain lines to delete the images of other drain lines; and actually setting the selected feed line and drain line.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for setting and controlling a supply / discharge line of a liquid processing apparatus, and more specifically, a processing liquid such as a chemical liquid for a processed object such as a semiconductor wafer or a glass substrate for LCD. The present invention relates to a recipe setting management method of a liquid processing apparatus that supplies the above items and performs processing such as cleaning.

[0002]

2. Description of the Related Art Generally, semiconductor device manufacturing processes and L
In the CD manufacturing process, a liquid that uses a treatment liquid or the like to remove the resist adhering to an object to be treated (hereinafter referred to as a wafer or the like) such as a semiconductor wafer or LCD glass and the residue (polymer or the like) after the dry treatment. Processing devices (methods) are widely adopted.

In this type of conventional liquid processing apparatus, a cleaning processing method is known in which a new processing liquid to be used for processing is reused as a recycling liquid in order to effectively use a processing liquid such as an expensive chemical liquid. In the method using the recycled liquid and the new treatment liquid, two types of tanks are prepared: a tank for storing the new treatment liquid and a tank for storing the recycled liquid. After the primary treatment, the new treatment liquid is subjected to the secondary treatment to effectively use the treatment liquid.

Therefore, this type of liquid processing apparatus has a nozzle and a drain port in a chamber which is a processing chamber of an object to be processed,
The processing liquid can be supplied to the nozzle from a plurality of processing liquid supply sources through a plurality of selectable supply lines, and the tank or the processing liquid can be supplied from a drain port through a plurality of drain lines that can select the processed liquid. It has a structure for discharging to the outside.

Conventionally, the connection relations of these lines are set on a recipe forming screen in a table format.

[0006]

However, when looking at the connection system of the pipes centering on the supply nozzle and the drainage port to the chamber which is the processing chamber, there are a plurality of pipes connectable to this. Since one of them is configured to be selectively used, there are not a few places that are not easy to understand at the time of setting. For example, in the case of a supply nozzle, in addition to the supply lines of the chemical liquid supply pipe and the IPA supply pipe, it is possible to connect the supply lines of the pure water supply pipe and the dry fluid supply pipe. In addition, the drain port includes a circulation line forming a return line for the solvent to the circulation supply tank, a return line for the chemical liquid to the outer tank of the chemical liquid supply unit, and drain lines such as a plurality of drain pipes. Can be connected.

Therefore, in the conventional setting of the connection relation by the tabular recipe creation screen, there is a possibility that the setting may be mistaken.

Therefore, in the present invention, a graphical recipe creation screen is displayed in which only the pipes that can be connected at the time of data setting are displayed so that the recipes can be selectively set so that the recipe can be visually created. An object of the present invention is to provide a device setting management method.

[0009]

In order to achieve the above object, a liquid processing apparatus according to a first aspect of the present invention supplies a processing liquid to a chamber for liquid processing an object to be processed and an object to be processed in the chamber. A nozzle, a plurality of processing liquid supply sources communicating with the nozzle via a plurality of supply lines, and a monitor capable of displaying the chamber, nozzle, supply line, and processing liquid supply source as an image when setting a recipe. Furthermore, by designating the nozzles in the image on the monitor, all connectable supply lines from the nozzles to the processing liquid supply source are displayed in the image, and 1 of the supply lines displayed in this image is displayed. When one of the supply lines is selected, a control means for leaving the image of the selected supply line and erasing the image of the other supply line is provided.

According to a second aspect of the present invention, there is provided a liquid processing apparatus in which a chamber for liquid-processing an object to be processed, a drain port for draining the processing liquid supplied into the chamber from the chamber, and a plurality of drain ports are provided. A plurality of drains communicating with each other via a drain line; and a monitor capable of displaying the chamber, drain port, drain line, and drain as an image when setting a recipe, By specifying the drainage port in the monitor image, all drainage lines that can be connected from the drainage port to the drainage part are displayed in the image, and one of the drainage lines displayed in this image is displayed. It is characterized by comprising control means for leaving the image of the selected drainage line and deleting the images of other lines when selected.

According to a third aspect of the present invention, there is provided a liquid processing apparatus in which a chamber for liquid-processing an object to be processed, a nozzle for supplying a processing liquid to the object to be processed in the chamber, and a nozzle which communicates with the nozzle via a plurality of supply lines. A plurality of treatment liquid supply sources, a drain port for draining the treatment liquid supplied into the chamber from the chamber, and a plurality of drain parts communicating with the drain port via a plurality of drain lines. A monitor capable of displaying an image of the chamber, nozzle, supply line, treatment liquid supply source, drainage port, drainage line, and drainage part at the time of setting a recipe, and further, an image of the monitor When all the supply lines that can be connected from the nozzles to the supply source are displayed in the image by designating the nozzle inside, when one of the supply lines displayed in this image is selected, the selected supply line is selected. When the drain port in the above image is selected, the combination with the selected supply line is allowed, and the connection from the drain port to the drain is made when the drain port in the above image is selected. It is characterized in that it is provided with a control means for displaying an image of all the drainage lines that can be used.

A liquid processing apparatus according to a fourth aspect is the liquid processing apparatus according to any one of the first to third aspects, wherein at least one of the plurality of processing liquid supply sources is a tank for storing the processing liquid. , This tank has a new liquid tank that stores new liquid that has not been used for treatment, and a recycle tank that stores recycled liquid that has been used for treatment liquid, and the supply line can be either a new liquid tank or a recycle tank. Is also connectable.

The liquid processing apparatus according to a fifth aspect is the liquid processing apparatus according to the third aspect, wherein at least one of the plurality of processing liquid supply sources is a tank for storing the processing liquid,
This tank has a new liquid tank that stores new liquid that has not been used for treatment, and a recycle tank that stores recycled liquid that has been used for treatment, and the supply line is connected to both the new liquid tank and the recycle tank. It is possible, and at least one of the plurality of drainage portions can be connected to the recycling tank.

A liquid processing apparatus according to a sixth aspect is the liquid processing apparatus according to any one of the first to fifth aspects, wherein a plurality of processing liquid supply sources supply a processing liquid supply source and a gas. And a gas supply source.

The liquid processing apparatus according to claim 7 is the liquid processing apparatus according to any one of claims 1 to 6, wherein the chamber has a dual structure of an inner chamber and an outer chamber, and a monitor is provided for each chamber. It is characterized in that each of the images can be displayed.

According to another aspect of the present invention, there is provided a method for managing settings of a liquid processing apparatus, wherein a chamber for liquid-processing an object to be processed has a nozzle and a drain port, and a plurality of processings are provided to the nozzle via a plurality of selectable supply lines. A liquid processing apparatus that enables the processing liquid to be supplied from a liquid supply source and discharges the processed processing liquid from a drain port to a tank or the outside through a plurality of drain lines that can be selected. For the monitor of the control device that sets and controls the connection of the line and the drainage line,
By displaying the above chamber and the nozzles and drain ports provided in the chamber as an image, and specifying the nozzle in this image, a supply line that can be connected from the nozzle to the processing liquid supply source on the monitor screen All of the images are displayed, and when one of the supply lines is selected, the image of the selected supply line is left and the images of the other supply lines are erased. When a port is selected, the monitor screen displays an image of all drainage lines that are allowed to be combined with and connected to the selected supply line, and one of the drainage lines in that image was selected. At this time, the image of the selected discharge line is left and the images of other discharge lines are deleted,
It is characterized in that actual setting of the supply line and the drainage line selected as described above is performed.

