JPH07286987A - 薄膜センサの組立方法 - Google Patents
薄膜センサの組立方法Info
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- JPH07286987A JPH07286987A JP7055584A JP5558495A JPH07286987A JP H07286987 A JPH07286987 A JP H07286987A JP 7055584 A JP7055584 A JP 7055584A JP 5558495 A JP5558495 A JP 5558495A JP H07286987 A JPH07286987 A JP H07286987A
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 238000005530 etching Methods 0.000 claims abstract description 9
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- 239000011810 insulating material Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 238000010992 reflux Methods 0.000 claims description 2
- 238000009987 spinning Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 14
- 239000004020 conductor Substances 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 8
- 238000001723 curing Methods 0.000 description 8
- 239000008103 glucose Substances 0.000 description 8
- 210000004369 blood Anatomy 0.000 description 6
- 239000008280 blood Substances 0.000 description 6
- 238000012544 monitoring process Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 206010012601 diabetes mellitus Diseases 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 108010015776 Glucose oxidase Proteins 0.000 description 2
- 239000004366 Glucose oxidase Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229940116332 glucose oxidase Drugs 0.000 description 2
- 235000019420 glucose oxidase Nutrition 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007920 subcutaneous administration Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920004943 Delrin® Polymers 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 210000003722 extracellular fluid Anatomy 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/28—Electrolytic cell components
- G01N27/30—Electrodes, e.g. test electrodes; Half-cells
- G01N27/327—Biochemical electrodes, e.g. electrical or mechanical details for in vitro measurements
- G01N27/3271—Amperometric enzyme electrodes for analytes in body fluids, e.g. glucose in blood
- G01N27/3272—Test elements therefor, i.e. disposable laminated substrates with electrodes, reagent and channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Hematology (AREA)
- Molecular Biology (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- Biophysics (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Investigating Or Analysing Biological Materials (AREA)
Abstract
(57)【要約】 (修正有)
【目的】 糖尿病患者の血中ぶどう糖濃度をモニタする
のに用いられる皮下ぶどう糖センサのような薄膜電気化
学センサを作る改良された方法を提供する。 【構成】 堅い平らな基板12上に絶縁材料からなる薄
膜ベース層を、ベース層の境界と基板12との間に介在
する硬化可能な粘着剤を用いて定置することからなり、
ベース層の中央部分の下に浅いキャビティを形成する。
このサブ組立体は、粘着剤を硬化させるために、熱と圧
力とを受け、これにより、キャビティから空気を排出
し、ベース層の中央部分が引き付けられて、基板12と
親密な接触状態になる。在来のコンタクトマスク写真平
板によるような、一以上のセンサのための適当な導体要
素がベース層の上に形成され、そして、その上に、絶縁
材料からなる薄膜カバー層が、遠位端センサ電極および
近位端コンタクトパッドを露出させるカバー層の孔を用
いて与えられる。
のに用いられる皮下ぶどう糖センサのような薄膜電気化
学センサを作る改良された方法を提供する。 【構成】 堅い平らな基板12上に絶縁材料からなる薄
膜ベース層を、ベース層の境界と基板12との間に介在
する硬化可能な粘着剤を用いて定置することからなり、
ベース層の中央部分の下に浅いキャビティを形成する。
このサブ組立体は、粘着剤を硬化させるために、熱と圧
力とを受け、これにより、キャビティから空気を排出
し、ベース層の中央部分が引き付けられて、基板12と
親密な接触状態になる。在来のコンタクトマスク写真平
板によるような、一以上のセンサのための適当な導体要
素がベース層の上に形成され、そして、その上に、絶縁
材料からなる薄膜カバー層が、遠位端センサ電極および
近位端コンタクトパッドを露出させるカバー層の孔を用
いて与えられる。
Description
【0001】
【産業上の利用分野】この発明は、一般的に、例えば、
糖尿病患者の血中ぶどう糖濃度を皮下的あるいは経皮的
にモニタするのに用いられる種類の薄膜電気化学センサ
を作るための組立方法に関する。より詳しくは、本発明
は、基板へのセンサの付着を必要としないで、コンタク
トマスク写真平板等によって堅い平らな基板の上に薄膜
センサを形成する改良された組立方法に関する。
糖尿病患者の血中ぶどう糖濃度を皮下的あるいは経皮的
にモニタするのに用いられる種類の薄膜電気化学センサ
を作るための組立方法に関する。より詳しくは、本発明
は、基板へのセンサの付着を必要としないで、コンタク
トマスク写真平板等によって堅い平らな基板の上に薄膜
センサを形成する改良された組立方法に関する。
【0002】
【従来の技術】この分野では、様々な特化されたセンサ
適用例での使用のための薄膜電気化学センサが広く知ら
れている。このような薄膜センサは、一般的に、ポリイ
ミドのような非導電性フィルム材料の薄い層間に写真平
板マスクおよびエッチング法によって付けられた一以上
の薄い導体を有する。この導体は、適当な電子モニタ機
器と電気的に接続するようになっている近位端コンタク
トパッドと一緒に、適当な電極材を有する遠位端センサ
チップを形成するように形作られる。近年、この一般的
な種類の薄膜センサは、医療での適用例において、経皮
センサとしての使用が提案されてきている。一つの例と
して、薄膜センサは、糖尿病患者の血中ぶどう糖濃度の
モニタ用に設計され、患者の血液と直接的な接触状態で
皮下に配置される遠位多センサ電極を備えている。
適用例での使用のための薄膜電気化学センサが広く知ら
れている。このような薄膜センサは、一般的に、ポリイ
ミドのような非導電性フィルム材料の薄い層間に写真平
板マスクおよびエッチング法によって付けられた一以上
の薄い導体を有する。この導体は、適当な電子モニタ機
器と電気的に接続するようになっている近位端コンタク
トパッドと一緒に、適当な電極材を有する遠位端センサ
チップを形成するように形作られる。近年、この一般的
な種類の薄膜センサは、医療での適用例において、経皮
センサとしての使用が提案されてきている。一つの例と
して、薄膜センサは、糖尿病患者の血中ぶどう糖濃度の
モニタ用に設計され、患者の血液と直接的な接触状態で
皮下に配置される遠位多センサ電極を備えている。
【0003】
【発明が解決しようとする課題】既知の写真平板組立法
によれば、例えばガラス板のような平らで堅い基板上で
のセンサ層の次のビルドアップによって、薄膜センサが
作られていた。典型的には、液体の形態で基板上にベー
ス層材料を加え、その後、基板をスピンさせて薄い実質
的に均一な厚さのベース層を作ることによって、基板上
に絶縁材料からなるベース層を形成する。続いて、一連
の写真平板マスク工程とエッチング工程によって導体を
形成する。次いで、絶縁材料からなるカバー層を加え
て、結果物としてのセンサを基板から剥がす。しかしな
がら、この剥がし工程は、完成したセンサを基板からダ
メージなしに分離するために、注意深く行わなければな
らない。不幸にも、基板上にベース層を形成する初期ス
ピン工程によって、完成したセンサを基板から分離させ
るのにコストと共に時間を要する程にベース層が基板に
固着する。これにより、望ましいことではないが薄膜セ
ンサの製造コストを増大させる。
によれば、例えばガラス板のような平らで堅い基板上で
のセンサ層の次のビルドアップによって、薄膜センサが
作られていた。典型的には、液体の形態で基板上にベー
ス層材料を加え、その後、基板をスピンさせて薄い実質
的に均一な厚さのベース層を作ることによって、基板上
に絶縁材料からなるベース層を形成する。続いて、一連
の写真平板マスク工程とエッチング工程によって導体を
形成する。次いで、絶縁材料からなるカバー層を加え
て、結果物としてのセンサを基板から剥がす。しかしな
がら、この剥がし工程は、完成したセンサを基板からダ
メージなしに分離するために、注意深く行わなければな
らない。不幸にも、基板上にベース層を形成する初期ス
ピン工程によって、完成したセンサを基板から分離させ
るのにコストと共に時間を要する程にベース層が基板に
固着する。これにより、望ましいことではないが薄膜セ
ンサの製造コストを増大させる。
【0004】したがって、薄膜電気化学センサを作る方
法の改良に対する要望、特に、平らな基板から完成した
センサの取り外しを容易にすることによりセンサ製造時
間およびコストを低減することに関する要望がある。本
発明は、この要望を満足させ且つそれ以上の関連した利
点を提供する。
法の改良に対する要望、特に、平らな基板から完成した
センサの取り外しを容易にすることによりセンサ製造時
間およびコストを低減することに関する要望がある。本
発明は、この要望を満足させ且つそれ以上の関連した利
点を提供する。
【0005】
【課題を解決するための手段】本発明によれば、薄膜電
気化学センサを製造する改良された組立方法が提供され
る。この方法は、コンタクトマスクリトグラフィー等に
よってガラス板のような平らな堅い基板の上に一以上の
センサを形成することからなるが、基板へのセンサの物
理的な付着を必要としない。本発明では、絶縁層からな
るベース層を真空引きし、基板との親密な接触状態にし
て、平らで安定した面を作り、この面の上に、写真平板
法により薄膜センサの残存する構成要素を作ることがで
きる。完成したセンサは、次いで、基板から迅速且つ簡
単に取り除くことができる。
気化学センサを製造する改良された組立方法が提供され
る。この方法は、コンタクトマスクリトグラフィー等に
よってガラス板のような平らな堅い基板の上に一以上の
センサを形成することからなるが、基板へのセンサの物
理的な付着を必要としない。本発明では、絶縁層からな
るベース層を真空引きし、基板との親密な接触状態にし
て、平らで安定した面を作り、この面の上に、写真平板
法により薄膜センサの残存する構成要素を作ることがで
きる。完成したセンサは、次いで、基板から迅速且つ簡
単に取り除くことができる。
【0006】本発明の好ましい形態によれば、上記平ら
で堅い基板上に、上のベース層の境界と下の基板との間
に配置されたエポキシ樹脂のような硬化可能な粘着剤の
薄いダイ・カット(die-cut) シートあるいはフレーム
で、ポリアミドのシートのような絶縁材料からなる薄膜
ベース層が置かれ、これにより、ベース層の中央部分の
下に位置する薄いキャビティを形成する。このサブ組立
体は、粘着剤を硬化させるために、適当な熱と圧力とを
受ける。キャビティ内の空気および他のガス成分は、こ
の硬化工程中にキャビティから排出され、キャビティ内
に真空を作る。この結果、ベース層の中央部分は、真空
引きされて、平らな基板の上に親密な固定された接触状
態になる。この硬化した粘着剤は、硬化後のキャビティ
内へのガスの還流に対するバリアになり、ベース層の中
央部分は、均一な平ら配置で基板上に保持される。
で堅い基板上に、上のベース層の境界と下の基板との間
に配置されたエポキシ樹脂のような硬化可能な粘着剤の
薄いダイ・カット(die-cut) シートあるいはフレーム
で、ポリアミドのシートのような絶縁材料からなる薄膜
ベース層が置かれ、これにより、ベース層の中央部分の
下に位置する薄いキャビティを形成する。このサブ組立
体は、粘着剤を硬化させるために、適当な熱と圧力とを
受ける。キャビティ内の空気および他のガス成分は、こ
の硬化工程中にキャビティから排出され、キャビティ内
に真空を作る。この結果、ベース層の中央部分は、真空
引きされて、平らな基板の上に親密な固定された接触状
態になる。この硬化した粘着剤は、硬化後のキャビティ
内へのガスの還流に対するバリアになり、ベース層の中
央部分は、均一な平ら配置で基板上に保持される。
【0007】次に、一以上の薄膜センサの残存する構成
要素が、好ましくは写真平板マスクおよびエッチング法
によって、ベース層に与えられる。例えば、導電性薄膜
が、電着、スパッタリング等によって、ベース層に与え
られる。この導電性フィルムは、適当にマスキングある
いはエッチングされて、一以上のセンサのための細長い
導体トレースを形成する。この導体トレースは、マスキ
ングおよび露光に適したフォトイメージ可能なポリアミ
ドのような絶縁材料からなるカバー層によって被覆さ
れ、そこに孔を形成して、遠位端センサチップおよび近
位端コンタクトパッドを露光させる。このセンサチップ
には、例えば、血中ブドウ糖濃度モニタ用のグルコース
オキシダーゼのような電極化学品が塗布される。これに
より形成されたセンサは、カバー層およびベース層を各
完成したセンサを囲むラインに沿って切断することによ
り、基板から取り去られ、その上で、基礎をなす基板か
ら各センサを持ち上げて簡単に分離することができる。
要素が、好ましくは写真平板マスクおよびエッチング法
によって、ベース層に与えられる。例えば、導電性薄膜
が、電着、スパッタリング等によって、ベース層に与え
られる。この導電性フィルムは、適当にマスキングある
いはエッチングされて、一以上のセンサのための細長い
導体トレースを形成する。この導体トレースは、マスキ
ングおよび露光に適したフォトイメージ可能なポリアミ
ドのような絶縁材料からなるカバー層によって被覆さ
れ、そこに孔を形成して、遠位端センサチップおよび近
位端コンタクトパッドを露光させる。このセンサチップ
には、例えば、血中ブドウ糖濃度モニタ用のグルコース
オキシダーゼのような電極化学品が塗布される。これに
より形成されたセンサは、カバー層およびベース層を各
完成したセンサを囲むラインに沿って切断することによ
り、基板から取り去られ、その上で、基礎をなす基板か
ら各センサを持ち上げて簡単に分離することができる。
【0008】本発明の他の特徴および利点は、本発明の
原理を例示として図示する添付図面と一緒にして次の詳
細な説明から一層明らかになろう。
原理を例示として図示する添付図面と一緒にして次の詳
細な説明から一層明らかになろう。
【0009】
【実施例】例示としての図面に見られるように、図1に
参照符号10で全体的に示す薄膜電気化学センサを作る
ための改良された組立方法を提供する。一以上のセンサ
10は、ガラス板のような堅い平らな基板12の上に形
成される。センサ10は、写真平板マスクおよびエッチ
ング法に合った方法で形成されているが、センサ10は
基板12に物理的に粘着又は直接的に付着されていな
い。したがって、完成後のセンサ10を基板12から簡
単な持ち上げ式分離によって取り去ることができる。
参照符号10で全体的に示す薄膜電気化学センサを作る
ための改良された組立方法を提供する。一以上のセンサ
10は、ガラス板のような堅い平らな基板12の上に形
成される。センサ10は、写真平板マスクおよびエッチ
ング法に合った方法で形成されているが、センサ10は
基板12に物理的に粘着又は直接的に付着されていな
い。したがって、完成後のセンサ10を基板12から簡
単な持ち上げ式分離によって取り去ることができる。
【0010】添付の図面に示す電気化学センサ10は、
特に、糖尿病患者の血中ぶどう糖濃度をモニタするため
の皮下又は経皮のぶどう糖センサとしての用途のために
設計されている。各センサは、基礎をなす絶縁薄膜ベー
ス層16(図2)と、上を覆う絶縁薄膜カバー層18と
の間に形成された複数の細長い薄膜導体14を有する。
カバー層18には、遠位端電極24と近位端コンタクト
パッド26とを露出させる孔20、22(図10)が形
成されている。ぶどう糖をモニタする適用例では、遠位
端電極24を患者の血液あるいは細胞外の液体と直接接
触する状態に置くようにして、薄膜センサ10が経皮的
に置かれる。ここに、コンタクトパッド26は、モニタ
装置(図示せず)との都合のよい接続のために外部に配
置される。
特に、糖尿病患者の血中ぶどう糖濃度をモニタするため
の皮下又は経皮のぶどう糖センサとしての用途のために
設計されている。各センサは、基礎をなす絶縁薄膜ベー
ス層16(図2)と、上を覆う絶縁薄膜カバー層18と
の間に形成された複数の細長い薄膜導体14を有する。
カバー層18には、遠位端電極24と近位端コンタクト
パッド26とを露出させる孔20、22(図10)が形
成されている。ぶどう糖をモニタする適用例では、遠位
端電極24を患者の血液あるいは細胞外の液体と直接接
触する状態に置くようにして、薄膜センサ10が経皮的
に置かれる。ここに、コンタクトパッド26は、モニタ
装置(図示せず)との都合のよい接続のために外部に配
置される。
【0011】基板12は、写真平板マスクおよびエッチ
ング処理での使用に適した堅く且つ平らな構造を有す
る。これに関し、基板12は、高い均一平面度を有する
上面28(図3)を有する。この滑らかな上面28を形
成するのに、みがきガラス板を用いてもよい。その代わ
りの基板材料としては、例えば、ステンレス鋼、アルミ
ニウム、Delrinのようなプラスチック材料等がある。
ング処理での使用に適した堅く且つ平らな構造を有す
る。これに関し、基板12は、高い均一平面度を有する
上面28(図3)を有する。この滑らかな上面28を形
成するのに、みがきガラス板を用いてもよい。その代わ
りの基板材料としては、例えば、ステンレス鋼、アルミ
ニウム、Delrinのようなプラスチック材料等がある。
【0012】硬化可能な粘着剤からなる薄膜層30は、
ダイ・カット(die-cut) のストリップあるいはフレーム
の形で示されるように設けられるが、図3に示すように
基板12の境界部に閉ループのパターンで塗布される。
次いで、ベース層16は、ベース層16の境界部が粘着
性ストリップ30の上に親密な固定的な接触状態で、基
板12に定置される。このようにして組立られた構成部
品は、ベース層16の中央部分と、基礎をなす基板12
との間に浅いキャビティ32を有し、粘着性ストリップ
30はキャビティ32の周辺縁の回りの境界を画する。
好ましい形態では、ベース層16は、約0.003 インチ
(0.0076cm)程度の膜厚を有するポリアミドのような絶縁
材料の薄膜シートからなる。粘着性ストリップ30は、
ミズーリ州、スプリングフィールドの3M Aerospace部門
から、商品名AF-163-205T で入手可能であるエポキシ樹
脂のようなガラス繊維で含浸されるエポキシ樹脂からな
る。その代わりの粘着材料としては、紫外線硬化粘着剤
等であってもよい。更に、ベース層16と粘着性ストリ
ップ30との間で改良された粘着が望ましいのであれ
ば、ベース層16の境界領域は、エッチングされた面で
あればよい。
ダイ・カット(die-cut) のストリップあるいはフレーム
の形で示されるように設けられるが、図3に示すように
基板12の境界部に閉ループのパターンで塗布される。
次いで、ベース層16は、ベース層16の境界部が粘着
性ストリップ30の上に親密な固定的な接触状態で、基
板12に定置される。このようにして組立られた構成部
品は、ベース層16の中央部分と、基礎をなす基板12
との間に浅いキャビティ32を有し、粘着性ストリップ
30はキャビティ32の周辺縁の回りの境界を画する。
好ましい形態では、ベース層16は、約0.003 インチ
(0.0076cm)程度の膜厚を有するポリアミドのような絶縁
材料の薄膜シートからなる。粘着性ストリップ30は、
ミズーリ州、スプリングフィールドの3M Aerospace部門
から、商品名AF-163-205T で入手可能であるエポキシ樹
脂のようなガラス繊維で含浸されるエポキシ樹脂からな
る。その代わりの粘着材料としては、紫外線硬化粘着剤
等であってもよい。更に、ベース層16と粘着性ストリ
ップ30との間で改良された粘着が望ましいのであれ
ば、ベース層16の境界領域は、エッチングされた面で
あればよい。
【0013】ベース層16と基材12とを有するサブ組
立体は、図5に概略的に示すような硬化工程を受ける。
図示のように、これらの構成部品はプレス34の中に置
かれて、粘着材料30を硬化させるために、適当な加熱
と圧力を受ける。この硬化工程中、空気及び他のガス成
分がキャビティ32から排出され、これによって、キャ
ビティ32内が効果的な真空になり、ベース層16の中
央部分を真空引きして、基板12の平らな上面28と親
密な、なにものにもさいぎられない面対面の係合状態に
する。粘着材料30が実質的に硬化した状態に達する
と、キャビティ32へのガス成分の再侵入は防止され、
これにより、ベース層16の中央部分は、基板12との
親密な係合状態で保持される。
立体は、図5に概略的に示すような硬化工程を受ける。
図示のように、これらの構成部品はプレス34の中に置
かれて、粘着材料30を硬化させるために、適当な加熱
と圧力を受ける。この硬化工程中、空気及び他のガス成
分がキャビティ32から排出され、これによって、キャ
ビティ32内が効果的な真空になり、ベース層16の中
央部分を真空引きして、基板12の平らな上面28と親
密な、なにものにもさいぎられない面対面の係合状態に
する。粘着材料30が実質的に硬化した状態に達する
と、キャビティ32へのガス成分の再侵入は防止され、
これにより、ベース層16の中央部分は、基板12との
親密な係合状態で保持される。
【0014】図6は、絶縁ベース層16に導電性センサ
トレースを形成する写真平板工程を示す。より詳しく
は、ベース層16は、始めに、電極蒸着、面スパッタリ
ングあるいは他の適当な処理工程によって薄膜導電層3
8でコーティングされる。好ましい形態では、この導電
層38は、例えば、ポリイミドのベース層16への化学
的な粘着に適した始めのクロムベースの層の次に、金ベ
ースおよびクロムベースの薄膜層を順次形成したよう
な、複数の薄膜導電層として設けられてもよい。
トレースを形成する写真平板工程を示す。より詳しく
は、ベース層16は、始めに、電極蒸着、面スパッタリ
ングあるいは他の適当な処理工程によって薄膜導電層3
8でコーティングされる。好ましい形態では、この導電
層38は、例えば、ポリイミドのベース層16への化学
的な粘着に適した始めのクロムベースの層の次に、金ベ
ースおよびクロムベースの薄膜層を順次形成したよう
な、複数の薄膜導電層として設けられてもよい。
【0015】次いで、導電層38は、在来の写真平板法
により、所定のフォトレジストコーティング40で被覆
され、そして、コンタクトマスク42が、適当なフィト
イメージング(photoimaging)のために、フォトレジスト
コーティング40の上に設けられる。コンタクトマスク
42は、精密にネストされた関係で(in closely nested
relation)フォトレジストコーティング40の適当な露
光のための図6に示す複数のトレースのような一以上の
導体トレースパターンを有し、次に、エッチング工程が
続いて、これによって、図7に示すように、ベース層1
6に複数の導電性センサトレース44が残る。皮下ぶど
う糖センサとしての用途のために設計された図示のセン
サ構造においては、各センサトレースは、後に説明する
ような3つの分離した電極24に対応する3つの平行な
導体14を有するように示される。
により、所定のフォトレジストコーティング40で被覆
され、そして、コンタクトマスク42が、適当なフィト
イメージング(photoimaging)のために、フォトレジスト
コーティング40の上に設けられる。コンタクトマスク
42は、精密にネストされた関係で(in closely nested
relation)フォトレジストコーティング40の適当な露
光のための図6に示す複数のトレースのような一以上の
導体トレースパターンを有し、次に、エッチング工程が
続いて、これによって、図7に示すように、ベース層1
6に複数の導電性センサトレース44が残る。皮下ぶど
う糖センサとしての用途のために設計された図示のセン
サ構造においては、各センサトレースは、後に説明する
ような3つの分離した電極24に対応する3つの平行な
導体14を有するように示される。
【0016】導電性センサトレース44は、絶縁材料か
らなる薄膜カバー層18によって覆われている。この工
程は、図7に示すように、センサトレース44の上に液
体ベースの絶縁材料45を加え、次いで、矢印46で示
すように基板12をスピンさせて、センサトレース44
の上の且つセンサのマージン縁を超えて延びる薄膜とし
て液体材料45をベース層と密閉した接触状態で分配す
る。この液体材料は、次いで、図8に示すような、適当
な放射線及び/又は熱硬化工程を受ける。種々のカバー
層材料を用いてもよいが、好ましい材料としては、ニュ
ージャージー州、ウエスト・パターソンのOCG社から
入手可能なフォトイメージ可能なポリイミド(製品番号
7020)である。
らなる薄膜カバー層18によって覆われている。この工
程は、図7に示すように、センサトレース44の上に液
体ベースの絶縁材料45を加え、次いで、矢印46で示
すように基板12をスピンさせて、センサトレース44
の上の且つセンサのマージン縁を超えて延びる薄膜とし
て液体材料45をベース層と密閉した接触状態で分配す
る。この液体材料は、次いで、図8に示すような、適当
な放射線及び/又は熱硬化工程を受ける。種々のカバー
層材料を用いてもよいが、好ましい材料としては、ニュ
ージャージー州、ウエスト・パターソンのOCG社から
入手可能なフォトイメージ可能なポリイミド(製品番号
7020)である。
【0017】図9は、硬化したカバー層18の上に置く
ためのコンタクトマスク47を示す。コンタクトマスク
47は、そこに形成された孔48、50を有し、これら
の孔を通して、フォトイメージ可能な層18を適当な光
源に晒すことができる。このようにして露光されたカバ
ー層18は、続いて、カバー層18の部分を除去するた
めに処理され、この結果、各センサトレースの遠位端セ
ンサチップおよび近位端コンタクトパッド26を夫々露
出させる孔20、22になる(図10)。
ためのコンタクトマスク47を示す。コンタクトマスク
47は、そこに形成された孔48、50を有し、これら
の孔を通して、フォトイメージ可能な層18を適当な光
源に晒すことができる。このようにして露光されたカバ
ー層18は、続いて、カバー層18の部分を除去するた
めに処理され、この結果、各センサトレースの遠位端セ
ンサチップおよび近位端コンタクトパッド26を夫々露
出させる孔20、22になる(図10)。
【0018】孔20を介したセンサチップの露光に続い
て或いはカバー層18の適用の前に、遠位端電極24を
作る適当な電極化学品をセンサチップに塗布することが
できる。ぶどう糖センサとしての用途のための図示の実
施例のセンサでは、センサチップの一つが、グルコース
オキシダーゼを含有する電極化学品で被覆されて、実働
(working) 電極を形成している。他の2つの電極24
は、電気化学センサ用参照電極および対抗電極を形成す
るために、他の適当な化学品で被覆されていてもよく、
或いは、被覆しないままに残されていてもよい。
て或いはカバー層18の適用の前に、遠位端電極24を
作る適当な電極化学品をセンサチップに塗布することが
できる。ぶどう糖センサとしての用途のための図示の実
施例のセンサでは、センサチップの一つが、グルコース
オキシダーゼを含有する電極化学品で被覆されて、実働
(working) 電極を形成している。他の2つの電極24
は、電気化学センサ用参照電極および対抗電極を形成す
るために、他の適当な化学品で被覆されていてもよく、
或いは、被覆しないままに残されていてもよい。
【0019】完成したセンサ10は、基板12上の各セ
ンサを囲むライン11に沿って切断することにより、基
板12から素早く且つ簡単に取り除かれる。図11は、
レーザ切断装置52を含む切断工程を示し、レーザ切断
装置52は、ベース層16とカバー層18とを、導電要
素から外方に僅かに間隔を隔てた関係で各センサを囲む
或いは回りを画すラインに沿って切断するのに用いら
れ、その結果、完成したセンサの側縁を密閉するのに十
分な相互結合したベースおよびカバー材料が残る。ベー
ス層16が、基礎をなす基板12に物理的に付着され或
いは直接的に粘着されるので、重要な更なる処理工程無
しに或いは基板からその付着したセンサを物理的に引っ
張ったり剥ぎとることによって受ける応力に起因する潜
在的なダメージ無しに、センサ10を基板から素早く且
つ簡単に持ち上げることができる。その後、基板12
は、洗浄され、再使用され、或いは、処分される。
ンサを囲むライン11に沿って切断することにより、基
板12から素早く且つ簡単に取り除かれる。図11は、
レーザ切断装置52を含む切断工程を示し、レーザ切断
装置52は、ベース層16とカバー層18とを、導電要
素から外方に僅かに間隔を隔てた関係で各センサを囲む
或いは回りを画すラインに沿って切断するのに用いら
れ、その結果、完成したセンサの側縁を密閉するのに十
分な相互結合したベースおよびカバー材料が残る。ベー
ス層16が、基礎をなす基板12に物理的に付着され或
いは直接的に粘着されるので、重要な更なる処理工程無
しに或いは基板からその付着したセンサを物理的に引っ
張ったり剥ぎとることによって受ける応力に起因する潜
在的なダメージ無しに、センサ10を基板から素早く且
つ簡単に持ち上げることができる。その後、基板12
は、洗浄され、再使用され、或いは、処分される。
【0020】かくして、本発明は、改良されたセンサ組
立方法、つまり基板へのセンサの直接的な物理的粘着あ
るいは付着を必要としないで、平らな基板上に薄膜の可
撓性電気化学センサを形成する方法を提供する。本発明
の組立方法の種々の変更あるいは改良は、当業者にとっ
て明らかであろう。したがって、特許請求の範囲で述べ
たことを除いて、上記の説明および添付の図面によって
本発明の限定を意図するものではない。
立方法、つまり基板へのセンサの直接的な物理的粘着あ
るいは付着を必要としないで、平らな基板上に薄膜の可
撓性電気化学センサを形成する方法を提供する。本発明
の組立方法の種々の変更あるいは改良は、当業者にとっ
て明らかであろう。したがって、特許請求の範囲で述べ
たことを除いて、上記の説明および添付の図面によって
本発明の限定を意図するものではない。
【図1】堅い平らな基板上に形成された複数の薄膜電気
化学センサを示す分解斜視図。
化学センサを示す分解斜視図。
【図2】図1の2−2線に沿って切断した拡大断面図。
【図3】基板の境界に対する硬化可能な粘着剤のダイー
カットストリップの適用を示す斜視図。
カットストリップの適用を示す斜視図。
【図4】基板への薄膜ベース層の配置を示す分解斜視
図。
図。
【図5】ベース層と基板との間に介在された粘着剤を硬
化させるための硬化工程を概略的に示す図。
化させるための硬化工程を概略的に示す図。
【図6】ベース層に導電性センサトレースを形成する写
真平板マスク工程およびエッチング工程を示す一部切欠
分解斜視図。
真平板マスク工程およびエッチング工程を示す一部切欠
分解斜視図。
【図7】導電性センサトレースの上の薄膜の塗布を示す
斜視図。
斜視図。
【図8】カバー層を硬化させる硬化工程の概略図。
【図9】導電性センサトレースの一部を露光するフォト
イメージ工程を示す拡大斜視図。
イメージ工程を示す拡大斜視図。
【図10】絶縁カバー層を通して露光されたセンサコン
タクトパッドおよび遠位端を示す拡大部分斜視図。
タクトパッドおよび遠位端を示す拡大部分斜視図。
【図11】基板から完成後のセンサの各々の取り除きを
示す斜視図。
示す斜視図。
10 電気化学センサ 12 基板 18 フォトイメージ可能な層(カバー層) 16 絶縁薄膜ベース層 20、22 孔 30 硬化可能な粘着剤からなる薄膜層 38 薄膜導電層 40 フォトレジストコーティング 42 コンタクトマスク 44 導電性センサトレース 47 コンタクトマスク 52 レーザ切断装置
Claims (10)
- 【請求項1】 堅い基板の平らな面に硬化可能な粘着剤
を閉ループのパターンで塗布する工程と、 絶縁シート材料からなるベース層を、前記基板と該ベー
