JPH07285097A - Device for punching printed circuit board,etc - Google Patents
Device for punching printed circuit board,etcInfo
- Publication number
- JPH07285097A JPH07285097A JP6291695A JP29169594A JPH07285097A JP H07285097 A JPH07285097 A JP H07285097A JP 6291695 A JP6291695 A JP 6291695A JP 29169594 A JP29169594 A JP 29169594A JP H07285097 A JPH07285097 A JP H07285097A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- surface layer
- punching
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004080 punching Methods 0.000 title claims description 21
- 239000010410 layer Substances 0.000 claims abstract description 41
- 239000002344 surface layer Substances 0.000 claims abstract description 37
- 238000005553 drilling Methods 0.000 claims description 33
- 238000012360 testing method Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000012795 verification Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010626 work up procedure Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/26—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring depth
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/22—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Control Of Cutting Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリント回路基板等の穿
孔装置に関し、穿孔具、例えば、ドリルを把持する穿孔
スピンドルを機械テーブル上に載置したプリント回路基
板の導電性表面層の方向に下降させると共に、プリント
回路基板表面層に対するドリルの高さ位置を高さ測定装
置により測定する穿孔装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a punching device for a printed circuit board or the like, which is lowered in the direction of a conductive surface layer of a printed circuit board on which a punching tool, for example, a drilling spindle for holding a drill is placed on a machine table. The present invention also relates to a drilling device for measuring a height position of a drill with respect to a surface layer of a printed circuit board by a height measuring device.
【０００２】[0002]
【従来の技術】多層プリント回路基板には、その利用性
を向上するため、貫通孔だけでなく盲穴も設けられ、こ
れら盲穴は表面層からプリント回路基板の内部における
所定の導電層に達する。小型化が進むと共に層の厚さも
薄くなるため、盲穴の深さ（プリント回路基板表面層に
対し測定）は数ミクロンの誤差しか許容されない。従
来、この要求には、ドリルヘッドに検定ユニットを装備
すること─ドリルヘッドの送り測定装置に加えて第２の
深さ測定装置─により対応する努力がされてきた。Multilayer printed circuit boards are provided with through holes as well as blind holes in order to improve their utility, and these blind holes extend from a surface layer to a predetermined conductive layer inside the printed circuit board. . Due to the miniaturization and thinner layers, the blind hole depth (measured against the printed circuit board surface layer) can only tolerate a few microns. In the past, efforts have been made to meet this requirement by equipping the drill head with a verification unit-a second depth measuring device in addition to the drill head feed measuring device.
【０００３】[0003]
【発明が解決しようとする課題】この場合、ドリルヘッ
ドに工具を取り付けた後に、ドリルヘッドが検定ユニッ
トと共に移動し、下降し、前記第２の深さ測定装置にゼ
ロパルスを送り、これにより制御装置がプリント回路基
板の表面層に対する工具先端位置を検出する。しかし、
その穿孔精度は、諸々の不正確さ、つまり穿孔スピンド
ル、Ｚ軸送り、コンピュータ数値制御（ＣＮＣ）、取付
板、第２深さ測定装置の機械的取付け、工具（たとえば
熱膨脹による）等の不正確さと共に、プリント回路基板
材料の不均一性、環境の影響（たとえば汚染）および機
械の保守等によっても阻害される。加えて、追加計測装
置および、例えば、レーザー内蔵の検定ユニットのため
に、多大な設備が必要になる。In this case, after mounting the tool on the drill head, the drill head moves with the verification unit and descends, sending a zero pulse to the second depth measuring device, which results in a control device. Detects the tool tip position with respect to the surface layer of the printed circuit board. But,
The drilling accuracy depends on various inaccuracies such as drilling spindle, Z-axis feed, computer numerical control (CNC), mounting plate, mechanical mounting of the second depth measuring device, tools (for example due to thermal expansion). Along with this, non-uniformity of printed circuit board materials, environmental influences (eg contamination) and machine maintenance are also hindered. In addition, a large amount of equipment is required due to the additional measuring device and, for example, the laser-embedded verification unit.
【０００４】本発明の目的は、より高い穿孔精度を簡単
な構造で達成しうる穿孔装置を提供することにある。An object of the present invention is to provide a punching device capable of achieving higher punching accuracy with a simple structure.
【０００５】[0005]
【課題を解決するための手段】前記の目的を達成するた
めに、本発明は、穿孔具を支持する穿孔スピンドルを機
械テーブル上に配置されたプリント回路基板の導電性表
面層の方向に下降させると共に、プリント回路基板表面
に対する前記穿孔具の各高さ位置を高さ測定装置により
測定するプリント回路基板等の穿孔装置において、穿孔
具と導電性表面層もしくはｎ番目の回路基板層との間に
電位差（ΔＰ）を発生させると共に、穿孔具の先端と表
面層との接触に際し前記穿孔具と表面層との間で測定し
うる信号を孔の深さのゼロレベルの決定に用い、必要に
応じ該穿孔具の先端とｎ番目の回路基板層との接触に際
し測定しうる信号を孔の深さの最終レベルの決定に用い
ることを特徴とする。To achieve the above object, the present invention lowers a drilling spindle supporting a drilling tool toward a conductive surface layer of a printed circuit board disposed on a machine table. At the same time, in a punching device such as a printed circuit board in which each height position of the punching tool with respect to the surface of the printed circuit board is measured by a height measuring device, between the punching tool and the conductive surface layer or the nth circuit board layer. A potential difference (ΔP) is generated, and a signal that can be measured between the tip of the punch and the surface layer upon contact with the tip of the punch is used to determine the zero level of the depth of the hole, and if necessary, It is characterized in that a signal which can be measured upon contact between the tip of the punch and the nth circuit board layer is used for determining the final level of the depth of the hole.
