JPH07321176A - 基板搬送方法 - Google Patents

基板搬送方法

Info

Publication number
JPH07321176A
JPH07321176A JP6106444A JP10644494A JPH07321176A JP H07321176 A JPH07321176 A JP H07321176A JP 6106444 A JP6106444 A JP 6106444A JP 10644494 A JP10644494 A JP 10644494A JP H07321176 A JPH07321176 A JP H07321176A
Authority
JP
Japan
Prior art keywords
substrate
chamber
electrostatic attraction
arm
substrate transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6106444A
Other languages
English (en)
Japanese (ja)
Inventor
Nushito Takahashi
主人 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6106444A priority Critical patent/JPH07321176A/ja
Priority to EP95107734A priority patent/EP0683506A1/en
Priority to KR1019950012888A priority patent/KR100283295B1/ko
Priority to SG1995000483A priority patent/SG32356A1/en
Priority to TW084105037A priority patent/TW273034B/zh
Priority to US08/445,863 priority patent/US5697751A/en
Publication of JPH07321176A publication Critical patent/JPH07321176A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
JP6106444A 1994-05-20 1994-05-20 基板搬送方法 Pending JPH07321176A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP6106444A JPH07321176A (ja) 1994-05-20 1994-05-20 基板搬送方法
EP95107734A EP0683506A1 (en) 1994-05-20 1995-05-19 Water transfer apparatus and method
KR1019950012888A KR100283295B1 (ko) 1994-05-20 1995-05-20 웨이퍼 취급 장치
SG1995000483A SG32356A1 (en) 1994-05-20 1995-05-20 Wafer transfer apparatus and method
TW084105037A TW273034B (en, 2012) 1994-05-20 1995-05-20
US08/445,863 US5697751A (en) 1994-05-20 1995-05-22 Wafer transfer apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6106444A JPH07321176A (ja) 1994-05-20 1994-05-20 基板搬送方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP8249766A Division JPH09120985A (ja) 1996-09-20 1996-09-20 基板搬送方法
JP10005364A Division JPH10189688A (ja) 1998-01-14 1998-01-14 基板搬送方法

Publications (1)

Publication Number Publication Date
JPH07321176A true JPH07321176A (ja) 1995-12-08

Family

ID=14433799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6106444A Pending JPH07321176A (ja) 1994-05-20 1994-05-20 基板搬送方法

Country Status (5)

Country Link
US (1) US5697751A (en, 2012)
EP (1) EP0683506A1 (en, 2012)
JP (1) JPH07321176A (en, 2012)
KR (1) KR100283295B1 (en, 2012)
TW (1) TW273034B (en, 2012)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3208029B2 (ja) * 1994-11-22 2001-09-10 株式会社巴川製紙所 静電チャック装置およびその作製方法
US5975740A (en) 1996-05-28 1999-11-02 Applied Materials, Inc. Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
US6457929B2 (en) 1998-11-03 2002-10-01 Seh America, Inc. Apparatus and method for automatically transferring wafers between wafer holders in a liquid environment
JP2001155980A (ja) * 1999-11-25 2001-06-08 Nec Corp 検査補修システム、製品製造システム、部材検査装置、データ処理装置、部材補修装置、情報記憶媒体
US7059475B2 (en) 2001-10-04 2006-06-13 Entegris, Inc. System for cushioning wafer in wafer carrier
KR20040110391A (ko) * 2003-06-19 2004-12-31 삼성전자주식회사 기판 처리 장치
JP4766156B2 (ja) * 2009-06-11 2011-09-07 日新イオン機器株式会社 イオン注入装置
JP5750328B2 (ja) * 2011-07-20 2015-07-22 株式会社ニューフレアテクノロジー 気相成長方法及び気相成長装置
US10297483B2 (en) * 2013-09-20 2019-05-21 Applied Materials, Inc. Substrate carrier with integrated electrostatic chuck
US10199256B2 (en) 2013-09-28 2019-02-05 Applied Materials, Inc. Methods and systems for improved mask processing
US20170194181A1 (en) * 2016-01-04 2017-07-06 Micron Technology, Inc. Overhead traveling vehicle, transportation system with the same, and method of operating the same
US11121019B2 (en) 2018-06-19 2021-09-14 Kla Corporation Slotted electrostatic chuck

