JPH0810234Y2 - チップ状回路部品マウント装置 - Google Patents
チップ状回路部品マウント装置Info
- Publication number
- JPH0810234Y2 JPH0810234Y2 JP1988018495U JP1849588U JPH0810234Y2 JP H0810234 Y2 JPH0810234 Y2 JP H0810234Y2 JP 1988018495 U JP1988018495 U JP 1988018495U JP 1849588 U JP1849588 U JP 1849588U JP H0810234 Y2 JPH0810234 Y2 JP H0810234Y2
- Authority
- JP
- Japan
- Prior art keywords
- suction
- circuit component
- mounting
- chip
- mounting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000013013 elastic material Substances 0.000 claims description 7
- 239000003463 adsorbent Substances 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988018495U JPH0810234Y2 (ja) | 1988-02-15 | 1988-02-15 | チップ状回路部品マウント装置 |
| KR1019890000721A KR920002278B1 (ko) | 1988-02-15 | 1989-01-24 | 리드선이 없는 회로부품의 장착장치 |
| US07/307,899 US4914809A (en) | 1988-02-15 | 1989-02-07 | Chip mounting apparatus |
| EP89102168A EP0329004B1 (en) | 1988-02-15 | 1989-02-08 | Chip mounting apparatus |
| DE68924660T DE68924660T2 (de) | 1988-02-15 | 1989-02-08 | Vorrichtung zum Montieren von Chips. |
| HK105896A HK105896A (en) | 1988-02-15 | 1996-06-19 | Chip mounting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988018495U JPH0810234Y2 (ja) | 1988-02-15 | 1988-02-15 | チップ状回路部品マウント装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01123400U JPH01123400U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-08-22 |
| JPH0810234Y2 true JPH0810234Y2 (ja) | 1996-03-27 |
Family
ID=31233195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988018495U Expired - Lifetime JPH0810234Y2 (ja) | 1988-02-15 | 1988-02-15 | チップ状回路部品マウント装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810234Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0651031Y2 (ja) * | 1989-11-28 | 1994-12-21 | 太陽誘電株式会社 | チップ状電子部品マウント装置 |
| JP4309084B2 (ja) * | 2001-11-26 | 2009-08-05 | アピックヤマダ株式会社 | ダイシング装置 |
| JP6454730B2 (ja) * | 2014-12-26 | 2019-01-16 | シャープ株式会社 | 半導体素子パッケージのためのキャップ装着方法及びキャップ装着装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55164493A (en) * | 1979-06-09 | 1980-12-22 | Pioneer Electronic Corp | Vacuum head for moving electronic part |
| JPS565332U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1979-06-25 | 1981-01-17 |
-
1988
- 1988-02-15 JP JP1988018495U patent/JPH0810234Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01123400U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-08-22 |