【０００６】[0006]
【作用】以上の構成において、穿孔具とプリント回路基
板の導電性表面層乃至ｎ番目の導電層との間に電位差を
与え、該穿孔具の先端と表面層との接触時に穿孔具と表
面層との間に発生する信号を検出して孔の深さのゼロレ
ベルを決定し、必要に応じ穿孔具の先端とｎ番目の導電
層との接触時に発生する信号を孔の深さの最終レベルの
決定に用いる。In the above structure, a potential difference is applied between the punch and the conductive surface layer to the n-th conductive layer of the printed circuit board, and when the tip of the punch and the surface layer come into contact with each other, the punch and the surface layer. The zero level of the depth of the hole is determined by detecting the signal generated between the hole and the final level of the depth of the hole, and the signal generated at the time of contact between the tip of the drilling tool and the nth conductive layer is detected. Used to determine.
【０００７】このようにして、深さの測定にはいかなる
付加的な測定装置も検定ステーションも必要としない。
さらに孔の深さは、プリント回路基板の凹凸が深さの許
容度に対して全く或いは極く僅かな影響しか与えないよ
うに、穿孔具を当てる位置から常に正確に測定される。
盲穴が達するｎ番目の導電層の固定した所定深さ位置か
ら出発する場合にも、従来から知られた装置に比べて本
発明によるゼロレベルの決定は一層高い穿孔精度をもた
らす。In this way, no additional measuring device or verification station is required for depth measurement.
Furthermore, the depth of the holes is always accurately measured from the position of the punch, so that the irregularities of the printed circuit board have no or only a slight influence on the depth tolerance.
Even when starting from a fixed, predetermined depth position of the nth conductive layer reached by the blind hole, the determination of the zero level according to the invention leads to a higher drilling accuracy compared to previously known devices.
【０００８】穿孔具の先端がｎ番目の導電層に接触する
時点をもって最終レベルを決定する本発明の計測原理を
各盲穴の場合に用いれば、ｎ番目の導電層の深さ位置の
不均一性が補償され、深さの許容度をさらに縮小するこ
とができる。If the measuring principle of the present invention, which determines the final level when the tip of the punch touches the nth conductive layer, is applied to each blind hole, the depth position of the nth conductive layer is not uniform. And the depth tolerance can be further reduced.
【０００９】また、本発明の装置では、穿孔スピンドル
の送りのためにいずれの場合にも存在する高さ測定装置
を、孔の深さの測定にも用いることができる。穿孔具先
端の接触により確定されるゼロレベルから出発して、深
さ測定信号が既存の高さ測定装置の別個のカウンタへ適
宜に送られる。In the device according to the invention, the height-measuring device which is present in each case for feeding the drilling spindle can also be used for measuring the depth of the hole. Starting from a zero level determined by the contact of the piercer tip, the depth measurement signal is conveniently sent to a separate counter of the existing height measuring device.
【００１０】しかも、穿孔具の電位Ｐｂは工具ロータへ
の、例えば、電極を用いる直接的な機械的接触により与
えることができる。しかし、電位Ｐｂをインダクタンス
または容量を介して、すなわち穿孔具に無接触で与える
ことができれば好都合である。Moreover, the electric potential Pb of the punch can be applied to the tool rotor by direct mechanical contact, for example using electrodes. However, it would be advantageous if the potential Pb could be applied via inductance or capacitance, i.e. without contact to the punch.
【００１１】導電性表面層の電位Ｐｏは直接的接触によ
っても得られるが、本発明の好適な実施例ではクランプ
を電位Ｐｏに接続することにより得ることができる。こ
のクランプは導電性材料（たとえば金属）からなり、穿
孔スピンドルに付設されてプリント回路基板の表面層ま
で下降して当該表面層に接触することができる。The potential Po of the conductive surface layer can also be obtained by direct contact, but in the preferred embodiment of the invention it can be obtained by connecting a clamp to the potential Po. The clamp is made of a conductive material (e.g. metal) and can be attached to the drilling spindle and lowered to the surface layer of the printed circuit board to contact the surface layer.