The setting management method according to claim 9 is the method according to claim 8.
In the setting management method of the liquid processing apparatus described above, one of the supply lines includes a recycling tank system.

According to a tenth aspect of the setting control method of the liquid treatment apparatus of the eighth or ninth aspect, the supply line is a dry fluid supply source, a pure water supply source, a new liquid tank of a chemical solution, It is characterized by including a supply line from a fresh solvent tank of the solvent to the nozzle.

The setting control method according to claim 11 is the method for setting control of a liquid processing apparatus according to claim 8 or 9, characterized in that one of the drainage lines includes a recycling tank system.

According to a twelfth aspect of the setting management method of the eighth aspect or the eleventh aspect of the invention,
The drainage line includes a drainage recycling tank, a solvent recycling tank, and a drainage line connecting another drainage destination and the drainage port.

A setting management method according to a thirteenth aspect is the method according to any one of the eighth to twelfth aspects, wherein the chamber is composed of an inner chamber and an outer chamber, and the inner chamber is provided with the nozzle and a drain port. It is characterized by being.

According to the present invention, by designating a nozzle in the monitor image, all connectable supply lines from the nozzle to the processing liquid supply source are displayed as an image, and when one of the supply lines is selected. The image of the other supply line is erased to identify the supply line, and then, when the drain port is selected, all drain lines that are allowed to be combined with and connected to the selected supply line are imaged. When one of the drainage lines is displayed, the image of the other drainage line is erased, and the actual setting of the supply line and drainage line selected above is performed. Therefore, even if there are many types of processing liquids and the number of lines that can be selectively used and it is difficult to understand the connection system when setting them, make sure to set the steps correctly without making a mistake in the piping and processing liquids. You can Therefore, the connectable pipes can be easily changed.

Further, in relation to the previously selected supply line, only the drainage line which is allowed to be combined with and connected to the supply line is displayed as an image, and one of the drainage lines is selected. Therefore, the combination of connections that cannot be actually selected is eliminated, and the discharge line selection setting becomes easy.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In this embodiment, a case where the semiconductor wafer cleaning / drying apparatus is applied will be described.

FIG. 1 is a schematic block diagram showing an example of a cleaning / drying processing apparatus to which the liquid processing apparatus according to the present invention is applied.
[FIG. 3] is a schematic piping diagram showing a piping system of a processing liquid in a liquid processing apparatus.

As shown in FIG. 1, the liquid processing apparatus 20 has a rotatable holding means for holding a wafer W to be processed, for example, a rotor 21, and a drive for rotationally driving the rotor 21 about a horizontal axis. An inner chamber 23 and an outer chamber 24 of a plurality of, for example, two processing units (specifically, the first processing chamber and the second processing chamber) surrounding the wafer W held by the motor 22 and the rotor 21, which is a means. And the wafer W housed in the inner chamber 23 or the outer chamber 24.
On the other hand, a supply means 50 of a treatment liquid such as a resist stripping liquid and a polymer removing liquid, a supply means 60 of a solvent of the chemical liquid such as isopropyl alcohol (IPA), a supply means of a rinse liquid such as pure water (a rinse liquid supply means). ) 70 or a supply means 80 of an inert gas such as nitrogen (N2) or a dry gas (dry fluid) such as clean air (in FIG. 1, the chemical solution supply means 50 and the dry fluid supply means 80 are shown. }, And moving means for switching and moving the inner cylindrical body 25 forming the inner chamber 23 and the outer cylindrical body 26 forming the outer chamber 24 to the surrounding position of the wafer W and the standby position separated from the surrounding position of the wafer W, for example, 1, second cylinder 27, 28 and wafer W
Is transferred from the wafer transfer chuck (not shown) to the rotor 21 and is transferred to the wafer transfer chuck from the rotor 21. The object transfer means, for example, the wafer transfer hand 29, constitutes a main part.

The motor 22 in the liquid processing apparatus 20 configured as described above, the processing fluid supply means 50, 60,
70, 80 {In FIG. 1, the chemical liquid supply means 50 and the dry fluid supply means 80 are shown. } Supply unit, wafer delivery hand 29, etc. are controlled by a control unit 30 including a control means, for example, a central processing unit (CPU) as a main component and a memory (ROM, RAM).

The rotor 21 is cantilevered to a drive shaft 22a of a horizontally arranged motor 22.
The processing surface of the wafer W is held so as to be vertical, and is formed so as to be rotatable around a horizontal axis. In this case, the rotor 21 includes a first rotary plate 21a having a rotary shaft (not shown) connected to the drive shaft 22a of the motor 22 via a coupling (not shown), and the first rotary plate 21a. 21a
A second rotary plate 21b facing the above, a plurality of, for example, four fixed holding bars 31 installed between the first and second rotary plates 21a and 21b, and holding grooves arranged in rows in these fixed holding bars 31. It is composed of a pair of presser bars 32 which are switched between a pressing position and a non-pressing position by lock means and lock releasing means (not shown) that presses the upper portion of the wafer W held by (not shown). In this case, the motor 22 is controlled so that predetermined high speed rotation and low speed rotation can be selectively repeated based on a program stored in the control device 30 in advance. Therefore, since the motor 22 may be overheated by switching between high speed rotation and low speed rotation many times, the motor 22 is provided with the cooling means 37 for suppressing overheating. This cooling means 3
As shown in FIG. 1, the cooling pipe 37a is provided with a circulating cooling pipe 37a arranged around the motor 22, a part of the cooling pipe 37a and a part of the cooling water supply pipe 37b. And a heat exchanger 37c that cools the refrigerant liquid enclosed therein.

On the other hand, a processing unit such as the inner chamber 23 (first
Between the first fixed wall 34, the second fixed wall 38 facing the first fixed wall 34, and the first fixed wall 34 and the second fixed wall 38. The inner cylinder 25 is engaged with the first and second seal members 40a and 40b, respectively. That is, the inner cylinder 25 is
The first cylinder 27, which is a moving unit, is moved to a position that surrounds the wafer W together with the rotor 21 by the extension operation of the first cylinder 27, and the first seal member 40 a is formed between the first cylinder 27 and the first fixed wall 34.
The inner chamber 23 (first processing chamber) is formed in a state of being sealed with the second fixing member 38 via the second sealing member 40b. Further, the contraction operation of the first cylinder 27 is configured to move it to the outer peripheral side position (standby position) of the fixed cylindrical body 36. In this case, the front end opening of the inner tubular body 25 is sealed with the first fixed wall 34 via the first sealing member 40a, and the base end of the inner tubular body 25 is an intermediate portion of a fixed tubular body (not shown). It is sealed via a third seal member (not shown) provided around the portion to prevent the atmosphere of the chemical solution remaining in the inner chamber 23 from leaking to the outside.

The outer chamber 24 (second processing chamber)
Is a first fixed wall 34, a second fixed wall 38, a second fixed wall 38, and an inner tubular body 25 with a seal member 40b interposed between the inner tubular body 25 and the inner tubular body 25 moved to the standby position. And an outer cylindrical body 26 which is engaged with each other via the fourth and fifth sealing members 40d and 40e. That is, the outer cylinder body 26 is moved to a position surrounding the wafer W together with the rotor 21 by the extension operation of the second cylinder 28 that is the moving means, and the fourth seal member is formed between the outer cylinder body 26 and the second fixed wall 38. The outer chamber 24 (second processing chamber) in a state of being sealed via the fifth sealing member 40e located outside the front end portion of the inner tubular body 25 while being sealed via the 40d.
To form. Further, the contraction operation of the second cylinder 28 is configured to move to the outer peripheral side position (standby position) of the fixed cylindrical body 36. In this case, a fifth seal member 40e is interposed between the outer cylinder body 26 and the inner cylinder body 25 so as to seal them. Therefore, the inner atmosphere of the inner chamber 23 and the inner atmosphere of the outer chamber 24 are separated from each other in an air-tight manner, so that both chambers 23, 24 are separated.
It is possible to prevent cross-contamination caused by reaction of different processing fluids without mixing the atmosphere inside.

