JP3918981B2 - Liquid processing apparatus and setting management method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention provides a liquid processing apparatus Drain line More specifically, for example, the setting management of the recipe of a liquid processing apparatus that supplies a processing liquid such as a chemical solution to a target object such as a semiconductor wafer or a glass substrate for LCD and performs processing such as cleaning. It is about the method.
[0002]
[Prior art]
Generally, in a semiconductor device manufacturing process or an LCD manufacturing process, a resist adhering to an object to be processed (hereinafter referred to as a wafer or the like) such as a semiconductor wafer or LCD glass or a residue (polymer or the like) after dry processing is removed. In addition, a liquid processing apparatus (method) using a processing liquid or the like is widely used.
[0003]
In this type of conventional liquid processing apparatus, a cleaning processing method is known in which a new processing liquid used for processing is reused as a recycling liquid in order to effectively use an expensive processing liquid such as a chemical liquid. In the method using the recycle liquid and the new process liquid, two types of tanks for storing the new process liquid and the tank for storing the recycle liquid are prepared. For example, the wafer is After the primary treatment, the treatment liquid is effectively used by subjecting the new treatment liquid to the secondary treatment.
[0004]
Therefore, this type of liquid processing apparatus has a nozzle and a drain port in a chamber which is a processing chamber of an object to be processed, and receives processing liquid from a plurality of processing liquid supply sources via a plurality of supply lines selectable to the nozzle. In addition to being capable of being supplied, it has a configuration in which a processed processing liquid is discharged from a draining port to a tank or the outside through a plurality of draining lines that can be selected.
[0005]
Conventionally, the connection relations of these lines are set on a table-form recipe creation screen.
[0006]
[Problems to be solved by the invention]
However, when the piping connection system is viewed centering on the supply nozzle and drainage port to the chamber as the processing chamber, there are a plurality of pipes that can be connected to this, and one of them is selectively used. Therefore, there are not a few places that are difficult to understand when setting. For example, in the case of a supply nozzle, a supply line for a pure water supply line and a dry fluid supply line can be connected to the supply line for the chemical solution supply line and the IPA supply line. Also, the drainage port has a drainage line such as a circulation line that forms a return line for the solvent to the circulation supply tank, a return line for the chemical liquid to the outer tank of the chemical liquid supply unit, and a plurality of drainage pipes. Can be connected.
[0007]
Therefore, there is a possibility that the setting may be missed in the setting of the connection relation on the conventional tabular recipe creation screen.
[0008]
Therefore, in the present invention, the liquid recipe is set up so that the recipe can be created visually by displaying only the pipes that can be connected at the time of data setting and making it selectable on the graphical recipe creation screen. To provide a management method.
[0009]
[Means for Solving the Problems]
To achieve the above objective, The liquid processing apparatus according to claim 1, A chamber for liquid processing a target object; a nozzle for supplying a processing liquid to the target object in the chamber; a plurality of processing liquid supply sources communicating with the nozzle via a plurality of supply lines; A drainage port for draining the supplied processing liquid from the chamber; a plurality of drainage portions communicating with the drainage port via a plurality of drainage lines; and the chamber, nozzle, supply line, A monitor capable of displaying the processing liquid supply source, drainage port, drainage line, and drainage section as an image, and by specifying a nozzle in the monitor image, Display all of the connectable supply lines from the nozzle to the supply source. One Is selected, the image of the other supply line is deleted leaving the image of the selected supply line, and then the drainage port in the image is selected When All of the drainage lines that can be connected to the selected supply line and can be connected from the drainage port to the drainage unit are displayed as an image. When one of the drainage lines in the image is selected, the image of the other drainage line is deleted while leaving the image of the selected drainage line. Control means is provided.
[0010]
Claim 2 The liquid processing apparatus according to claim 1 In the liquid processing apparatus described above, at least one of the plurality of processing liquid supply sources includes a tank that stores the processing liquid. processing A new liquid tank for storing new liquid that has not been supplied to processing And a recycle tank for storing the recycle liquid supplied to the tank, and the supply line can be connected to either the new liquid tank or the recycle tank.
[0011]
Claim 3 The liquid processing apparatus according to claim 1 In the liquid processing apparatus described above, at least one of the plurality of processing liquid supply sources includes a tank that stores processing liquid. The tank stores a new liquid tank that stores unprocessed new liquid, and a processing liquid. A recycle tank that stores the supplied recycle liquid, the supply line can be connected to either the new liquid tank or the recycle tank, and at least one of the plurality of drainage parts can be connected to the recycle tank It is characterized by that.
[0012]
Claim 4 The liquid processing apparatus according to any one of claims 1 to 3 In the liquid processing apparatus according to any one of the above, the plurality of processing liquid supply sources includes a processing liquid supply source for supplying a processing liquid and a gas supply source for supplying a gas.
[0013]
Claim 5 The liquid processing apparatus according to any one of claims 1 to 4 In the liquid processing apparatus according to any one of the above, the chamber has a dual structure of an inner chamber and an outer chamber, and the monitor is capable of displaying an image in each chamber.
[0014]
Claim 6 In the setting management method of the liquid processing apparatus described above, a processing liquid is supplied from a plurality of processing liquid supply sources through a plurality of supply lines selectable to the nozzle, having a nozzle and a drain port in a chamber for liquid processing the object to be processed. In a liquid processing apparatus that discharges processed processing liquid from a drain port to a tank or the outside through a plurality of drain lines that can be selected, a supply line and a drain line of the liquid processing apparatus The monitor of the control device for setting and controlling the connection displays the chamber and the nozzles and drainage ports provided in the chamber as images. By designating the nozzles in the image, the monitor screen displays the nozzles. Display all of the connectable supply lines leading to the processing liquid supply source, and when one of the supply lines is selected, the image of the selected supply line is displayed. Erasing the image of the other supply line, and then, when the drainage port in the image is selected, the monitor screen, the supply line and combined as the selection is allowed connected drainage line possible all Is displayed, and when one of the drainage lines is selected, the selected Drain line Leave other images Drain line And the actual setting of the supply line and drainage line selected as described above is performed.
[0015]
Claim 7 The setting management method described in claim 6 In the setting management method for the liquid processing apparatus described above, one of the supply lines includes a recycling tank system.
[0016]
Claim 8 The setting management method described in claim 6 or 7 In the setting management method of the liquid processing apparatus described above, the supply line includes a dry fluid supply source, a pure water supply source, a new liquid tank for chemical liquid, and a supply line from a new liquid tank for solvent to a nozzle. .
[0017]
Claim 9 The setting management method described in claim 6 or 7 In the setting management method for the liquid processing apparatus described above, one of the drainage lines includes a recycling tank system.
[0018]
Claim 10 The setting management method described in claim 6 or 9 In the setting management method for the liquid processing apparatus described above, the drainage line includes a drainage recycling tank, a solvent recycling tank, and a drainage line connecting another drainage destination and a drainage port.
[0019]
Claim 11 The setting management method described in claim 6 to 10 In any one of the setting management methods, the chamber is composed of an inner chamber and an outer chamber, and the nozzle and the drainage port are provided in the inner chamber.
