JPH07285097A - プリント回路基板等の穿孔装置 - Google Patents

プリント回路基板等の穿孔装置

Info

Publication number
JPH07285097A
JPH07285097A JP6291695A JP29169594A JPH07285097A JP H07285097 A JPH07285097 A JP H07285097A JP 6291695 A JP6291695 A JP 6291695A JP 29169594 A JP29169594 A JP 29169594A JP H07285097 A JPH07285097 A JP H07285097A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
surface layer
punching
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6291695A
Other languages
English (en)
Japanese (ja)
Inventor
Thomas Kunz
クンツ トマス
Gerhard Voith
フォイト ゲルハルト
Ulrich Rock
ロック ウルリッヒ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schmoll Maschinenfab Werkzeug & Vorrichtungsbau GmbH
Shiyumoole Mas Fab Werkzeug & Fuoritsuhitsunkusuboo GmbH
Schmoll Maschinen GmbH
Original Assignee
Schmoll Maschinenfab Werkzeug & Vorrichtungsbau GmbH
Shiyumoole Mas Fab Werkzeug & Fuoritsuhitsunkusuboo GmbH
Schmoll Maschinen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schmoll Maschinenfab Werkzeug & Vorrichtungsbau GmbH, Shiyumoole Mas Fab Werkzeug & Fuoritsuhitsunkusuboo GmbH, Schmoll Maschinen GmbH filed Critical Schmoll Maschinenfab Werkzeug & Vorrichtungsbau GmbH
Publication of JPH07285097A publication Critical patent/JPH07285097A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/26—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring depth
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/22—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Control Of Cutting Processes (AREA)
  • Laminated Bodies (AREA)
JP6291695A 1993-11-26 1994-11-25 プリント回路基板等の穿孔装置 Pending JPH07285097A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4340249A DE4340249A1 (de) 1993-11-26 1993-11-26 Vorrichtung zum Tiefenbohren von Leiterplatten o. dgl.
DE4340249:6 1993-11-26

Publications (1)

Publication Number Publication Date
JPH07285097A true JPH07285097A (ja) 1995-10-31

Family

ID=6503463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6291695A Pending JPH07285097A (ja) 1993-11-26 1994-11-25 プリント回路基板等の穿孔装置

Country Status (3)

Country Link
JP (1) JPH07285097A (it)
DE (1) DE4340249A1 (it)
IT (1) IT1278342B1 (it)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006526776A (ja) * 2003-06-02 2006-11-24 ノバトール アーベー オービタル切削工具によって加工された複合材料加工体孔の深さ測定方法および深さ測定装置
JP2009004585A (ja) * 2007-06-22 2009-01-08 Hitachi Via Mechanics Ltd プリント基板の製造方法及びプリント基板
CN102686050A (zh) * 2012-06-04 2012-09-19 广东成德电路股份有限公司 多层印制电路板的盲孔制作方法
CN103692485A (zh) * 2013-12-31 2014-04-02 林晓辉 皮带钻孔器
CN110402032A (zh) * 2019-08-16 2019-11-01 孔令飞 一种利用热传导性对电路板进行预加工的设备
CN112440331A (zh) * 2019-09-03 2021-03-05 维亚机械株式会社 基板开孔装置以及基板开孔方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1285334B1 (it) 1996-05-17 1998-06-03 Pluritec Italia Apparecchiatura e relativo metodo di controllo della profondita' di lavorazione per una macchina operatrice per piastre di circuiti
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
FR2774617B1 (fr) 1998-02-06 2000-05-05 St Microelectronics Sa Procede et machine d'usinage d'une cavite dans une carte a puce electronique renfermant une antenne
FR2781589A1 (fr) * 1998-07-22 2000-01-28 Solaic Sa Dispositif de fraisage d'au moins une cavite a l'aplomb d'une antenne noyee dans un corps de carte, antenne pour carte a circuit integre et corps de carte comprenant une telle antenne
DE10040303C2 (de) * 2000-08-17 2002-07-11 Volker Nissen Verfahren zum definierten Tiefenbohren von Sacklöchern (blind vias) in mehrlagigen Leiterplatten (Multilayer)
DE10056184A1 (de) * 2000-11-13 2002-05-29 Cimatec Gmbh Produkte Fuer Lei Bohrunterlage
EP1248502A1 (fr) * 2001-04-02 2002-10-09 Posalux S.A. Procédé de détermination d'incertitudes pour machine à perforer des plaquettes à circuits imprimés
EP1663569A4 (en) * 2003-09-19 2009-04-15 Viasystems Group Inc BORE HOUSING SYSTEM WITH CLOSED LOOP
DE102012203318A1 (de) 2011-12-22 2013-06-27 Rohde & Schwarz Gmbh & Co. Kg Verfahren zum Freilegen einer Schicht einer Leiterplatte und entsprechend freigelegte Leiterplatte
DE102013004679B4 (de) * 2013-03-19 2017-11-23 Skybrain Vermögensverwaltung GmbH Vorrichtung und Verfahren zum Bearbeiten von Leiterplatten
EP2987576A1 (de) 2014-08-19 2016-02-24 Skybrain Vermögensverwaltungs GmbH Verfahren zur Herstellung einer Bohrung und Bohrmaschine hierfür
DE102018127991A1 (de) * 2018-11-08 2020-05-14 Deutsches Zentrum für Luft- und Raumfahrt e.V. Verfahren zur mechanischen Bearbeitung einer Sandwichstruktur, Werkzeugeinrichtung und Sandwichstruktur
WO2021207351A1 (en) 2020-04-07 2021-10-14 Nextgin Technology Bv Methods and systems for back-drilling a multi-layer circuit board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3206354A1 (de) * 1982-02-22 1983-09-01 Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt Vorrichtung zum aendern oder reparieren von nicht sichtbaren leiterbahnmustern von mehrlagigen leiterplatten
US4765784A (en) * 1984-12-06 1988-08-23 Advanced Controls, Inc. Electronic depth control for drill
DE3719167C1 (de) * 1987-06-09 1988-11-03 Klingelnberg Soehne Numerisch gesteuerte Leiterplatten-Bearbeitungsmaschine

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006526776A (ja) * 2003-06-02 2006-11-24 ノバトール アーベー オービタル切削工具によって加工された複合材料加工体孔の深さ測定方法および深さ測定装置
JP2009004585A (ja) * 2007-06-22 2009-01-08 Hitachi Via Mechanics Ltd プリント基板の製造方法及びプリント基板
KR101465264B1 (ko) * 2007-06-22 2014-11-26 비아 메카닉스 가부시키가이샤 프린트 기판의 제조 방법 및 프린트 기판
CN102686050A (zh) * 2012-06-04 2012-09-19 广东成德电路股份有限公司 多层印制电路板的盲孔制作方法
CN103692485A (zh) * 2013-12-31 2014-04-02 林晓辉 皮带钻孔器
CN110402032A (zh) * 2019-08-16 2019-11-01 孔令飞 一种利用热传导性对电路板进行预加工的设备
CN112440331A (zh) * 2019-09-03 2021-03-05 维亚机械株式会社 基板开孔装置以及基板开孔方法
CN112440331B (zh) * 2019-09-03 2023-05-23 维亚机械株式会社 基板开孔装置以及基板开孔方法

Also Published As

Publication number Publication date
IT1278342B1 (it) 1997-11-17
ITBZ940062A1 (it) 1996-05-25
DE4340249A1 (de) 1995-06-01
ITBZ940062A0 (it) 1994-11-25

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