Both the inner cylindrical body 25 and the outer cylindrical body 26 configured as described above are formed in a tapered shape that widens toward the tip. In this way, by forming the inner tubular body 25 and the outer tubular body 26 in a tapered shape that widens toward one end,
An air flow generated when the rotor 21 is rotated in the inner tubular body 25 or the outer tubular body 26 during processing flows spirally to the expansion side, and it is possible to easily discharge the internal chemical liquid or the like to the expansion side. . Further, the inner tubular body 25 and the outer tubular body 26 are structured such that the inner tubular body 25 and the outer tubular body 26 are superposed on the same axis.
Also, the installation space for the inner chamber 23 and the outer chamber 24 can be reduced, and the device can be downsized.

On the other hand, among the above-mentioned processing liquid supply means, the supplying means 50 for supplying a chemical solution, for example, a polymer removal solution, has a chemical solution supply nozzle 51 mounted in the processing section, that is, the inner cylinder 25, and a chemical solution supply means, as shown in FIG. It is provided with a portion 52 and a chemical liquid supply conduit 53 connecting the chemical liquid supply nozzle 51 and the chemical liquid supply portion 52.

As shown in FIG. 3, the chemical liquid supply section 52 stores the chemical liquid supply source 3 (liquid supply source) and a new chemical liquid supplied from the chemical liquid supply source 3 and is used for processing. The main part is composed of the tank 10 that stores the chemical liquid.

The tank 10 contains an inner tank 1 for storing a new liquid which is connected to a chemical liquid supply source 3 via a chemical liquid pipe 3b provided with a chemical liquid opening / closing valve 3a, and the inner tank 1 is housed inward. It has a double tank structure including an outer tank 2. In this case, the inner tank 1 is formed of a bottomed cylindrical stainless steel container. Also, the outer tank 2
Is formed of a bottomed cylindrical stainless steel container having a large-diameter body portion, a small-diameter opening portion, and a shoulder portion that gradually narrows toward the opening portion. Here, the reason why the shoulder portion is gradually tapered toward the opening is that the outer tank 2 is
This is to prevent air from accumulating in the shoulder portion during the process in which the drug solution stored therein fills the opening. Further, on the outer peripheral surface of the outer tank 2, a heater 4 as a heating means is arranged so as to surround the outer tank 2.

In this case, an overflow pipe line 5 is provided at the upper end of the inner tank 1 for supplying the chemical liquid overflowing from the inner tank 1 into the outer tank 2. Therefore, after the new chemical liquid supplied from the chemical liquid supply source 3 into the inner tank 1 is filled in the inner tank 1, it is supplied into the outer tank 2 via the overflow pipe line 5. Further, as shown in FIG. 3, the gap between the opening of the outer tank 2 and the inner tank 1 is narrow. As the gap between the inner tank 1 and the outer tank 2 is narrower, the area of the liquid surface of the chemical solution stored in the outer tank 2 that is in contact with the outside air can be reduced, so that the chemical reaction or deterioration due to the contact of the chemical solution with air can be reduced. This is because it is possible to suppress the above and maintain the quality and performance of the chemical liquid.

A purge gas supply pipeline 6 and a gas vent pipeline 6A are connected to the openings of the inner tank 1 and the outer tank 2 so that the chemicals stored in both tanks 1 and 2 are exposed to the outside air. In order to prevent the atmosphere from changing,
A purge gas, such as N2 gas, is supplied from a purge gas supply conduit 6 connected to a purge gas supply source such as an inert gas, such as N2 gas. It should be noted that the electrostatic capacity type upper limit sensor 7a, the weighing sensor 7b, and the heater off lower limit sensor 7 are provided in the outer proximity portions of the outer tank 2, respectively.
c and a lower limit sensor 7d are provided, and these sensors 7a to 7d are connected to a control device (control unit) 30 mainly composed of a CPU. In this case, the sensors 7a-7
d does not necessarily have to be a capacitance type and may be any other type of sensor as long as it can detect the liquid surface. Of these sensors 7a to 7d, the upper limit sensor 7a and the lower limit sensor 7d detect the upper limit liquid level and the lower limit liquid level of the chemical liquid stored in the outer tank 2, and the weighing sensor 7b actually detects the liquid level in the outer tank 2. Detects the amount of drug solution stored,
The heater-off lower limit sensor 7c can detect the amount of the chemical liquid that can be heated by the heater 4. In addition,
A chemical liquid full sensor is arranged at the upper end portion of the inner tank 1, and the state of the chemical liquid flowing from the inside tank 1 to the outside tank 2 can be monitored by this chemical liquid full sensor. That is, the control unit 3 is based on the detection signals from the liquid chemical full sensor and the weighing sensor 7b.
By transmitting the control signal from 0 (CPU) to the chemical liquid opening / closing valve 3a, the liquid amount of the chemical liquid in the inner tank 1 and the outer tank 2 can be managed.

The chemical solution stored in the inner tank 1 and the chemical solution stored in the outer tank 2 are
One heater 4 disposed in the outer vicinity of the above is used to heat and keep warm. In this case, the temperature of the chemical liquid in the inner tank 1 is detected by the inner tank chemical liquid temperature sensor Ta, the temperature of the chemical liquid in the outer tank 2 is detected by the outer tank chemical liquid temperature sensor Tb, and the temperature of the heater 4 is The control temperature sensor Tc and the overheat temperature sensor Td are used for detection. Of these temperature sensors Ta to Td, the outer tank chemical liquid temperature sensor Tb and the control temperature sensor Tc
And the detection signal of the overheat temperature sensor Td is controlled by the temperature control unit to control the temperature of the chemical liquid in the outer tank 2 and the heater 4.
Heating temperature of the specified temperature, that is, 80 ℃ <T1 <15
It can be set to 0 ° C.

Thus, the temperature T of the chemical solution in the outer tank 2 is
By controlling 1 to a predetermined temperature, that is, 80 ° C. <T1 <150 ° C., the temperature T0 of the chemical liquid in the inner tank 1 is set to a temperature substantially equal to T1 by the heat capacity of the temperature T1 of the chemical liquid in the outer tank 2. can do.

On the other hand, as shown in FIGS. 1 and 3, the inner tank 1 is provided with a chemical liquid supply conduit 53 for connecting the chemical liquid supply nozzle 51 mounted in the processing section, that is, the inner cylindrical body 25, and the chemical liquid supply section 52. A first supply pipeline 14a for supplying the chemical solution inside to the processing section side, a second supply pipeline 14b for supplying the chemical solution inside the outer tank 2 to the processing section side, and the first and second
The main supply pipe line 14c is formed mainly by connecting the supply pipe lines 14a and 14b in common. In this case, the first switching on-off valve 15a is interposed in the first supply pipeline 14a, and the second switching on-off valve 15b is disposed in the second supply pipeline 14b.
Is installed. A diaphragm type supply pump 16 is provided in the main supply line 14c, and
A third switching opening / closing valve 15c, a filter 17, and a fourth switching opening / closing valve 15d are sequentially provided on the discharge side of the supply pump 16.