[0020]
According to the present invention, by designating the nozzle in the monitor image, all of the connectable supply lines from the nozzle to the processing liquid supply source are displayed as an image, and when one of the supply lines is selected, the other supply is displayed. The image of the line is erased to identify the supply line, and when the drainage port is selected, all of the drainage lines that are allowed to be combined with the selected supply line and can be connected are displayed as images. When one of the drainage lines is selected, the other Drain line And the actual setting of the supply line and drainage line selected above is performed. Therefore, even if there are many types of processing liquids and the number of lines that can be selectively used and it is difficult to understand the connection system at the time of setting, it is possible to set steps correctly without mistakes in piping and processing liquids. Can do. Therefore, the change of connectable piping can also be easily performed.
[0021]
In addition, in relation to the previously selected supply line, only the drainage line that is allowed to be combined with this and can be connected is displayed as an image, and one of the drainage lines is selected. Connection combinations that cannot actually be selected are eliminated, Drain line This makes it easy to select and set.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below in detail with reference to the drawings. In this embodiment, a case where the present invention is applied to a semiconductor wafer cleaning / drying processing apparatus will be described.
[0023]
FIG. 1 is a schematic configuration diagram illustrating an example of a cleaning / drying processing apparatus to which a liquid processing apparatus according to the present invention is applied, and FIG. 2 is a schematic piping diagram illustrating a piping system for processing liquid in the liquid processing apparatus.
[0024]
As shown in FIG. 1, the liquid processing apparatus 20 is a rotatable holding means for holding a wafer W as an object to be processed, for example, a rotor 21 and a driving means for rotationally driving the rotor 21 around a horizontal axis. An inner chamber 23 and an outer chamber 24 of a plurality of, for example, two processing units {specifically, a first processing chamber and a second processing chamber} surrounding the motor 22 and the wafer W held by the rotor 21, and these Supply means 50 for a chemical solution such as a processing solution such as a resist stripping solution and a polymer removal solution for the wafer W accommodated in the inner chamber 23 or the outer chamber 24, a supply means 60 for a solvent of this chemical solution such as isopropyl alcohol (IPA), A supplying means (rinsing liquid supplying means) 70 for rinsing liquid such as pure water or a supplying means 80 for supplying dry gas (dry fluid) such as inert gas such as nitrogen (N2) or clean air {FIG. 1 Then, the chemical solution supply means 50 and the dry fluid supply means 80 are shown. }, And a moving means for moving the inner cylinder 25 constituting the inner chamber 23 and the outer cylinder 26 constituting the outer chamber 24 to an enclosing position of the wafer W and a standby position away from the enclosing position of the wafer W, for example, The first and second cylinders 27, 28 and the wafer W are received from a wafer transfer chuck (not shown) and transferred to the rotor 21, and a workpiece transfer means such as a wafer transfer hand 29 is received from the rotor 21 and transferred to the wafer transfer chuck. The main part is composed of.
[0025]
In the liquid processing apparatus 20 configured as described above, each supply means 50, 60, 70, 80 of the processing fluid {the chemical liquid supply means 50 and the dry fluid supply means 80 are shown in FIG. }, The wafer delivery hand 29 and the like are controlled by a control device 30 which is mainly composed of control means such as a central processing unit (CPU) and includes a memory (ROM, RAM).
[0026]
The rotor 21 is connected in a cantilever manner to a drive shaft 22a of a motor 22 that is horizontally disposed so that the processing surface of the wafer W is vertical and can be rotated about the horizontal axis. Is formed. In this case, the rotor 21 includes a first rotating plate 21a having a rotating shaft (not shown) connected to the drive shaft 22a of the motor 22 via a coupling (not shown), and the first rotating plate. A second rotating plate 21b opposed to 21a, a plurality of, for example, four fixed holding rods 31 installed between the first and second rotating plates 21a, 21b, and holdings arranged in a row on these fixed holding rods 31 It is composed of a pair of presser bars 32 that are switched between a presser position and a non-presser position by a lock means (not shown) and a lock release means (not shown) that press the upper part of the wafer W held by a groove (not shown). In this case, the motor 22 is controlled such that predetermined high speed rotation and low speed rotation can be selectively repeated based on a program stored in the control device 30 in advance. Accordingly, since the motor 22 may be overheated by switching between high speed rotation and low speed rotation many times, the motor 22 is provided with a cooling means 37 for suppressing overheating. As shown in FIG. 1, the cooling means 37 is provided with a circulating cooling pipe 37a piped around the motor 22, a part of the cooling pipe 37a and a part of the cooling water supply pipe 37b. The heat exchanger 37c cools the refrigerant liquid sealed in the cooling pipe 37a.
[0027]
On the other hand, the processing unit, for example, the inner chamber 23 (first processing chamber) includes a first fixed wall 34, a second fixed wall 38 that faces the first fixed wall 34, and the first fixed wall 34. And the inner cylinder 25 that engages with the second fixed wall 38 via the first and second seal members 40a and 40b, respectively. That is, the inner cylinder 25 is moved to a position surrounding the wafer W together with the rotor 21 by the extension operation of the first cylinder 27 as a moving means, and the first seal member is interposed between the inner cylinder 25 and the first fixed wall 34. The inner chamber 23 (first processing chamber) is formed in a state of being sealed through the second fixing wall 38 and sealed with the second fixed wall 38. Further, the first cylinder 27 is configured to be moved to the outer peripheral side position (standby position) of the fixed cylinder 36 by the contraction operation of the first cylinder 27. In this case, the distal end opening of the inner cylinder 25 is sealed with the first fixed wall 34 via the first seal member 40a, and the base end of the inner cylinder 25 is the middle of the fixed cylinder (not shown). It is sealed via a third seal member (not shown) provided around the portion to prevent the chemical solution remaining in the inner chamber 23 from leaking outside.
[0028]
Further, the outer chamber 24 (second processing chamber) includes a first fixed wall 34 with a seal member 40b interposed between the inner cylinder 25 moved to the standby position, a second fixed wall 38, The outer cylinder body 26 is formed between the second fixed wall 38 and the inner cylinder body 25 through the fourth and fifth seal members 40d and 40e. That is, the outer cylinder 26 is moved to a position surrounding the wafer W together with the rotor 21 by the extension operation of the second cylinder 28 as a moving means, and the fourth seal member is interposed between the outer cylinder 26 and the second fixed wall 38. The outer chamber 24 (second processing chamber) is formed in a state of being sealed through the fifth sealing member 40e positioned outside the distal end portion of the inner cylindrical body 25 while being sealed through 40d. Further, the second cylinder 28 is configured to be moved to the outer peripheral side position (standby position) of the fixed cylinder 36 by the contraction operation of the second cylinder 28. In this case, a fifth seal member 40e is interposed between the base end portions of the outer cylinder body 26 and the inner cylinder body 25 and sealed. Therefore, the inner atmosphere of the inner chamber 23 and the inner atmosphere of the outer chamber 24 are separated from each other in an air-watertight state, so that different processing fluids react without the atmosphere in the chambers 23 and 24 being mixed. Cross contamination that occurs can be prevented.
