JPH0739255Y2 - ワイヤボンディングを行う両面フレキシブル基板の構造 - Google Patents

ワイヤボンディングを行う両面フレキシブル基板の構造

Info

Publication number
JPH0739255Y2
JPH0739255Y2 JP1988058758U JP5875888U JPH0739255Y2 JP H0739255 Y2 JPH0739255 Y2 JP H0739255Y2 JP 1988058758 U JP1988058758 U JP 1988058758U JP 5875888 U JP5875888 U JP 5875888U JP H0739255 Y2 JPH0739255 Y2 JP H0739255Y2
Authority
JP
Japan
Prior art keywords
wire bonding
pattern
double
sided flexible
reinforcing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988058758U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01163365U (enExample
Inventor
義之 水藻
俊二 奥
Original Assignee
ミノルタ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミノルタ株式会社 filed Critical ミノルタ株式会社
Priority to JP1988058758U priority Critical patent/JPH0739255Y2/ja
Publication of JPH01163365U publication Critical patent/JPH01163365U/ja
Application granted granted Critical
Publication of JPH0739255Y2 publication Critical patent/JPH0739255Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
JP1988058758U 1988-04-30 1988-04-30 ワイヤボンディングを行う両面フレキシブル基板の構造 Expired - Lifetime JPH0739255Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988058758U JPH0739255Y2 (ja) 1988-04-30 1988-04-30 ワイヤボンディングを行う両面フレキシブル基板の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988058758U JPH0739255Y2 (ja) 1988-04-30 1988-04-30 ワイヤボンディングを行う両面フレキシブル基板の構造

Publications (2)

Publication Number Publication Date
JPH01163365U JPH01163365U (enExample) 1989-11-14
JPH0739255Y2 true JPH0739255Y2 (ja) 1995-09-06

Family

ID=31284556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988058758U Expired - Lifetime JPH0739255Y2 (ja) 1988-04-30 1988-04-30 ワイヤボンディングを行う両面フレキシブル基板の構造

Country Status (1)

Country Link
JP (1) JPH0739255Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033347A (ja) * 2000-07-17 2002-01-31 Rohm Co Ltd 半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2633124B2 (ja) * 1991-10-25 1997-07-23 山武ハネウエル株式会社 ダイアフラムセンサ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020058A (ja) * 1983-07-13 1985-02-01 Hitachi Chem Co Ltd 集熱面の処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033347A (ja) * 2000-07-17 2002-01-31 Rohm Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPH01163365U (enExample) 1989-11-14

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