The discharge side of the supply pump 16 in the main supply line 14c and the outer tank 2 are connected to a circulation line 18 with a fifth switching valve 15e interposed therebetween. It is configured so that the supplied chemical liquid can be circulated.

The discharge side of the supply pump 16 in the main supply line 14c (specifically, between the supply pump 16 and the third switching on-off valve 15c) and the discharge side of the third switching on-off valve 15c. A bypass conduit 19 that branches from the main supply conduit 14c and is connected to the main supply conduit 14c again is connected to the connection portion of the circulation conduit 18. This bypass line 1
A ninth switching on-off valve 15f, a filter 19a, and a seventh switching on-off valve 15g are sequentially provided in the valve 9. Also,
A return line 56 for the chemical liquid via a switching valve V1 is connected to the opening of the outer tank 2 and the processing unit, and the chemical liquid used for processing in the processing unit is stored in the outer tank 2. It is ready for recycling.

By forming the chemical liquid supply conduit 53 as described above, the chemical liquid stored in the outer tank 2 is supplied to the second supply conduit 14b, the main supply conduit 14c, the bypass conduit 19 and the main supply. It can be supplied to the processing section side via the conduit 14c. Further, the chemical liquid (new liquid) stored in the inner tank 1 can be supplied to the processing section side via the first supply pipeline 14a and the main supply pipeline 14c. Further, during the standby of the processing of the wafer W, the chemical liquid stored in the outer tank 2 can be circulated through the circulation pipe line 18.

A drain pipe 58 having a drain opening / closing valve 57 is connected to the bottom of the outer tank 2 and is further connected to a drain pipe 59 (see FIG. 3).

On the other hand, as shown in FIG. 2, the supply means 60 for the solvent of the chemical solution, for example, IPA, is a supply nozzle 51 (also referred to below as the chemical solution supply nozzle 51, which also functions as the chemical solution supply nozzle mounted in the inner cylindrical body 25). And the solvent supply unit 6
1, a pump 54, a filter 55, and an IPA supply valve 63 which are provided in an IPA supply pipe line 62 connecting the supply nozzle 51 and the chemical liquid supply section 52. in this case,
The solvent supply unit 61 includes a supply source 64 for a solvent, such as IPA,
An IPA supply tank 61a for storing new IPA supplied from the IPA supply source 64, and an IP used for processing
A circulating supply tank 61b for storing A is connected to both the IPA supply tanks 61a and 61b, which are connected to a first drainage port 41 provided under the expansion side portion of the inner chamber 23. The switching valve V2 is connected to the first drainage pipe 42.
The circulation line 90 is connected via. The first drainage conduit 42 is connected to the drainage conduit 42A via the switching valve V3, and another drainage conduit 59 is connected via the switching valve V4.
(See FIG. 1).

On the other hand, a rinsing liquid, for example, pure water supply means 70.
2, is a pure water supply nozzle 71 attached to the second fixed wall 38, a pure water supply source 72, and a pure water supply connecting the pure water supply nozzle 71 and the pure water supply source 72. It is provided with a supply pump 74 and a pure water supply valve 75 provided in the pipe 73. In this case, the pure water supply nozzle 71 is located outside the inner chamber 23 and the outer chamber 24.
Is arranged so that it can be located inside the
When the outer cylinder body 26 moves to a position surrounding the rotor 21 and the wafer W to form the outer chamber 24, the outer cylinder body 26 is located in the outer chamber 24 and is deionized with respect to the wafer W. Is configured to supply. The pure water supply nozzle 71 may be attached to the outer chamber 24.

A second drainage port 45 is provided in the lower portion of the expansion side portion of the outer chamber 24, and an opening / closing valve (not shown) is provided in the second drainage port 45. The second drainage pipe line 46 is connected. The second drainage conduit 46 has a resistivity meter 4 for detecting the resistivity value of pure water.
7 is interposed, and the specific resistance value of the pure water supplied to the rinsing process is detected by the specific resistance meter 47, and the signal is transmitted to the control device 30. Therefore, it is possible to monitor the condition of the rinsing process with the specific resistance meter 47 and terminate the rinsing process after the proper rinsing process is performed.

A second exhaust port 48 is provided in the upper portion of the expansion side portion of the outer chamber 24, and the second exhaust port 48 is provided with an opening / closing valve (not shown). Two exhaust pipe lines 49 are connected.

As shown in FIGS. 1 and 2, the drying fluid supply means 80 includes a drying fluid supply nozzle 81 attached to the second fixed wall 38 and a drying fluid such as nitrogen (N).
2) A supply source 82, an opening / closing valve 84, a filter 85, and an N2 temperature controller 86 provided in a drying fluid supply pipe 83 connecting the drying fluid supply nozzle 81 and the N2 supply source 82. A branch line 88 branched from the IPA supply line 62 is connected via a switching valve 87 to the secondary side of the N2 temperature controller 86 in the dry fluid supply line 83. In this case, the dry fluid supply nozzle 81 is located outside the inner chamber 23 as well as the pure water supply nozzle 71, and is arranged so as to be located inside the outer chamber 24. Is retracted to the standby position and the outer cylinder 2
When 6 moves to a position surrounding the rotor 21 and the wafer W to form the outer chamber 24, it is located in the outer chamber 24 and supplies a mixed fluid of N 2 gas and IPA to the wafer W in a mist state. Is configured to be able to. In this case, N
After drying with a mixed fluid of 2 gases and IPA, further drying is performed only with N2 gas. Although the case where the dry fluid is a mixed fluid of N2 gas and IPA has been described here, only N2 gas may be supplied instead of the mixed fluid.

The chemical solution supply means 50, the IPA supply means 60, the pure water supply means 70, and the dry fluid supply means 80.
Of the supply pumps 16, 54 and the chemical liquid supply section 52 in
~ Seventh switching on-off valves 15a to 15g, temperature controller 56,
N2 temperature controller 86, IPA supply valve 63 and switching valve 87
Are controlled by the control device 30 (see FIG. 1).

Next, the operation mode of the cleaning / drying processing apparatus will be described. First, the wafer W transferred by the wafer transfer chuck from the loading / unloading unit (not shown) side is located above the processing apparatus 20, that is, the inner cylindrical body 25 and the outer cylindrical body 26.
Is conveyed to a position above the rotor 21 in a state where it is retracted to the standby position. Then, the wafer delivery hand 29 rises,
After receiving the wafer W transferred by the wafer transfer chuck 10 and then descending to transfer the wafer W onto the fixed holding rod 31 of the rotor 21, the wafer transfer hand 29 moves to the original position. After the wafer W is transferred onto the fixed holding rod 31 of the rotor 21, the locking means (not shown) is activated to move the wafer holding rod 32 to the upper edge portion of the wafer W to hold the upper portion of the wafer W.

When the wafer W is set on the rotor 21 as described above, the inner cylindrical body 25 and the outer cylindrical body 26 are moved to the rotor 2
1 and the wafer W is moved to a position surrounding the wafer W, and the wafer W is accommodated in the inner chamber 23. In this state, first, the chemical liquid is supplied to the wafer W to perform the chemical liquid treatment. In this chemical treatment, the rotor 21 and the wafer W are rotated at a low speed, for example, 1
After supplying the chemical solution for a predetermined time, for example, for several tens of seconds in a state of being rotated at ~ 500 rpm, the supply of the chemical solution is stopped, and thereafter,
Rotate the rotor 21 and the wafer W at high speed for several seconds, for example, 100
Rotate at ˜3000 rpm to shake off the chemical liquid adhering to the surface of the wafer W to remove it. The chemical liquid supply process and the chemical liquid shake-off process are repeated several to several thousand times to complete the chemical liquid treatment.

In the above chemical treatment step, the inner tank 1
In the normal process in which the chemical liquid is stored in the outer tank 2, the chemical liquid initially supplied is the chemical liquid stored in the outer tank 2. That is, the second, sixth, seventh and fourth switching on-off valves 15b, 15f, 15g, 15
By operating the supply pump 16 with the d opened, the chemical liquid in the outer tank 2 is transferred to the second supply pipeline 14b,
Main supply line 14c, bypass line 19 and main supply line 1
4c and is supplied to the processing unit side. At this time, the chemical liquid that has passed through the supply pump 16 is filtered by the filter 19a to remove impurities, contaminants, and the like mixed in the chemical liquid.
The first used chemical liquid within a certain period of time is discarded from the first drainage conduit 42. The other chemicals are treated for a certain period of time, then returned to the outer tank 2 and circulated thereafter.

After the chemical solution is circulated and processed for a predetermined time, the new chemical solution in the inner tank 1 is supplied to the processing section side, and the chemical solution processing is completed. When the new chemical liquid in the inner tank 1 is supplied to the processing unit side, the second, sixth and seventh switching on-off valves 15b, 15f, 15g are closed and the first, third and fourth switching on-off valves are opened. The valves 15a, 15c and 15d are opened. By operating the supply pump 16 in this state, the new chemical liquid in the inner tank 1 flows through the first supply pipe 14a and the main supply pipe 14c and is supplied to the processing section side. At this time, the new chemical liquid that has passed through the supply pump 16 is filtered by the filter 17 to remove impurities, contaminants and the like mixed in the chemical liquid. In addition, the main supply pipeline 14 that was supplied during the previous processing
The new chemical liquid remaining in c is filtered by the filter 17 together with the next new chemical liquid. The new chemical liquid used for the treatment is stored in the outer tank 2 via the return pipe line 56.

In the above description, the normal chemical solution treatment in which the chemical solution is stored in the inner tank 1 and the outer tank 2 has been described. However, the empty chemical solution is not stored in the inner tank 1 and the outer tank 2. In the state, the chemical treatment is performed as follows.

First, the chemical solution opening / closing valve 3a is opened to supply the chemical solution from the chemical solution supply source 3 into the inner tank 1, and the outer tank 2 from the inner tank 1 through the overflow pipe line 5.
A predetermined amount of drug solution is stored inside. And at the beginning of the process,
The new chemical liquid in the outer tank 2 is supplied to the processing unit side to perform the first chemical liquid treatment. After that, as in the case of the normal chemical solution treatment described above, after the chemical solution in the outer tank 2 is circulated and supplied, the new chemical solution in the inner tank 1 is supplied to the processing unit side, and the chemical solution processing is completed.

During the chemical solution treatment step, the chemical solution used for the chemical solution treatment is discharged to the first drain port 41, and the chemical solution is discharged through the return line 56 by the operation of the switching valve (not shown). While being circulated to the supply unit 52 or discharged to the first drainage pipe line 42, the gas generated from the chemical liquid is discharged from the first exhaust pipe line 44 via the first exhaust port 43.

After performing the chemical treatment, the IPA supply means 60 is used while the wafer W is still contained in the inner chamber 23.
After supplying the IPA from the chemical liquid supply nozzle 51 that also serves as the IPA supply nozzle at a low speed rotation of, for example, 1 to 500 rpm for a predetermined time of, for example, several tens of seconds, the supply of the IPA is stopped, and thereafter, the rotor 21 and the wafer. The W is rotated at a high speed for several seconds, for example, at 100 to 3000 rpm, and the IPA adhering to the surface of the wafer W is shaken off and removed.
The IPA supply step and the IPA shaking off step are repeated several times to several thousand times to complete the chemical solution removal process. Also in this chemical solution removal process, the IPA initially supplied is the IPA stored in the circulation supply tank 61b, as in the case of the chemical solution processing step, and the IPA initially used is the first drainage liquid. The IPA discarded from the pipe line 42 and used for the subsequent processing circulates and supplies the IPA stored in the supply tank 61b. Then, at the end of the chemical solution removal process, the new IP supplied from the IPA supply source 64 into the supply tank 61a
A is used, and the chemical solution removal process ends.

In the chemical solution removing process, the IPA used for the chemical solution removing process is discharged to the first drain port 41, and the solvent supply section 61 is operated by the operation of the switching valve (not shown).
While being discharged to the circulation pipeline 90 or the first drainage pipeline 42, the IPA gas is discharged from the first exhaust pipeline 44 via the first exhaust port 43.

After the chemical solution processing is completed, the inner cylinder 25 is retracted to the standby position, and the rotor 21 and the wafer W are moved to the outer cylinder 26.
The wafer W is enclosed by the outer chamber 24. Therefore, even if the liquid is dropped or dropped from the wafer W processed in the inner chamber 23, it can be received by the outer chamber 24. In this state, first, the wafer W rotated from the pure water supply nozzle 71 of the rinse liquid supply means.
A rinse solution, for example, pure water, is supplied to the rinsing process. Pure water that has been subjected to this rinse treatment and IP that has been removed
A is the second drainage line 46 via the second drainage port 45.
Emitted from. Further, the gas generated in the outer chamber 24 passes through the second exhaust port 48 and the second exhaust pipe line 49.
Is discharged from the outside.

After performing the rinsing process for a predetermined time in this way, the N 2 gas supply source 82 and the IPA supply source 64 of the dry fluid supply means 80 are used to supply N 2 while the wafer W is still contained in the outer chamber 24. By supplying a mixed fluid of gas and IPA to the rotating wafer W to remove pure water adhering to the wafer surface, the wafer W and the inside of the outer chamber 24 can be dried. Further, after the drying process is performed by the mixed fluid of N 2 gas and IPA, only the N 2 gas is supplied to the wafer W to dry the wafer W and the outer chamber 2.
The inside of 4 can be dried more efficiently.

As described above, the chemical treatment of the wafer W,
After the chemical removal process, rinse process and drying process are completed,
While the outer cylinder 26 is retracted to the standby position on the outer peripheral side of the inner cylinder 25, the unlocking means (not shown) is operated to retract the wafer retainer rod 32 from the retainer position of the wafer W. Then, the wafer delivery hand 29 rises to receive the wafer W held by the fixed holding rod 31 of the rotor 21 and receive the processing device 20.
Move above. The wafer W moved above the processing apparatus is received by the wafer transfer chuck, transferred to the loading / unloading section, and then transferred to the outside of the apparatus.

<Setting method of liquid processing apparatus> By the way,
Looking at the connection system of the above system centering on the supply nozzle and drain port, there are multiple pipes that can be connected to this, and one of them is selectively used, so the setting There are many places that are not easy to understand at times. For example, in the case of the supply nozzle 51, in addition to the supply lines of the chemical liquid supply pipeline 53 and the IPA supply pipeline 62, it is possible to connect the supply lines of the pure water supply pipeline 73 and the dry fluid supply pipeline 83. . Further, in the drainage port 41, a circulation pipeline 90 that forms a return pipeline for the solvent to the circulation supply tank 61b, a return pipeline 56 for the chemical liquid to the outer tank 2 of the chemical fluid supply unit 52, and a drainage pipe. The drain lines such as the lines 42 and 42A and the drain pipe line 59 can be connected.

Therefore, there is a possibility that the connection relations may be set incorrectly on the tabular recipe creation screen.

Therefore, according to the present invention, the recipe is displayed visually by displaying only the pipes that can be connected at the time of data setting and selectively setting one of the pipes on the graphical recipe creation screen. By making it easy to create, setting mistakes are prevented. In addition, the connectable pipes can be changed in the data table so that it can be handled even if the pipes change.