[0029]
Both the inner cylinder body 25 and the outer cylinder body 26 configured as described above are formed in a tapered shape that expands toward the tip. Thus, when the inner cylinder 25 and the outer cylinder 26 are formed in a tapered shape that expands toward one end, the rotor 21 is rotated in the inner cylinder 25 or the outer cylinder 26 during processing. The generated airflow flows spirally to the expansion side, and the internal chemicals can be easily discharged to the expansion side. In addition, by setting the inner cylinder body 25 and the outer cylinder body 26 to be superposed on the same axis, the installation space for the inner cylinder body 25, the outer cylinder body 26, the inner chamber 23, and the outer chamber 24 can be reduced. In addition, the apparatus can be miniaturized.
[0030]
On the other hand, among the processing liquid supply means, a chemical liquid, for example, a polymer removal liquid supply means 50 includes, as shown in FIG. The chemical solution supply nozzle 53 and the chemical solution supply unit 52 are connected to each other.
[0031]
As shown in FIG. 3, the chemical liquid supply unit 52 stores a chemical liquid supply source 3 (liquid supply source) and a new chemical liquid supplied from the chemical liquid supply source 3 and also stores a chemical liquid used for processing. The main part is comprised with the tank 10 to perform.
[0032]
The tank 10 includes an inner tank 1 that stores a new liquid that is connected to a chemical liquid supply source 3 via a chemical liquid conduit 3b that includes a chemical liquid on-off valve 3a, and an outer tank 2 that accommodates the inner tank 1 inward. It is comprised in the double tank structure which consists of. In this case, the inner tank 1 is formed of a bottomed cylindrical stainless steel container. The outer tank 2 is formed of a bottomed cylindrical stainless steel container having a large-diameter trunk, a small-diameter opening, and a shoulder that is gradually narrowed toward the opening. Here, the shoulder portion is gradually narrowed toward the opening side in order to prevent air from accumulating in the shoulder portion in the process of filling the opening with the chemical solution stored in the outer tank 2. It is. A heater 4 as a heating unit is disposed on the outer peripheral surface of the outer tank 2 so as to surround the outer tank 2.
[0033]
In this case, an overflow line 5 for supplying a chemical solution overflowing from the inner tank 1 into the outer tank 2 is disposed at the upper end of the inner tank 1. Therefore, after the new chemical liquid supplied from the chemical liquid supply source 3 into the inner tank 1 is filled in the inner tank 1, it is supplied into the outer tank 2 via the overflow line 5. Further, as shown in FIG. 3, the gap between the opening of the outer tank 2 and the inner tank 1 is formed narrow. As the gap between the inner tank 1 and the outer tank 2 is narrower, the area of the liquid surface of the chemical liquid stored in the outer tank 2 that comes into contact with the outside air can be reduced. This is because the quality and performance of the chemical solution can be maintained.
[0034]
A purge gas supply line 6 and a gas vent line 6A are connected to the openings of the inner tank 1 and the outer tank 2, and the chemical solution stored in both the tanks 1 and 2 is exposed to the outside air to create an atmosphere. In order to prevent this change, purge gas such as N2 gas is supplied from a purge gas supply line 6 connected to a purge gas supply source such as an inert gas such as N2 gas (not shown). Capacitance type upper limit sensor 7a, weighing sensor 7b, heater-off lower limit sensor 7c, and lower limit sensor 7d are disposed in the outer proximity portion of outer tank 2, respectively, and these sensors 7a-7d are mainly composed of CPU. It is connected to the control device (control unit) 30 configured as described above. In this case, the sensors 7a to 7d do not necessarily have to be capacitive type, and may be other types of sensors as long as the liquid level can be detected. Among these sensors 7a to 7d, the upper limit sensor 7a and the lower limit sensor 7d detect the upper limit liquid level and the lower limit liquid level of the chemical liquid stored in the outer tank 2, and the weighing sensor 7b is actually installed in the outer tank 2. The amount of the stored chemical solution is detected, and the heater-off lower limit sensor 7 c can detect the amount of chemical solution that can be heated by the heater 4. A chemical solution full sensor is disposed at the upper end of the inner tank 1, and the state of the chemical solution flowing from the inner tank 1 into the outer tank 2 can be monitored by this chemical solution full sensor. Yes. That is, by transmitting a control signal from the control unit 30 (CPU) to the chemical solution opening / closing valve 3a based on the detection signal from the chemical solution full sensor and the weighing sensor 7b, the chemical solution in the inner tank 1 and the outer tank 2 is supplied. The amount can be managed.
[0035]
Further, the chemical solution stored in the inner tank 1 and the chemical solution stored in the outer tank 2 are heated and kept warm by one heater 4 disposed in the outer proximity portion of the outer tank 2. ing. In this case, the temperature of the chemical solution in the inner tank 1 is detected by the inner tank chemical solution temperature sensor Ta, the temperature of the chemical solution in the outer tank 2 is detected by the outer tank chemical solution temperature sensor Tb, and the temperature of the heater 4 is These are detected by the control temperature sensor Tc and the overheat temperature sensor Td. Among these temperature sensors Ta to Td, the temperature control unit controls the detection signals of the outer tank chemical temperature sensor Tb, the control temperature sensor Tc, and the overheat temperature sensor Td, and the chemical temperature in the outer tank 2 and the heating temperature of the heater 4 Can be set to a predetermined temperature, that is, 80 ° C. <T 1 <150 ° C.
[0036]
Thus, by controlling the temperature T1 of the chemical solution in the outer tank 2 to a predetermined temperature, that is, 80 ° C. <T1 <150 ° C., the temperature T0 of the chemical solution in the inner tank 1 is changed to the temperature of the chemical solution in the outer tank 2. The temperature can be set approximately equal to T1 by the heat capacity of T1.
[0037]
On the other hand, as shown in FIGS. 1 and 3, the chemical solution supply nozzle 53 connected to the processing unit, that is, the chemical solution supply nozzle 51 mounted in the inner cylinder 25, and the chemical solution supply unit 52 is a chemical solution in the inner tank 1. A first supply pipe 14a for supplying the liquid to the processing section, a second supply pipe 14b for supplying the chemical in the outer tank 2 to the processing section, and the first and second supply pipes 14a, It is mainly configured by a main supply pipe 14c that connects and shares 14b. In this case, a first switching opening / closing valve 15a is interposed in the first supply line 14a, and a second switching opening / closing valve 15b is interposed in the second supply line 14b. Further, for example, a diaphragm type supply pump 16 is interposed in the main supply line 14c, and a third switching on / off valve 15c, a filter 17, a fourth switching on / off valve are sequentially arranged on the discharge side of the supply pump 16. 15d is interposed.
[0038]
Further, the discharge side of the supply pump 16 in the main supply line 14c and the outer tank 2 are connected to a circulation line 18 provided with a fifth switching on / off valve 15e, and supplied from the outer tank 2. It is comprised so that a chemical | medical solution can be circulated.
[0039]
Further, the discharge side of the supply pump 16 in the main supply line 14c {specifically, between the supply pump 16 and the third switching valve 15c}, the discharge side of the third switching valve 15c, and the circulation line A bypass line 19 that is branched from the main supply line 14c and connected to the main supply line 14c is connected to the connection part 18. In the bypass line 19, a sixth switching on-off valve 15f, a filter 19a, and a seventh switching on-off valve 15g are sequentially provided. A chemical return pipe 56 is connected to the opening and the processing portion of the outer tank 2 via a switching valve V1 so that the chemical solution used for processing in the processing portion is stored in the outer tank 2. And is now available for recycling.
[0040]
By forming the chemical solution supply line 53 as described above, the chemical solution stored in the outer tank 2 is supplied to the second supply line 14b, the main supply line 14c, the bypass line 19, and the main supply line 14c. Can be supplied to the processing unit side. Moreover, the chemical | medical solution (new liquid) stored in the inner side tank 1 can be supplied to the process part side via the 1st supply pipeline 14a and the main supply pipeline 14c. Further, at the time of standby for processing the wafer W, the chemical liquid stored in the outer tank 2 can be circulated through the circulation pipe 18.
[0041]
In addition, a drainage pipe 58 provided with a drainage on / off valve 57 is connected to the bottom of the outer tank 2 and further connected to a drainage pipe 59 (see FIG. 3).
[0042]
On the other hand, as shown in FIG. 2, a chemical solution solvent, for example, IPA supply means 60 is provided with a supply nozzle 51 (hereinafter represented by the chemical solution supply nozzle 51) that also serves as the chemical solution supply nozzle mounted in the inner cylinder 25. , A solvent supply unit 61, and a pump 54, a filter 55, and an IPA supply valve 63 provided in an IPA supply line 62 connecting the supply nozzle 51 and the chemical solution supply unit 52. In this case, the solvent supply unit 61 includes a supply source 64 of a solvent, for example, IPA, an IPA supply tank 61a for storing new IPA supplied from the IPA supply source 64, and a circulation supply for storing IPA used for processing. The first drainage pipe connected to the first drainage port 41 provided in the lower part of the expansion side portion of the inner chamber 23 is formed in both the IPA supply tanks 61a and 61b. A circulation line 90 is connected to the path 42 via a switching valve V2. The first drain line 42 is connected to the drain line 42A via the switching valve V3, and is connected to another drain line 59 via the switching valve V4 (FIG. 1). reference).
[0043]
On the other hand, as shown in FIG. 2, the rinsing liquid, eg, pure water supply means 70 includes a pure water supply nozzle 71 attached to the second fixed wall 38, a pure water supply source 72, a pure water supply nozzle 71, and a pure water. It comprises a supply pump 74 and a pure water supply valve 75 that are provided in a pure water supply pipe 73 that connects to a water supply source 72. In this case, the pure water supply nozzle 71 is disposed outside the inner chamber 23 and so as to be located inside the outer chamber 24, and the inner cylinder 25 moves backward to the standby position, and the outer cylinder When the body 26 moves to a position surrounding the rotor 21 and the wafer W to form the outer chamber 24, the body 26 is located in the outer chamber 24 and is configured to supply pure water to the wafer W. Yes. The pure water supply nozzle 71 may be attached to the outer chamber 24.
[0044]
Further, a second drain port 45 is provided at the lower part of the expansion side portion of the outer chamber 24, and the second drain port 45 is provided with a second drain valve that is not shown. A drain line 46 is connected. The second drain 46 is provided with a specific resistance meter 47 for detecting the specific resistance value of pure water, and the specific resistance of the pure water subjected to the rinsing process by the specific resistance meter 47. A value is detected and the signal is transmitted to the control device 30. Accordingly, the state of the rinsing process is monitored by the specific resistance meter 47, and after the appropriate rinsing process is performed, the rinsing process can be terminated.
[0045]
A second exhaust port 48 is provided in the upper part of the expansion side portion of the outer chamber 24, and the second exhaust port 48 is provided with a second exhaust through an on-off valve (not shown). A pipe line 49 is connected.
[0046]
1 and 2, the drying fluid supply means 80 includes a drying fluid supply nozzle 81 attached to the second fixed wall 38, a drying fluid, for example, nitrogen (N2) supply source 82, and a drying fluid supply. An on-off valve 84, a filter 85, and an N2 temperature regulator 86 are provided in a dry fluid supply line 83 connecting the nozzle 81 and the N2 supply source 82, and the N2 in the dry fluid supply line 83 is provided. A branch line 88 branched from the IPA supply line 62 is connected to the secondary side of the temperature regulator 86 via a switching valve 87. In this case, the dry fluid supply nozzle 81 is located outside the inner chamber 23 as well as the pure water supply nozzle 71, and is disposed so as to be located inside the outer chamber 24. Is retracted to the standby position, and the outer cylinder 26 moves to a position surrounding the rotor 21 and the wafer W to form the outer chamber 24. And a mixed fluid of IPA can be supplied in a mist form. In this case, after drying with a mixed fluid of N2 gas and IPA, drying is further performed only with N2 gas. Although the case where the dry fluid is a mixed fluid of N2 gas and IPA has been described here, only the N2 gas may be supplied instead of the mixed fluid.
[0047]
The chemical liquid supply means 50, the IPA supply means 60, the pure water supply means 70, the supply pumps 16 and 54 in the dry fluid supply means 80, the first to seventh switching on / off valves 15a to 15g of the chemical liquid supply section 52, the temperature The regulator 56, the N2 temperature regulator 86, the IPA supply valve 63, and the switching valve 87 are controlled by the control device 30 (see FIG. 1).
[0048]
Next, an operation mode of the cleaning / drying processing apparatus will be described. First, the rotor 21 with the wafer W transferred by the wafer transfer chuck from the loading / unloading unit (not shown) side above the processing apparatus 20, that is, the inner cylinder 25 and the outer cylinder 26 are retracted to the standby position. To the upper position. Then, the wafer delivery hand 29 is raised to receive the wafer W carried by the wafer carrying chuck 10, and then lowered to deliver the wafer W onto the fixed holding rod 31 of the rotor 21, and then the wafer delivery hand 29. Move to the original position. After delivering the wafer W onto the fixed holding rod 31 of the rotor 21, a locking means (not shown) is operated, and the wafer pressing rod 32 moves to the upper edge of the wafer W to hold the upper portion of the wafer W.
[0049]
When the wafer W is set on the rotor 21 as described above, the inner cylinder 25 and the outer cylinder 26 move to a position surrounding the rotor 21 and the wafer W, and the wafer W is accommodated in the inner chamber 23. . In this state, first, a chemical solution is supplied to the wafer W to perform a chemical treatment. In this chemical treatment, after supplying the chemical solution for a predetermined time, for example, several tens of seconds while rotating the rotor 21 and the wafer W at a low speed, for example, 1 to 500 rpm, the supply of the chemical solution is stopped. The chemical solution adhering to the surface of the wafer W is spun off and removed by rotating at high speed, for example, 100 to 3000 rpm for several seconds. The chemical solution processing is completed by repeating the chemical solution supply step and the chemical solution shaking step several times to several thousand times.
[0050]
In the chemical treatment process, in a normal process in which the chemical solution is stored in the inner tank 1 and the outer tank 2, the chemical solution stored in the outer tank 2 is used as the chemical solution supplied first. That is, when the supply pump 16 operates with the second, sixth, seventh, and fourth switching on / off valves 15b, 15f, 15g, and 15d open, the chemical solution in the outer tank 2 is supplied to the second supply. It flows through the pipeline 14b, the main supply pipeline 14c, the bypass pipeline 19 and the main supply pipeline 14c and is supplied to the processing unit side. At this time, the chemical liquid that has passed through the supply pump 16 is filtered by the filter 19a, and impurities and impurities mixed in the chemical liquid are removed. The chemical used first within a certain period of time is discarded from the first drainage line 42. The other chemicals are subjected to treatment for a certain period of time, then returned to the outer tank 2 and thereafter circulated.
