JPH073642Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH073642Y2
JPH073642Y2 JP1985157913U JP15791385U JPH073642Y2 JP H073642 Y2 JPH073642 Y2 JP H073642Y2 JP 1985157913 U JP1985157913 U JP 1985157913U JP 15791385 U JP15791385 U JP 15791385U JP H073642 Y2 JPH073642 Y2 JP H073642Y2
Authority
JP
Japan
Prior art keywords
power supply
wiring
potential
supply wiring
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985157913U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6265840U (OSRAM
Inventor
彰 清水
裕之 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1985157913U priority Critical patent/JPH073642Y2/ja
Publication of JPS6265840U publication Critical patent/JPS6265840U/ja
Application granted granted Critical
Publication of JPH073642Y2 publication Critical patent/JPH073642Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP1985157913U 1985-10-16 1985-10-16 半導体装置 Expired - Lifetime JPH073642Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985157913U JPH073642Y2 (ja) 1985-10-16 1985-10-16 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985157913U JPH073642Y2 (ja) 1985-10-16 1985-10-16 半導体装置

Publications (2)

Publication Number Publication Date
JPS6265840U JPS6265840U (OSRAM) 1987-04-23
JPH073642Y2 true JPH073642Y2 (ja) 1995-01-30

Family

ID=31080903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985157913U Expired - Lifetime JPH073642Y2 (ja) 1985-10-16 1985-10-16 半導体装置

Country Status (1)

Country Link
JP (1) JPH073642Y2 (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003289104A (ja) * 2002-03-28 2003-10-10 Ricoh Co Ltd 半導体装置の保護回路及び半導体装置
JP2006245596A (ja) * 2006-04-03 2006-09-14 Ricoh Co Ltd 半導体装置
JP2013238453A (ja) * 2012-05-14 2013-11-28 Nippon Soken Inc 磁気センサ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5846854B2 (ja) * 1975-08-25 1983-10-19 株式会社日立製作所 タソウハイセンコウゾウノハンドウタイソウチ

Also Published As

Publication number Publication date
JPS6265840U (OSRAM) 1987-04-23

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