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123734A (ja) * 1982-01-18 1983-07-23 Fujitsu Ltd ワイヤボンデイング装置
JPS59195839A (ja) * 1983-04-21 1984-11-07 Toshiba Corp 半導体ウエハ−の自動移し替え装置
JPS61140148A (ja) * 1984-12-12 1986-06-27 Nanbu Denki Seisakusho:Kk 物品の移載装置
JPH01161846A (ja) * 1987-12-18 1989-06-26 Hitachi Ltd 移載装置
JPH01182834A (ja) * 1988-01-14 1989-07-20 Hamamatsu Photonics Kk 空間光変調装置およびそれを用いた画像再構成装置
JPH02278721A (ja) * 1989-04-19 1990-11-15 Nec Corp ボート搬送装置
JPH02288352A (ja) * 1989-04-10 1990-11-28 Applied Materials Inc ウェーハを絶縁されたブレードにより静電的にクランプする方法
JPH03187240A (ja) * 1989-12-18 1991-08-15 Nikon Corp 静電チヤツク
JPH0462951A (ja) * 1990-06-29 1992-02-27 Oki Electric Ind Co Ltd ウエハ移し換え装置
JPH05190653A (ja) * 1992-01-08 1993-07-30 Hitachi Ltd 試料保持装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743570A (en) 1979-12-21 1988-05-10 Varian Associates, Inc. Method of thermal treatment of a wafer in an evacuated environment
US4449885A (en) * 1982-05-24 1984-05-22 Varian Associates, Inc. Wafer transfer system
JPS5929435A (ja) * 1982-08-11 1984-02-16 Hitachi Ltd 試料支持装置
JPS6060060A (ja) 1983-09-12 1985-04-06 株式会社日立製作所 鉄道車両の扉開閉装置
EP0189279B1 (en) * 1985-01-22 1991-10-09 Applied Materials, Inc. Semiconductor processing system
JPS62274739A (ja) * 1986-05-16 1987-11-28 バリアン・アソシエイツ・インコ−ポレイテッド ウエファ方向づけ装置および方法
DE3702775A1 (de) * 1987-01-30 1988-08-11 Leybold Ag Vorrichtung zum quasi-kontinuierlichen behandeln von substraten
JP2528962B2 (ja) 1989-02-27 1996-08-28 株式会社日立製作所 試料処理方法及び装置
JPH03106721A (ja) * 1989-09-21 1991-05-07 Mitsubishi Electric Corp 縦型ウエーハ搬送装置
US4999507A (en) * 1990-05-10 1991-03-12 At&T Bell Laboratories Apparatus comprising an electrostatic wafer cassette
JP3064409B2 (ja) * 1990-11-30 2000-07-12 株式会社日立製作所 保持装置およびそれを用いた半導体製造装置
US5315473A (en) * 1992-01-21 1994-05-24 Applied Materials, Inc. Isolated electrostatic chuck and excitation method

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123734A (ja) * 1982-01-18 1983-07-23 Fujitsu Ltd ワイヤボンデイング装置
JPS59195839A (ja) * 1983-04-21 1984-11-07 Toshiba Corp 半導体ウエハ−の自動移し替え装置
JPS61140148A (ja) * 1984-12-12 1986-06-27 Nanbu Denki Seisakusho:Kk 物品の移載装置
JPH01161846A (ja) * 1987-12-18 1989-06-26 Hitachi Ltd 移載装置
JPH01182834A (ja) * 1988-01-14 1989-07-20 Hamamatsu Photonics Kk 空間光変調装置およびそれを用いた画像再構成装置
JPH02288352A (ja) * 1989-04-10 1990-11-28 Applied Materials Inc ウェーハを絶縁されたブレードにより静電的にクランプする方法
JPH02278721A (ja) * 1989-04-19 1990-11-15 Nec Corp ボート搬送装置
JPH03187240A (ja) * 1989-12-18 1991-08-15 Nikon Corp 静電チヤツク
JPH0462951A (ja) * 1990-06-29 1992-02-27 Oki Electric Ind Co Ltd ウエハ移し換え装置
JPH05190653A (ja) * 1992-01-08 1993-07-30 Hitachi Ltd 試料保持装置

Also Published As

Publication number Publication date
TW273034B (en, 2012) 1996-03-21
KR950034663A (ko) 1995-12-28
EP0683506A1 (en) 1995-11-22
US5697751A (en) 1997-12-16
KR100283295B1 (ko) 2001-04-02

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