[0051]
After the chemical solution is circulated and supplied for a predetermined time, the new chemical solution in the inner tank 1 is supplied to the processing unit side, and the chemical treatment is completed. When supplying the new chemical in the inner tank 1 to the processing unit side, the second, sixth and seventh switching on / off valves 15b, 15f and 15g are closed, and the first, third and fourth switching on / off valves are closed. Valves 15a, 15c and 15d are opened. When the supply pump 16 operates in this state, the new chemical solution in the inner tank 1 flows through the first supply pipe 14a and the main supply pipe 14c and is supplied to the processing unit side. At this time, the new chemical liquid that has passed through the supply pump 16 is filtered by the filter 17 to remove impurities, impurities, and the like mixed in the chemical liquid. Further, the new chemical solution supplied at the previous processing and remaining in the main supply conduit 14c is filtered by the filter 17 together with the next new chemical solution. In addition, the new chemical | medical solution with which it used for the process is stored in the outer side tank 2 via the return pipeline 56. FIG.
[0052]
In the above description, the normal chemical solution processing in which the chemical solution is stored in the inner tank 1 and the outer tank 2 has been described. However, in an empty state in which the chemical solution is not stored in the inner tank 1 and the outer tank 2, The chemical treatment is performed as follows.
[0053]
First, the chemical liquid on-off valve 3 a is opened to supply chemical liquid from the chemical liquid supply source 3 into the inner tank 1, and a predetermined amount of chemical liquid is stored in the outer tank 2 from the inner tank 1 through the overflow line 5. Then, at the initial stage of processing, the new chemical solution in the outer tank 2 is supplied to the processing unit side to perform the first chemical processing. After that, after the chemical solution in the outer tank 2 is circulated and supplied, the new chemical solution in the inner tank 1 is supplied to the processing unit side, and the chemical solution process is terminated, as in the normal chemical solution process.
[0054]
In the chemical solution processing step, the chemical solution supplied to the chemical solution processing is discharged to the first drain port 41, and the chemical solution supply unit 52 via the return pipe 56 is operated by the operation of a switching valve (not shown). Or the gas generated from the chemical liquid is exhausted from the first exhaust pipe 44 via the first exhaust port 43.
[0055]
After performing the chemical treatment, the wafer W is housed in the inner chamber 23 and rotated at a low speed, for example, 1 to 500 rpm from the chemical supply nozzle 51 that also serves as the IPA supply nozzle of the IPA supply means 60. After supplying the IPA for a predetermined time, for example, several tens of seconds, the supply of IPA is stopped, and then the rotor 21 and the wafer W are rotated at a high speed, for example, 100 to 3000 rpm for several seconds to shake off the IPA adhering to the surface of the wafer W. Remove. The chemical solution removal process is completed by repeating the IPA supply process and the IPA swing-off process several times to several thousand times. Also in this chemical solution removal process, the IPA stored in the circulation supply tank 61b is used as the first supplied IPA in the same manner as in the chemical solution processing step, and the IPA used first is the first drainage liquid. The IPA discarded from the pipeline 42 and used for the subsequent processing circulates and supplies the IPA stored in the supply tank 61b. Then, at the end of the chemical removal process, the new IPA supplied from the IPA supply source 64 into the supply tank 61a is used, and the chemical removal process ends.
[0056]
In the chemical solution removal process, the IPA subjected to the chemical solution removal process is discharged to the first drain port 41, and the operation of a switching valve (not shown) causes the circulation line 90 of the solvent supply unit 61 or the first flow line 90 to be discharged. While being discharged to the drain line 42, the IPA gas is exhausted from the first exhaust line 44 via the first exhaust port 43.
[0057]
After the chemical processing is completed, the inner cylinder 25 is retracted to the standby position, and the rotor 21 and the wafer W are surrounded by the outer cylinder 26, that is, the wafer W is accommodated in the outer chamber 24. Therefore, even if the liquid is dropped or dropped from the wafer W processed in the inner chamber 23, it can be received by the outer chamber 24. In this state, first, a rinsing liquid, for example, pure water, is supplied to the rotating wafer W from the pure water supply nozzle 71 of the rinsing liquid supply means, and is rinsed. The pure water subjected to the rinsing process and the removed IPA are discharged from the second drainage pipe 46 through the second drainage port 45. The gas generated in the outer chamber 24 is discharged to the outside from the second exhaust pipe 49 via the second exhaust port 48.
[0058]
After the rinsing process is performed for a predetermined time in this way, the N2 gas and the IPA are supplied from the N2 gas supply source 82 and the IPA supply source 64 of the drying fluid supply means 80 while the wafer W is accommodated in the outer chamber 24. The mixed fluid is supplied to the rotating wafer W to remove the pure water adhering to the wafer surface, whereby the wafer W and the inside of the outer chamber 24 can be dried. In addition, after the drying process is performed with the mixed fluid of N2 gas and IPA, only the N2 gas is supplied to the wafer W, so that the drying of the wafer W and the inside of the outer chamber 24 can be performed more efficiently.
[0059]
As described above, after the chemical processing, chemical removal processing, rinsing processing, and drying processing of the wafer W are completed, the outer cylinder 26 moves back to the standby position on the outer peripheral side of the inner cylindrical body 25, while unlocking not shown. The means operates to retract the wafer pressing bar 32 from the pressing position of the wafer W. Then, the wafer delivery hand 29 rises and receives the wafer W held by the fixed holding rod 31 of the rotor 21 and moves upward of the processing apparatus 20. The wafer W moved to the upper side of the processing apparatus is received by the wafer transfer chuck, transferred to the loading / unloading unit, and then transferred to the outside of the apparatus.
[0060]
<Setting management method of liquid processing equipment>
By the way, looking at the connection system of the above-mentioned system centering on the supply nozzle and the drainage port, there are a plurality of pipes that can be connected to this, and one of them is configured to be selectively used. There are a lot of places that are not easy to understand at the time of setting. For example, in the case of the supply nozzle 51, in addition to the supply lines of the chemical solution supply line 53 and the IPA supply line 62, the supply lines of the pure water supply line 73 and the dry fluid supply line 83 can be connected thereto. . Further, the drain port 41 includes a circulation line 90 that forms a return line for the solvent to the circulation supply tank 61b, a return line 56 for the chemical liquid to the outer tank 2 of the chemical liquid supply unit 52, and a drain pipe. The drain lines such as the paths 42 and 42A and the drain line 59 can be connected.
[0061]
Accordingly, there is a possibility that setting of connection relations may be missed on the tabular recipe creation screen.
[0062]
Therefore, according to the present invention, a graphical recipe creation screen is displayed, and only the pipes that can be connected are displayed at the time of data setting, and one of the pipes can be selectively set to make the recipe visually easy. Can be created in order to prevent setting mistakes. In addition, connectable pipes can be changed in the data table so that the pipes can be changed.
