JPH079614Y2 - 熱硬化性樹脂封止用金型 - Google Patents
熱硬化性樹脂封止用金型Info
- Publication number
- JPH079614Y2 JPH079614Y2 JP1989030867U JP3086789U JPH079614Y2 JP H079614 Y2 JPH079614 Y2 JP H079614Y2 JP 1989030867 U JP1989030867 U JP 1989030867U JP 3086789 U JP3086789 U JP 3086789U JP H079614 Y2 JPH079614 Y2 JP H079614Y2
- Authority
- JP
- Japan
- Prior art keywords
- gate
- mold
- cavity
- resin
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989030867U JPH079614Y2 (ja) | 1989-03-20 | 1989-03-20 | 熱硬化性樹脂封止用金型 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989030867U JPH079614Y2 (ja) | 1989-03-20 | 1989-03-20 | 熱硬化性樹脂封止用金型 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02121910U JPH02121910U ( ) | 1990-10-04 |
JPH079614Y2 true JPH079614Y2 (ja) | 1995-03-08 |
Family
ID=31256302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989030867U Expired - Fee Related JPH079614Y2 (ja) | 1989-03-20 | 1989-03-20 | 熱硬化性樹脂封止用金型 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH079614Y2 ( ) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61186416U ( ) * | 1985-05-15 | 1986-11-20 | ||
JPS6237119A (ja) * | 1985-08-10 | 1987-02-18 | Fujitsu Ltd | モ−ルド金型およびモ−ルド方法 |
JPS6311314A (ja) * | 1986-07-02 | 1988-01-18 | Matsushita Electric Ind Co Ltd | 樹脂成形金型 |
JPS6448432A (en) * | 1987-08-19 | 1989-02-22 | Hitachi Ltd | Molding die and manufacture of semiconductor device by using said die |
-
1989
- 1989-03-20 JP JP1989030867U patent/JPH079614Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH02121910U ( ) | 1990-10-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |