JPH079386Y2 - イメージセンサ - Google Patents

イメージセンサ

Info

Publication number
JPH079386Y2
JPH079386Y2 JP1988114972U JP11497288U JPH079386Y2 JP H079386 Y2 JPH079386 Y2 JP H079386Y2 JP 1988114972 U JP1988114972 U JP 1988114972U JP 11497288 U JP11497288 U JP 11497288U JP H079386 Y2 JPH079386 Y2 JP H079386Y2
Authority
JP
Japan
Prior art keywords
sensor
chip
bonding
drive circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988114972U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0236057U (enExample
Inventor
啓志 藤曲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP1988114972U priority Critical patent/JPH079386Y2/ja
Publication of JPH0236057U publication Critical patent/JPH0236057U/ja
Application granted granted Critical
Publication of JPH079386Y2 publication Critical patent/JPH079386Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
JP1988114972U 1988-09-02 1988-09-02 イメージセンサ Expired - Lifetime JPH079386Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988114972U JPH079386Y2 (ja) 1988-09-02 1988-09-02 イメージセンサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988114972U JPH079386Y2 (ja) 1988-09-02 1988-09-02 イメージセンサ

Publications (2)

Publication Number Publication Date
JPH0236057U JPH0236057U (enExample) 1990-03-08
JPH079386Y2 true JPH079386Y2 (ja) 1995-03-06

Family

ID=31356205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988114972U Expired - Lifetime JPH079386Y2 (ja) 1988-09-02 1988-09-02 イメージセンサ

Country Status (1)

Country Link
JP (1) JPH079386Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4231328B2 (ja) * 2003-04-24 2009-02-25 浜松ホトニクス株式会社 固体撮像装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5293285A (en) * 1976-02-02 1977-08-05 Hitachi Ltd Structure for semiconductor device
JPH0626247B2 (ja) * 1985-07-18 1994-04-06 株式会社東芝 イメ−ジセンサの製造方法
JPS6229162A (ja) * 1985-07-29 1987-02-07 Toshiba Corp イメ−ジセンサ
JPH0734464B2 (ja) * 1986-07-24 1995-04-12 株式会社東芝 読取装置

Also Published As

Publication number Publication date
JPH0236057U (enExample) 1990-03-08

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