[0063]
FIG. 4 shows a recipe screen displayed as an image on the monitor 32 of the control device 30. This recipe screen is displayed by selecting a “recipe” key on a menu bar (not shown).
[0064]
In the center of the recipe screen, a drawing creation area 100 in which a connection system such as a connection element icon or a connection line can be drawn is prepared in a large area.
[0065]
A condition setting display field 101 is provided above the drawing creation area 100. In the condition setting display field 101, whether an inner chamber or an outer chamber is input and set as an input setting area. CHAMBER "Setting section 102," Low speed / high speed rotation repetition "setting section 103, which is input when using a low speed / high speed rotation repetition recipe for repeating rotation while switching the rotation of the rotor 21 between low speed rotation and high speed rotation, the type of purge gas "Purge" setting unit 104 for inputting the "rotation speed" setting unit 105 for inputting the rotor speed, "Processing time" setting unit 106 for inputting the processing time of the step, and the initial drainage time at the start of the step processing A “drainage switching” setting unit 107 is provided. In these input setting areas 102 to 107, respective setting values can be input. this house" CHAMBER The “setting unit 102” and the “purge” setting unit 104 are configured as pull-down menu bars, and when a black triangle mark is pressed, a list box is displayed, and an arbitrary menu bar can be selected. Ie " CHAMBER For the input area, the inner chamber 23 or the outer chamber 24 can be selected as the type of the processing chamber, and for the “purge” input area, N 2 which is an inert gas or clean air is used as the purge gas type. Can be selected.
[0066]
Further, in the condition setting display field 101, as a display area, a “recipe No” display unit 108 that displays a recipe number of a recipe that is being created or registered, and a registered recipe ID (recipe name) are displayed. "Recipe ID" display unit 109, "Hybrid" display unit 110, "Step number" display unit 111 that displays the total number of steps of the recipe being created, and "Step No" display unit 112 that displays the step number being created Is also provided.
[0067]
On the other hand, the right side of the screen is provided with a “step-up” key 113 and a “step-down” key 114 with black triangle marks. By pressing these keys, the screen can be switched to a recipe creation screen for steps before and after this screen. it can.
[0068]
Further, on the right side of the screen, as an operation soft key, a step to be inserted is selected, an “insert” key 115 to be operated when a step is inserted before a designated step, a step to be deleted is selected, and a step is selected. “Delete” key 116 that is operated when it is desired to delete, “Cancel” key 117 that is used when changing the discharge nozzle and supply / drainage line during recipe creation, and “Operation” that is performed when initializing the contents of the step “ A “clear” key 118, a “registration” key 119 that is operated when the contents are saved after inputting or changing a step, and a “return” key 120 that is operated when returning to the previous screen are provided.
[0069]
In the drawing creation area 100, “ CHAMBER By selecting the inner chamber 23 in the setting unit 102, an image of the chamber unit 200 appears as shown in FIG. The chamber unit 200 includes contours 223 and 224 (hereinafter simply referred to as an inner chamber 223 and an outer chamber 224) corresponding to the actual inner chamber 23 and the outer chamber 24, a supply nozzle 51 and a drainage liquid that are located in the inner chamber 23. Port 41 symbols 251 and 241 (hereinafter simply referred to as supply nozzle 251 and drain port 241).
[0070]
Further, when the supply nozzle 251 in the image of the chamber unit 200 is selected by a pointing device such as a mouse (not shown), all the processing liquid supply sources connectable to the supply nozzle 251 and the supply nozzle 51 from these processing liquid sources The supply line is displayed. In this embodiment, as shown in FIG. 5, as processing liquid supply sources, icons 282 and 272 (hereinafter simply referred to as dry fluid supply source 282, pure water) of a dry fluid (for example, nitrogen N2) supply source 82 and a pure water supply source 72 are used. Water supply source 272) is displayed along with supply lines 289, 276 (corresponding to supply line 89, supply line 76) connecting them to the supply nozzle 251.
[0071]
Furthermore, as a processing liquid supply source, an icon 210 of the tank 10 including the inner tank 1 and the outer tank 2 (hereinafter simply referred to as a tank 210 including a new liquid tank 201 and a recycle tank 202), an IPA supply tank 61a, A supply line 253 connecting the supply nozzle 251 and an icon 261 of the solvent supply unit 61 including the circulation supply tank 61b (hereinafter simply referred to as a solvent supply tank 261 including the new liquid tank 261a and the recycle tank 261b), 262 (corresponding to the chemical solution supply line 53 and the IPA supply line 62). However, as to which side of the tank 210 the fresh solution tank 201 and the recycle tank 202 is used, the soft key 125 displayed below the icon 210 is operated with a pointing device as shown in FIG. Can be switched. Similarly, which side of the fresh solution tank 261a and the recycle tank 261b of the solvent supply tank 261 is used can be switched by operating the soft key 126 displayed below the icon 261 with a pointing device. .
[0072]
When the drainage port 241 in the image of the chamber unit 200 is selected by a pointing device such as a mouse (not shown), all drainage destinations connectable to the drainage port 241 and these and drainage ports A drainage line connecting 241 is displayed. In this embodiment, as shown in FIG. 6, as a liquid discharge destination, a recycling tank 202 of the tank 210 (the outer tank 2 of the tank 10) and a recycling tank 261b of the solvent supply tank 261 (a circulation supply tank of the solvent supply unit 61). 61b) are displayed together with drain lines 256, 290 (corresponding to the chemical return line 56 and the circulation line 90) connecting them to the drain port 41.
[0073]
Furthermore, as drainage destinations 121 to 124, Rinse Chemi (1) for draining, for example, IPA used as an initial rinse after chemical treatment, and organic-based organic chemicals such as amines and fluorinated ammonia are drained. There are four types of SOLVENT (1), for example, Dilution that drains pure water mixed with chemicals when rinsed with pure water, and Reclaim that drains recyclable pure water. Are displayed together with drainage lines 242, 259 (corresponding to the drainage pipeline 42 and drainage pipeline 59).
[0074]
FIG. 7 and FIG. 8 are flowcharts showing a recipe creation procedure for executing basic wafer processing.
[0075]
In FIG. 7, a recipe screen is first selected from the menu screen (step ST1). The “recipe” key is selected to start recipe creation (steps ST2 and ST3). The program enters the step creation process of FIG. 8 (step ST4).
[0076]
In the step creation process of FIG. 8, first, a spin chamber is selected (step ST41). In other words, CHAMBER For the input area, select the inner chamber 23 or the outer chamber 24 from the pull-down menu bar. Here, the inner chamber 23 is selected as an example. As shown in FIG. 4, an image of the chamber unit 200 appears.
[0077]
Next, the supply nozzle (discharge nozzle) of the spin chamber unit is selected (step ST42). Here, when the supply nozzle 251 is selected with a pointing device, all processing liquid supply sources and supply lines that can be connected to the supply nozzle 251 are displayed. That is, as shown in FIG. 9A, as a processing liquid supply source, a dry fluid supply source 282, a pure water supply source 272, a new liquid tank 201 in the tank 210, and a new liquid tank 261a in the solvent supply tank 261 are used. Are displayed together with supply lines 289, 276, 253, and 262 connecting them to the supply nozzle 251. Note that the soft keys 125 and 126 located below the tanks 210 and 261 are switched between the new liquid tank 201 and the recycle tank 202 of the tank 210 and between the new liquid tank 261a and the recycle tank 261b of the solvent supply tank 261. It can be executed by operating.