FIG. 4 shows a recipe screen image-displayed on the monitor 32 of the control device 30. This recipe screen is displayed by selecting the "recipe" key on the menu bar (not shown).

In the center of the recipe screen, a drawing creation area 100 in which a connection system such as an icon of a connection element or a connection line can be drawn is prepared in a large area.

A condition setting display field 101 is provided above the drawing creation area 100. In this condition setting display field 101, as a input setting area, "CHAMER" setting for inputting and setting whether the inner chamber or the outer chamber is set. Section 102, "low speed / high speed rotation repetition" setting section 103, which is input when using a low speed / high speed rotation repetition recipe for repeating while rotating the rotation of the rotor 21 between low speed rotation and high speed rotation, and the type of purge gas is input. “Purge” setting unit 104, “Rotation speed” setting unit 105 for inputting the rotor rotation speed, “Processing time” setting unit 106 for inputting the processing time of the step, and initial drainage time at the start of the step processing “ A drainage switching ”setting unit 107 is provided.
It is possible to input the respective set values into these respective input setting areas 102 to 107. Of these, "CH
The “AMER” setting section 102 and the “purge” setting section 104 are configured as pull-down menu bars, and when a black triangle mark is pressed, a list box is displayed and any menu bar can be selected. That is, "CHA
The inner chamber 23 or the outer chamber 24 can be selected as the type of the processing chamber for the "MER" input area, and the inert gas N2 or clean air as the type of the purge gas for the "purge" input area. Etc. can be selected.

Further, in the condition setting display field 101, as a display area, a "recipe number" display section 108 for displaying a recipe number of a recipe being prepared or registered, and a registered recipe ID (recipe name) are displayed. "Recipe I
The “D” display unit 109, the “hybrid” display unit 110, the “step number” display unit 111 that displays the total number of steps of the recipe that is being created, and the “Step No” display unit 112 that displays the step number that is being created It is provided.

On the other hand, on the right side of the screen, a "step-up" key 113 and a "step-down" with black triangles are attached.
A key 114 is provided, and by pressing this, it is possible to switch to a recipe creation screen of steps before and after this screen.

Further, on the right side of the screen, as a soft key for operation, a step to be inserted is selected, and "insert" is operated to insert a step before the specified step.
Key 115, a “delete” key 116 that is operated when selecting a step to be deleted and wants to delete the step, a “cancel” key 117 that is used when changing a discharge nozzle and a supply / drainage line during recipe creation, "Clear" key 118 to operate when initializing the content of the step, "register" to operate when saving the content after inputting and changing the step
A key 119 and a “return” key 120 which is operated when returning to the previous screen are provided.

In the drawing creation area 100, "CHAME
By selecting the inner chamber 23 in the “R” setting unit 102, as shown in FIG.
An image of the chamber unit 200 appears as shown in FIG. The chamber unit 200 has contours 223, 22 corresponding to the actual inner chamber 23 and outer chamber 24.
4 (hereinafter, simply referred to as inner chamber 223 and outer chamber 224) and the supply nozzle 51 located in the inner chamber 23.
And symbols 251 and 241 of the drainage port 41 (hereinafter simply referred to as the supply nozzle 251 and the drainage port 241).

When the supply nozzle 251 in the image of the chamber unit 200 is selected by a pointing device such as a mouse (not shown), all the processing liquid supply sources connectable to the supply nozzle 251 and the supply nozzles from these processing liquid supply sources. The supply line to 51 is displayed. In this embodiment, as shown in FIG. 5, as a processing liquid supply source, a dry fluid (for example, nitrogen N2) supply source 82 and a pure water supply source 7 are used.
2 icons 282 and 272 (hereinafter simply referred to as a dry fluid supply source 282 and a pure water supply source 272) connect supply lines 289 and 276 (the supply pipe line 89 and the supply pipe line 76) that connect them to the supply nozzle 251. Corresponding)).

Furthermore, an icon 210 of a tank 10 having an inner tank 1 and an outer tank 2 (hereinafter simply referred to as a tank 210 having a new liquid tank 201 and a recycle tank 202) as a treatment liquid supply source, and an IPA.
The icon 261 of the solvent supply unit 61 including the supply tank 61a and the circulation supply tank 61b (hereinafter simply referred to as the solvent supply tank 261 including the new liquid tank 261a and the recycle tank 261b) connects them to the supply nozzle 251. It is displayed together with the supply lines 253 and 262 (corresponding to the chemical liquid supply pipeline 53 and the IPA supply pipeline 62). However, as to which side of the new liquid tank 201 and the recycle tank 202 of this tank 210 is to be used, as shown in FIG. 5, the soft key 125 displayed below the icon 210 is operated by the pointing device. Can be switched by. Similarly,
Which side of the new solution tank 261a and the recycling tank 261b of the solvent supply tank 261 is used can be switched by operating the soft key 126 displayed below the icon 261 with the pointing device.

When the drainage port 241 in the image of the chamber unit 200 is selected with a pointing device such as a mouse (not shown), all drainage destinations connectable to this drainage port 241 and A drain line connecting the drain port 241 is displayed. In this embodiment, as shown in FIG.
10 recycle tank 202 (outer tank 2 of tank 10) and solvent supply tank 261 recycle tank 2
61b (circulation supply tank 61b of the solvent supply unit 61) connects the drainage port 41 to the drainage line 25.
6, 290 (corresponding to the chemical return line 56 and the circulation line 90).

Furthermore, as the drainage destinations 121 to 124,
Rinse Chemi (1) that drains, for example, IPA, which is used as an initial rinse after chemical liquid treatment, SOLVENT (1) that drains an organic chemical liquid, such as an amine-based or ammonia fluoride-based organic chemical liquid, for example, pure water as a rinse Dilution, which drains pure water mixed with chemicals when used, and Reclai, which drains reusable pure water
Four types of m are displayed together with the drain lines 242 and 259 (corresponding to the drain conduit 42 and the drain conduit 59) connecting them to the drain port 41.

FIGS. 7 and 8 are flowcharts showing the procedure for creating a recipe for executing basic wafer processing.

In FIG. 7, first, a recipe screen is selected from the menu screen (step ST1). Select the "recipe" key to start creating the recipe (step ST2,
ST3). The program enters the step creation process of FIG. 8 (step ST4).

In the step creation process of FIG. 8, first, the spin chamber is selected (step ST4).
1). That is, the inner chamber 23 or the outer chamber 24 is selected from the pull-down menu for the above-mentioned "CHAMER" input area. Here, the inner chamber 23 is selected as an example. As shown in FIG. 4, an image of the chamber unit 200 appears.

Next, the supply nozzle (discharge nozzle) of the spin chamber unit is selected (step ST42).
Here, when the supply nozzle 251 is selected with the pointing device, all the processing liquid supply sources and the supply lines connectable thereto are displayed. That is, as shown in FIG. 9A, a dry fluid supply source 282 is used as a processing liquid supply source.
, Pure water supply source 272, new liquid tank 2 of tank 210
01 and the new liquid tank 261a of the solvent supply tank 261 connect them to the supply nozzle 251.
It is displayed together with 9,276,253,262. In addition,
New liquid tank 201 of tank 210 and recycling tank 2
02 and switching between the new liquid tank 261a and the recycle tank 261b of the solvent supply tank 261 can be performed by operating the soft keys 125 and 126 located below the tanks 210 and 261.

Next, the supply line used by the supply nozzle 251 is selected (step ST43). For example, when it is desired to use the new liquid tank 201 of the tank 210, first, the tank 210 is selected and activated, and the soft key 125 is operated to change its display to "N" (new liquid tank). Do that. FIG. 9B shows a state in which the new liquid tank 201 is selected. As shown, the dry fluid supply source 282, the supply source 272, the solvent supply tank 261 and their supply lines 289, 276, 262 are erased, and only the new liquid tank 201 of the tank 210 and its supply line 253 remain. When the dry fluid supply source 282 is selected, it becomes as shown in FIG. That is, the supply source 272, the solvent supply tank 261, their supply lines 276 and 262, and the new liquid tank 201 of the tank 210.
And its supply line 253 are erased and the dry fluid source 2
Only 82 and its supply line 289 remain.

Next, the processing time (second) of the step and the setting of the rotation speed (rpm) of the rotor are input (step S).
T44). For example, when 65 seconds is set as the processing time of the step and 35 rpm is set as the rotation speed of the rotor, “65” is input to the “processing time” setting section 106 and “35” is set to the “rotation speed” setting section 105. Enter ".

Next, the drainage port of the spin chamber unit is selected (step ST45). Here, when the drainage port 241 is selected with the pointing device, all drainage destinations and drainage lines connectable to this are displayed. That is, as shown in FIG. 10A, as a drainage destination, the recycle tank 202 of the tank 210, the recycle tank 261b of the solvent supply tank 261, and further the Rinse Chemi (1), SOLVENT (1), and Dilution. , Reclaim's four drain destinations 121-124 and drain port 2
Drainage lines 256, 290, 242, 259 connecting 41
Is displayed together with.

Next, the drain line used by the drain port 241 is selected (step ST46). For example, when the user wants to use the recycling tank 202 of the tank 210, the tank 210 is first selected and activated, and the soft key 125 is operated to change its display to "R" (recycling tank). . A state in which the recycle tank 202 is selected is shown in FIG. As illustrated, the drainage destinations 121 to 124 and the solvent supply tank 2
61 and their supply lines 242, 259, 290 are erased, leaving only the recycling tank 202 of the tank 210 and its drain line 256. Drainage destination 12 of SOLVENT (1)
When 2 is selected, it becomes as shown in FIG. That is, the drainage destinations 121, 123, 124, the tank 210, the solvent supply tank 261, and their drainage lines 242, 256, 290 are erased, and only the drainage destination 122 of SOLVENT (1) and its drainage line 259 are deleted. Remain.

Then, it is confirmed whether or not the next step is created (step ST47). When the next step is created, the "low speed / high speed rotation repetition" setting section 103 is checked to select the low speed / high speed rotation repetition recipe. When it is not created, the process ends without doing anything, and the process proceeds to step ST46 in FIG. Return.

When the low-speed / high-speed rotation repeating recipe is selected, the low-speed / high-speed rotation repeating recipe is repeated within the set value (second) input in the step time. For example, when the processing time of the low speed / high speed rotation repeating recipe is 15 seconds, the low speed / high speed rotation repeating processing that is repeated during the 65 seconds input in the step time is (65 seconds / 1
5 seconds = 4 times) The low speed / high speed rotation repeating recipe is operated four times. Note that the remaining time is processed at the rotation speed set by the rotor rotation speed.

With the above, the step processing of FIG. 8 is completed,
The program returns to step ST4 in FIG. Then, it is inquired whether or not to write the step created above (step ST5). When writing is not performed, that is, when the "cancel" key 117 is operated, the above step creation processing is repeated. On the other hand, when the step created above is written, that is, when the "registration" key 119 is operated, the content of the step is stored in the memory (not shown) of the control device 30 and the registration is executed.

After the registration is completed, a question is asked as to whether or not to create the next step (step ST6). If the next step is created, the process returns to step ST4. If the next step is not created, the recipe creation process is performed. finish.

FIG. 11 shows a state in which the supply line and the drain line are selected by the above setting management method. Figure 11
(A) shows a state in which the new liquid tank 201 of the tank 210 and its supply line 253 as the supply line system, and the cycle tank 202 of the tank 210 and its drain line 256 as the drain line system are selected and remain. Show. Figure 11
(B) shows a state in which the dry fluid supply source 282 and its supply line 289 are selected as a supply line system, and the cycle tank 202 of the tank 210 and its drain line 256 are selected and left as a drain line system. Then, FIG. 11C shows a dry fluid supply source 28 as a supply line system.
2 and its supply line 289, and as the drain line system, the drain destination 122 of SOLVENT (1) and its drain line 2
59 shows a state in which the selected item remains.

Thus, the connection of the line to the supply nozzle 51 and the drainage port 41 can be completed freely and easily.

After the recipe for processing the inner chamber 23 is set as described above, the processing recipe for the outer chamber 24 is performed in the same procedure, although the description is omitted here.

In the above embodiment, the supply nozzle 25
The case where the processing time of the step and the setting of the rotation speed of the rotor are input (step ST44) after selecting the supply line 1 to be used (step ST43) has been described. It is also possible to set the time and the rotation speed of the rotor. In this case, it is possible to simultaneously display the selection screen of the drainage port of the spin chamber unit in the next step (step ST45) simultaneously with the selection of the supply line.

In the above embodiments, the case where the liquid processing apparatus and the liquid processing method according to the present invention are applied to the cleaning / drying processing apparatus for semiconductor wafers has been described. However, it may be applied to LCD glass substrates other than semiconductor wafers. It is needless to say that the present invention can be applied to a liquid processing apparatus using a processing liquid such as a chemical liquid other than the cleaning / drying processing apparatus.

[0093]

As described above, according to the present invention, since it is configured as described above, the following effects can be obtained.

According to the present invention, by designating the nozzle in the monitor image, all connectable supply lines from the nozzle to the processing liquid supply source are displayed as an image, and when one of the supply lines is selected. The image of the other supply line is erased to identify the supply line, and then, when the drain port is selected, all drain lines that are allowed to be combined with and connected to the selected supply line are imaged. When one of the drainage lines is displayed, the image of the other drainage line is erased, and the actual setting of the supply line and drainage line selected above is performed. Therefore, even if there are many types of processing liquids and the number of lines that can be selectively used and it is difficult to understand the connection system when setting them, make sure to set the steps correctly without making a mistake in the piping and processing liquids. You can Therefore, the connectable pipes can be easily changed.

Further, in relation to the previously selected supply line, only the drainage line which is allowed to be combined with and connected to the supply line is displayed as an image, and one of the drainage lines is selected. Therefore, the combination of connections that cannot be actually selected is eliminated, and the discharge line selection setting becomes easy.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a cleaning / drying processing apparatus including a liquid processing apparatus to which a setting management method according to the present invention is applied.

FIG. 2 is a schematic piping diagram showing a processing liquid piping system of the liquid processing apparatus according to the embodiment of the present invention.

FIG. 3 is a schematic configuration diagram showing a main part of a liquid processing apparatus according to an embodiment of the present invention.

FIG. 4 is a diagram showing one step of a monitor screen for explaining the setting management method according to the present invention.

FIG. 5 is a diagram showing another step of the monitor screen for explaining the setting management method according to the present invention.

FIG. 6 is a diagram showing another step of the monitor screen for explaining the setting management method according to the present invention.

FIG. 7 is a diagram showing a recipe creation flow of the setting management method according to the present invention.

8 is a diagram showing a flow of step creation processing defined in the recipe creation flow of FIG.

FIG. 9 is a diagram showing selection of supply lines in the setting management method according to the present invention.