ス層との間の該ベース層のほぼ境界に介在する前記粘着
剤で、前記基板と組み立てて、前記基板と前記ベース層
の中央部分との間に浅いキャビティを形成する工程と、 組立られたベース層および基板に熱と圧力を加えて、前
記キャビティから空気を排出して前記ベース層の中央部
分を前記基板との親密な面接触状態に置き、また、前記
粘着剤を硬化させて前記キャビティを密閉して前記キャ
ビティへの空気の還流を防止する工程と、 少なくとも1つの導電性センサ要素を前記ベース層に形
成する工程と、 前記少なくとも1の導電性センサ要素を覆い且つそのマ
ージン縁を超えて前記ベース層と密閉した接触状態で延
びるように絶縁材料からなるカバー層を形成する工程
と、 前記カバー層および前記ベース層を、前記少なくとも1
つのセンサ要素の回りの境界を画し且つ該センサ要素か
ら外方に間隔が隔てられたラインに沿って切断すること
により、前記基板から前記センサを取り除く工程と、か
らなる薄膜電気化学センサを作る方法。 - 【請求項2】 前記少なくとも1の導電性センサ要素を
形成する工程が、前記ベース層に複数の導電性センサ要
素を形成することからなり、前記カバー層形成工程が、
前記複数のセンサ要素を覆い且つ各センサ要素のマージ
ン縁を超えて前記ベース層と密閉した接触状態で延びる
ように前記カバー層を形成する工程からなり、更に、前
記取り除き工程が、前記カバー層および前記ベース層を
各センサ要素の境界を画すラインに沿って切断する工程
からなる、請求項1の方法。 - 【請求項3】 前記センサ要素形成工程が、写真平板マ
スク工程とエッチング工程とからなる、請求項1の方
法。 - 【請求項4】 更に、所定の電極化学品を前記少なくと
も1つの導電性センサ要素に塗布する工程を有する、請
求項1の方法。 - 【請求項5】 前記少なくとも1つの導電性センサ要素
が、細長い形状であり、更に、前記カバー層に孔を形成
して、前記センサ要素の所定の部分をほぼその両端で露
出させる工程を有する、請求項1の方法。 - 【請求項6】 前記カバー層形成工程が、前記センサ要
素形成工程に続いて、前記ベース層に液体の形態の絶縁
材料を塗布する工程と、前記基板をその上のベース層と
共にスピンさせて、前記液体絶縁材料を薄膜に形成する
工程と、前記液体絶縁材料を硬化させて前記カバー層を
形成する工程とからなる、請求項1の方法。 - 【請求項7】 前記カバー層形成工程が、フォトイメー
ジ可能な絶縁材料から前記カバー層を形成し、前記カバ
ー層に孔を形成してフォトマスキングによって前記少な
くとも1つのセンサ要素の所定の部分を露光させ、前記
カバー層の部分を取り除くことからなる、請求項1の方
法。 - 【請求項8】 前記ベース層がポリイミドシート材料で
ある、請求項1の不法。 - 【請求項9】 前記ベース層の中央部分が前記基板に付
着されていない、請求項1の方法。 - 【請求項10】 更に、前記ベース層の中央部分を真空
引きして、前記基板と親密な面接触の状態にする、請求
項1の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/212,961 US5391250A (en) | 1994-03-15 | 1994-03-15 | Method of fabricating thin film sensors |
US08/212961 | 1994-03-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07286987A true JPH07286987A (ja) | 1995-10-31 |
Family
ID=22793137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7055584A Pending JPH07286987A (ja) | 1994-03-15 | 1995-03-15 | 薄膜センサの組立方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5391250A (ja) |
EP (1) | EP0677743A3 (ja) |
JP (1) | JPH07286987A (ja) |
CA (1) | CA2143693A1 (ja) |
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Also Published As
Publication number | Publication date |
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EP0677743A3 (en) | 1997-05-07 |
US5391250A (en) | 1995-02-21 |
EP0677743A2 (en) | 1995-10-18 |
CA2143693A1 (en) | 1995-09-16 |
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