[0078]
Next, the supply line used by the supply nozzle 251 is selected (step ST43). For example, when it is desired to use the new liquid tank 201 of the tank 210, first, the tank 210 is selected and activated, and the soft key 125 is operated to set the display to “N” (new liquid tank). Do that. FIG. 9B shows a state where the new liquid tank 201 is selected. As shown in the figure, the dry fluid supply source 282, the supply source 272, the solvent supply tank 261 and their supply lines 289, 276, and 262 are deleted, and only the fresh liquid tank 201 of the tank 210 and its supply line 253 remain. When the dry fluid supply source 282 is selected, the result is as shown in FIG. That is, the supply source 272 and the solvent supply tank 261 and their supply lines 276 and 262, the fresh liquid tank 201 of the tank 210 and its supply line 253 are deleted, and only the dry fluid supply source 282 and its supply line 289 remain.
[0079]
Next, the setting of the processing time (seconds) of the step and the rotation speed (rpm) of the rotor is input (step ST44). For example, when 65 seconds is set as the processing time of the step and 35 rpm is set as the rotation number of the rotor, “65” is input to the “processing time” setting unit 106, and “35” is input to the “rotation number” setting unit 105. ”Is entered.
[0080]
Next, the drain port of the spin chamber unit is selected (step ST45). Here, when the drainage port 241 is selected with a pointing device, all drainage destinations and drainage lines that can be connected to the drainage port 241 are displayed. That is, as shown in FIG. 10 (a), as a drain destination, a recycle tank 202 of a tank 210 and a recycle tank 261b of a solvent supply tank 261 are further divided into Rinse Chemi (1), SOLVENT (1), Dilution. , Reclaim's four drainage destinations 121 to 124 are displayed together with drainage lines 256, 290, 242, and 259 connecting them to the drainage port 241.
[0081]
Next, the drain line used by the drain port 241 is selected (step ST46). For example, when it is desired to use the recycle tank 202 of the tank 210, the tank 210 is first selected and activated, and the soft key 125 is operated to set the display to “R” (recycle tank). . FIG. 10B shows a state where the recycle tank 202 is selected. As shown in the figure, the liquid discharge destinations 121 to 124 and the solvent supply tank 261 and their supply lines 242, 259 and 290 are deleted, and only the recycle tank 202 of the tank 210 and its drain line 256 remain. SOLVENT (1) Drain destination 122 is selected In such a case, the result is as shown in FIG. That is, the drain destinations 121, 123, 124, the tank 210 and the solvent supply tank 261 and their drain lines 242, 256, 290 are deleted, and only the drain destination 122 of the SOLVENT (1) and its drain line 259 are provided. Remains.
[0082]
Next, it is confirmed whether or not the next step is to be created (step ST47). When creating the next step, the “low speed / high speed rotation repetition” setting unit 103 is checked to select the low speed / high speed rotation repetition recipe. When not creating, the process is terminated and the process goes to step ST46 in FIG. Return.
[0083]
When the low-speed / high-speed rotation repetition recipe is selected, the low-speed / high-speed rotation repetition recipe is repeated between the set values (seconds) input at the step time. For example, when the processing time of the low-speed / high-speed rotation repetition recipe is 15 seconds, the low-speed / high-speed rotation repetition processing repeated during the 65 seconds input at the step time (65 seconds / 15 seconds = 4 times) is 4 times low speed / high speed The rotating repeat recipe will operate. The remaining time is processed at the rotational speed set by the rotor rotational speed.
[0084]
Thus, the step process of FIG. 8 is terminated, and the program returns to step ST4 of FIG. Then, it asks whether or not to write the step created as described above (step ST5). When writing is not performed, that is, when the “cancel” key 117 is operated, the above step creation process is repeated. On the other hand, when the step created as described above is written, that is, when the “registration” key 119 is operated, the contents of the step are stored in the memory (not shown) of the control device 30 and registration is executed.
[0085]
After the registration is completed, an inquiry is made as to whether or not the next step is to be created (step ST6). If the next step is to be created, the process returns to step ST4. If the next step is not to be created, the recipe creation process is terminated.
[0086]
FIG. 11 shows a state in which the supply line and the drain line are selected by the setting management method. In FIG. 11A, the new liquid tank 201 and its supply line 253 of the tank 210 are selected as the supply line system, and the cycle tank 202 and its drain line 256 of the tank 210 are selected and left as the drain line system. Indicates the state. FIG. 11B shows a state in which the dry fluid supply source 282 and its supply line 289 are selected as the supply line system, and the cycle tank 202 of the tank 210 and its drain line 256 are selected and left as the drain line system. Show. In FIG. 11C, the dry fluid supply source 282 and its supply line 289 are selected as the supply line system, and the drain destination 122 and its drain line 259 of SOLVENT (1) are selected as the drain line system. Indicates the remaining state.
[0087]
In this way, the connection of the lines to the supply nozzle 51 and the drainage port 41 can be completed freely and easily.
[0088]
After the processing recipe for the inner chamber 23 is set as described above, the processing recipe for the outer chamber 24 is performed in the same procedure, although the description is omitted here.
[0089]
In the above embodiment, the case where the setting of the processing time of the step and the rotation speed of the rotor is input (step ST44) after the supply line used by the supply nozzle 251 is selected (step ST43) has been described. It is also possible to set the processing time of the step and the number of rotations of the rotor before selection. In this case, simultaneously with the selection of the supply line, the screen for selecting the drain port of the spin chamber unit in the next step (step ST45) can be displayed at the same time.
[0090]
In the above embodiment, the case where the liquid processing apparatus and the liquid processing method according to the present invention are applied to a semiconductor wafer cleaning / drying processing apparatus has been described. However, the present invention can be applied to LCD glass substrates other than semiconductor wafers. Of course, it is needless to say that the present invention can also be applied to a liquid processing apparatus using a processing liquid such as a chemical solution other than the cleaning / drying processing apparatus.
[0091]
【The invention's effect】
As described above, according to the present invention, since it is configured as described above, the following effects can be obtained.
[0092]
According to the present invention, by designating the nozzle in the monitor image, all of the connectable supply lines from the nozzle to the processing liquid supply source are displayed as an image, and when one of the supply lines is selected, the other supply is displayed. The image of the line is erased to identify the supply line, and when the drainage port is selected, all of the drainage lines that are allowed to be combined with the selected supply line and can be connected are displayed as images. When one of the drainage lines is selected, the other Drain line And the actual setting of the supply line and drainage line selected above is performed. Therefore, even if there are many types of processing liquids and the number of lines that can be selectively used and it is difficult to understand the connection system at the time of setting, it is possible to set steps correctly without mistakes in piping and processing liquids. Can do. Therefore, the change of connectable piping can also be easily performed.
[0093]
In addition, in relation to the previously selected supply line, only the drainage line that is allowed to be combined with this and can be connected is displayed as an image, and one of the drainage lines is selected. Connection combinations that cannot actually be selected are eliminated, Drain line This makes it easy to select and set.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a cleaning / drying processing apparatus including a liquid processing apparatus to which a setting management method according to the present invention is applied.
FIG. 2 is a schematic piping diagram showing a processing liquid piping system of the liquid processing apparatus according to the embodiment of the present invention.
FIG. 3 is a schematic configuration diagram showing a main part of a liquid processing apparatus according to an embodiment of the present invention.
FIG. 4 is a diagram showing one step of a monitor screen for explaining a setting management method according to the present invention.
FIG. 5 is a diagram showing another step of the monitor screen for explaining the setting management method according to the present invention.
FIG. 6 is a diagram showing another step of the monitor screen for explaining the setting management method according to the present invention.
FIG. 7 is a diagram showing a recipe creation flow of the setting management method according to the present invention.
FIG. 8 is a diagram showing a flow of step creation processing defined in the recipe creation flow of FIG. 7;
FIG. 9 is a diagram showing selection of a supply line in the setting management method according to the present invention.
FIG. 10 is a diagram showing selection of a drain line in the setting management method according to the present invention.
FIG. 11 is a diagram showing a state where a supply line and a drain line are selected in the setting management method according to the present invention.
[Explanation of symbols]
10 tanks
14a First supply line
14b Second supply line
14c Main supply line
20 Liquid processing equipment
23 Internal chamber (processing section)
24 Outer chamber (processing section)
30 Control device (control means)
32 monitors
42 First drain line
42A drainage line
46 Second drain line
50 Supply means (chemical supply means)
51 Chemical supply nozzle (also used as solvent supply nozzle)
52 Chemical solution supply part
53 Chemical supply line
56 Return line for chemicals
59 Drainage pipeline
60 IPA supply means
61 Solvent supply section
61a IPA supply tank
61b Circulation supply tank
62 IPA supply pipeline
70 Supply means (rinse solution supply means)
71 Pure water supply nozzle
72 Pure water source
73 Pure water supply pipeline
76 Supply pipeline
80 Supply means (dry fluid supply means)
81 Drying fluid supply nozzle
82 Drying fluid eg nitrogen (N2) source
83 Drying fluid supply line
89 Supply line
90 Circulation line
100 drawing creation area
101 Condition setting display field
102 “ CHAMBER Setting part
103 “Low speed / High speed rotation repeat” setting section
104 “Purge” setting section
105 “Rotation speed” setting section
106 “Processing time” setting section
107 “Drainage switching” setting section
121-124 Drainage destination
200 chamber unit
201 New liquid tank
202 Recycle tank
210 tanks
223 inner chamber
224 Outer chamber
242 Drainage line
251 Supply nozzle
253 supply line
256 drainage line
259 drainage line
261 Solvent supply tank
261a New liquid tank
261b Recycle tank
262 supply line
272 Pure water source
276 supply line
282 Drying fluid source
289 supply line
290 drainage line

Claims (11)

A chamber for liquid processing the object to be processed;
A nozzle for supplying a processing liquid to the target object in the chamber;
A plurality of treatment liquid supply sources communicating with the nozzle via a plurality of supply lines;
A drainage port for draining the processing liquid supplied into the chamber from the chamber;
A plurality of drainage portions communicating with the drainage port via a plurality of drainage lines;
A monitor capable of displaying the chamber, nozzle, supply line, processing liquid supply source, drainage port, drainage line, and drainage part as an image when setting the recipe;
Furthermore, by specifying the nozzle in the monitor image, all of the connectable supply lines from the nozzle to the supply source are displayed in the image, and one of the supply lines displayed in the image is selected. when, to erase the image of the other supply line, leaving the image of the supply line selected, then when the drainage port in the image is selected, the permissible supply line and the selected combination, drainage Display all of the drainage lines that can be connected from the port to the drainage unit, and when one of the drainage lines is selected, leave the image of the selected drainage line and the other A liquid processing apparatus comprising control means for erasing an image of a drainage line . The liquid processing apparatus according to claim 1 ,
At least one of the plurality of processing liquid supply source consists of a tank for storing the treating liquid, the tank reservoir and the new chemical tank for storing a new liquid that has not been subjected to treatment, recycling liquid that has been subjected to treatment A liquid processing apparatus, wherein the supply line can be connected to either a new liquid tank or a recycling tank. The liquid processing apparatus according to claim 1 ,
At least one of the plurality of processing liquid supply sources includes a tank that stores the processing liquid. The tank stores a new liquid tank that stores new liquid that has not been processed, and a recycled liquid that has been processed. The supply line can be connected to either the new liquid tank or the recycling tank,
At least one of the plurality of drainage units can be connected to a recycle tank. In the liquid processing apparatus in any one of Claims 1 thru | or 3 ,
A liquid processing apparatus, wherein the plurality of processing liquid supply sources includes a processing liquid supply source for supplying a processing liquid and a gas supply source for supplying a gas. In the liquid processing apparatus in any one of Claims 1 thru | or 4 ,
The liquid processing apparatus, wherein the chamber has a dual structure of an inner chamber and an outer chamber, and the monitor can display images in each chamber. The chamber for liquid processing the object to be processed has a nozzle and a drain port, and the process liquid can be supplied from a plurality of processing liquid supply sources through a plurality of selectable supply lines to the nozzle, and from the drain port. In the liquid processing apparatus that discharges the processed processing liquid to the tank or the outside through a plurality of drain lines that can be selected,
On the monitor of the control device for setting and controlling the connection between the supply line and the drain line of the liquid processing apparatus, the chamber, the nozzle provided in the chamber and the drain port are displayed as an image,
By designating the nozzles in this image, all of the connectable supply lines from the nozzles to the processing liquid supply source are displayed on the monitor screen.
When one of the supply lines in the image is selected, the image of the other supply line is deleted leaving the image of the selected supply line,
Next, when the drainage port in the image is selected, the monitor screen displays an image of all the drainage lines that are allowed to be combined with the selected supply line and can be connected,
When one of the discharge line of the image is selected, leaving the image of the selected drain line to erase the image of the other discharge line,
A setting management method for a liquid processing apparatus, wherein actual setting of a supply line and a drainage line selected as described above is performed. In the setting management method of the liquid processing apparatus according to claim 6 ,
One of the supply lines includes a recycling tank system, and a setting management method for a liquid processing apparatus. In the setting management method of the liquid processing apparatus of Claim 6 or 7 ,
A method for managing and setting a liquid processing apparatus, wherein the supply line includes a dry fluid supply source, a pure water supply source, a new chemical solution tank, and a supply line from a new solvent tank to a nozzle. In the setting management method of the liquid processing apparatus of Claim 6 or 7 ,
One of the above drain lines includes a recycling tank system, and a setting management method for a liquid processing apparatus. In the setting management method of the liquid processing apparatus according to claim 6 or 9 ,
A method for managing and setting a liquid processing apparatus, wherein the drainage line includes a drainage recycling tank, a solvent recycling tank, and a drainage line connecting another drainage destination and a drainage port. In the setting management method of the liquid processing apparatus in any one of Claims 6 thru | or 10 ,
A setting management method for a liquid processing apparatus, wherein the chamber includes an inner chamber and an outer chamber, and the nozzle and the drainage port are provided in the inner chamber.

Images