FIG. 10 is a diagram showing selection of a drainage line in the setting management method according to the present invention.

FIG. 11 is a view showing a state in which a supply line and a drain line of the setting management method according to the present invention are selected.

[Explanation of symbols]

10 tanks 14a First supply line 14b Second supply line 14c Main supply line 20 liquid treatment equipment 23 Internal chamber (processing unit) 24 Outer chamber (processing unit) 30 control device (control means) 32 monitors 42 First drainage line 42A drain line 46 Second drainage line 50 Supply Means (Medicinal Solution Supply Means) 51 Chemical supply nozzle (also serves as solvent supply nozzle) 52 Chemical supply unit 53 Chemical supply line 56 Return line for chemicals 59 Drainage line 60 IPA supply means 61 Solvent supply section 61a IPA supply tank 61b Circulation supply tank 62 IPA supply line 70 Supplying means (rinsing liquid supplying means) 71 Pure water supply nozzle 72 Pure water supply source 73 Pure water supply line 76 Supply pipeline 80 Supplying means (dry fluid supplying means) 81 Dry fluid supply nozzle 82 Dry Fluid Source eg Nitrogen (N2) Source 83 Dry fluid supply line 89 Supply line 90 circulation lines 100 drawing creation area 101 Condition setting display column 102 "CHAMER" setting section 103 "Low speed / high speed rotation repeat" setting section 104 "Purge" setting section 105 "Rotation speed" setting section 106 "Processing time" setting section 107 “Drainage switching” setting section 121-124 drainage destination 200 chamber unit 201 New liquid tank 202 recycling tank 210 tank 223 inner chamber 224 Outer chamber 242 drainage line 251 supply nozzle 253 supply line 256 drain line 259 drainage line 261 solvent supply tank 261a New liquid tank 261b Recycle tank 262 supply line 272 Pure water supply source 276 supply line 282 Dry fluid source 289 supply line 290 drain line

Claims (13)

[Claims] 1. A chamber for liquid-treating an object to be processed, a nozzle for supplying a processing liquid to the object to be processed in the chamber, and a plurality of processing liquid supply sources communicating with the nozzle via a plurality of supply lines. When a recipe is set, the chamber, the nozzle, the supply line, and the processing liquid supply source are provided with a monitor capable of displaying an image, and further, by designating the nozzle in the image of the monitor, the nozzle is displayed in the image. Image of all connectable supply lines from the processing liquid supply source to the processing liquid supply source, and when one of the supply lines displayed in this image is selected, the image of the selected supply line is left and the image of the other supply line is left. A liquid processing apparatus comprising a control means for erasing the liquid. 2. A chamber for liquid-treating an object to be treated, a drainage port for draining the treatment liquid supplied into the chamber from the chamber, and a chamber for communicating with the drainage port via a plurality of drainage lines. A plurality of drainage parts and a monitor capable of displaying the chamber, the drainage port, the drainage line, and the drainage part as an image when a recipe is set are further provided, and the drainage port in the image of the monitor is further provided. Is specified, all connectable drain lines from the drain port to the drain are displayed in the image, and when one of the drain lines displayed in this image is selected, A liquid processing apparatus comprising: a control unit that leaves an image of a drainage line and erases an image of another line. 3. A chamber for performing a liquid treatment on an object to be treated, a nozzle for supplying a treatment liquid to the object to be treated in the chamber, and a plurality of treatment liquid supply sources communicating with the nozzle via a plurality of supply lines. , A drainage port for draining the processing liquid supplied into the chamber from the chamber, a plurality of drainage parts communicating with the drainage port via a plurality of drainage lines, the chamber at the time of recipe setting, Nozzle, supply line,
A monitor capable of displaying an image of the treatment liquid supply source, the drainage port, the drainage line and the drainage part, and further, by designating the nozzle in the image of the monitor, the nozzle in the image is designated. Display all the connectable supply lines from the source to the supply source, and when one of the supply lines displayed in this image is selected, the image of the selected supply line is retained and the images of the other supply lines are erased. Then, when the drain port in the above image is selected, the combination with the selected supply line is allowed, and all drain lines that can be connected from the drain port to the drain portion are displayed as images. A liquid processing apparatus comprising means. 4. The liquid processing apparatus according to claim 1, wherein at least one of the plurality of processing liquid supply sources is a tank that stores the processing liquid, and the tank is used for the treatment. It has a new liquid tank that stores the new liquid that is not stored and a recycle tank that stores the recycled liquid that has been used as the treatment liquid, and the supply line can be connected to both the new liquid tank and the recycle tank. Liquid processing equipment. 5. The liquid processing apparatus according to claim 3, wherein at least one of the plurality of processing liquid supply sources is a tank that stores the processing liquid, and the tank stores new liquid that has not been supplied to the processing. Has a new liquid tank and a recycle tank for storing the recycled liquid used for the treatment, and the supply line can be connected to either the new liquid tank or the recycle tank, and at least one of a plurality of drain parts Is a liquid treatment device that can be connected to a recycling tank. 6. The liquid processing apparatus according to claim 1, wherein the plurality of processing liquid supply sources include a processing liquid supply source for supplying a processing liquid and a gas supply source for supplying a gas. Characteristic liquid treatment device. 7. The liquid processing apparatus according to claim 1, wherein the chamber has a dual structure of an inner chamber and an outer chamber, and the monitor is capable of displaying an image in each chamber. A liquid treatment apparatus characterized by the following. 8. A chamber for liquid-treating an object to be treated has a nozzle and a drain port, and the treatment liquid can be supplied to the nozzle from a plurality of treatment liquid supply sources via a plurality of selectable supply lines. In a liquid processing apparatus that discharges a processed processing liquid from a liquid discharging port to a tank or the outside through a plurality of liquid discharging lines that can be selected, control for setting and controlling the connection between the supply line and the liquid discharging line of the liquid processing apparatus By displaying the above chamber and the nozzles and drain ports provided in the chamber as an image on the monitor of the apparatus, and by specifying the nozzle in this image, the nozzles from the nozzle to the processing liquid supply source are displayed on the monitor screen. When all the supply lines that can be connected are displayed as images, and one of the supply lines in the image is selected,
The images of the other supply lines are erased while leaving the image of the selected supply line, and then when the drain port in the image is selected, the combination of the selected supply line is allowed on the monitor screen. When all drainage lines that can be connected are displayed as an image and one of the drainage lines is selected from the images,
A method for managing settings of a liquid processing apparatus, characterized in that an image of another discharge line is deleted while leaving an image of the selected discharge line, and actual setting of the supply line and the liquid discharge line selected as described above is performed. 9. The setting management method for a liquid processing apparatus according to claim 8, wherein one of the supply lines includes a recycling tank system. 10. The method for setting and managing a liquid processing apparatus according to claim 8, wherein the supply line is a dry fluid supply source, a pure water supply source, a new liquid tank of a chemical liquid, and a new liquid tank of a solvent to a nozzle. And a method for setting and managing a liquid processing apparatus, comprising: 11. The setting management method for a liquid processing apparatus according to claim 8 or 9, wherein one of the drain lines includes a recycling tank system. 12. The liquid management apparatus setting management method according to claim 8 or 11, wherein the drainage line connects a drainage port with a drainage recycling tank, a solvent recycling tank, and another drainage destination. A method of setting and managing a liquid processing apparatus, which includes a liquid line. 13. The method of setting and managing a liquid processing apparatus according to claim 8, wherein the chamber is composed of an inner chamber and an outer chamber, and the inner chamber is provided with the nozzle and a drain port. A method for setting and managing a liquid processing apparatus, which is characterized in that