【００１２】本発明によりゼロレベルの決定に用いられ
る測定値を用いて、穿孔時の穿孔具の最終レベル（所望
の最終位置）の決定が阻害されないように、穿孔具は好
ましくは０ボルトの電位Ｐｂに設定されると共に、プリ
ント回路基盤の表面層乃至ｎ番目の導電層はＰボルト
（Ｐ≠０）の電位Ｐｏ乃至Ｐｎに設定される。この場
合、コマンドレートの助けにより、どの導電層から信号
が発生したかをも確認することができる。The punch is preferably at a potential of 0 volts so that the measurement used according to the invention for determining the zero level is not disturbed in determining the final level (desired final position) of the punch during drilling. While being set to Pb, the surface layer to the nth conductive layer of the printed circuit board are set to potentials Po to Pn of P volt (P ≠ 0). In this case, it is also possible to confirm from which conductive layer the signal originated, with the aid of the command rate.
【００１３】該穿孔具の先端が盲穴が到達すべきｎ番目
の導電層に接触するまでは制動過程が開始されない等、
穿孔具の送り速度が速い場合には、送りをあまり急速に
制動すると問題を生じるので、本発明の他の実施例で
は、ｎ番目の導電層の深さ位置を予備決定するため先ず
最初に試験穿孔を行うことを提案している。引き続く穿
孔に際しては、穿孔具の送り速度を、ｎ番目の導電層の
表面層（その深さ位置は予め知られている）に達する僅
か手前でより小さい値に切り換え、穿孔具先端とｎ番目
の導電層との接触時の「制動距離」が適度に小さくなる
ようにする。The braking process does not start until the tip of the punch touches the nth conductive layer that the blind hole should reach, etc.
If the feed rate of the punch is high, braking the feed too quickly causes problems, so in another embodiment of the invention, first a test is performed to predetermine the depth position of the nth conductive layer. It proposes to drill. During the subsequent drilling, the feed speed of the drilling tool is switched to a smaller value just before reaching the surface layer (the depth position of which is known in advance) of the nth conductive layer, and the tip of the drilling tool and the nth conductive layer are changed. The "braking distance" at the time of contact with the conductive layer is appropriately reduced.
【００１４】プリント回路基板の内部におけるｎ番目の
導電層の深さ位置は製作許容度により変動して穿孔の精
度を阻害しうるので、本発明の他の実施例では、各穿孔
作業に際し、それまでの穿孔作業で確認されたｎ番目の
導電層の深さ位置を考慮して、ｎ番目の導電層に達する
直前で送り速度をより小さい値に切り換えることが提案
されている。このようにすることにより、プリント回路
基板の内部における導電層の深さ位置は急激には変化せ
ず、徐々に変化するという経験を利用することができ
る。このようにして、その後の各穿孔作業に際し、隣接
する盲穴がどの深さ位置で終るかを考慮することができ
る。Since the depth position of the n-th conductive layer inside the printed circuit board may fluctuate due to manufacturing tolerances and impair the accuracy of perforation, in another embodiment of the present invention, when performing each perforation operation, Taking into account the depth position of the nth conductive layer confirmed in the drilling work up to, it has been proposed to switch the feed rate to a smaller value immediately before reaching the nth conductive layer. By doing so, it is possible to utilize the experience that the depth position of the conductive layer inside the printed circuit board does not change rapidly but changes gradually. In this way, in each subsequent drilling operation, it is possible to consider at which depth position the adjacent blind hole ends.
【００１５】上記利点（穿孔精度を阻害する多くの因子
の回避）の他に本発明の解決策によれば自動的なＺ軸設
定およびそれに関連する速度の利点が得られ、さらに穿
孔具破損の監視も可能である。In addition to the above advantages (avoidance of many factors that impede drilling accuracy), the solution of the present invention provides the advantages of automatic Z-axis setting and its associated speed, and further, of punch breakage. Monitoring is also possible.
【００１６】なお、本発明による測定原理は穿孔のみに
限定されず、フライス加工などの材料加工の場合にも同
様に用いることができる。従って、上述および以下にお
ける「深穿孔」への言及は、決してこの概念のみに限定
されるものではない。The measuring principle according to the present invention is not limited to drilling, but can be similarly applied to material processing such as milling. Accordingly, references to "deep perforation" above and below are in no way limited to this concept.
【００１７】[0017]
【実施例】以下、図面を参照して実施例により本発明の
他の目的、特徴、利点および利用の可能性につきさらに
説明する。上記した或いは図示した全ての特徴は単独で
或いは本発明による特徴の任意の組合せとして構成しう
ることは勿論である。The other objects, features, advantages and possibilities of use of the present invention will be further described below with reference to the accompanying drawings. It goes without saying that all the features mentioned above or shown in the figures can be constructed alone or in any combination of the features according to the invention.
【００１８】プリント回路基板ＬＰはできるだけ平面か
つできるだけ水平な表面層を有する機械テーブル４上
に、必要に応じて絶縁して配置される。たとえばプリン
ト回路基板ＬＰには、導電性表面層Ｓｏとｎ番目の導電
層Ｓｎとの２つの導電層が示されている。回路基板層Ｓ
ｏとＳｎとの間およびｎ番目の導電層Ｓｎの下側にはそ
れぞれ交互に他の絶縁層および導電層（図示せず）が存
在する。プリント回路基板ＬＰの上方には高さが自由に
調節できかつ回転可能な穿孔スピンドル２が配置され、
これに穿孔具、例えば、ドリル１が工具ロータ５によっ
て把持される。穿孔スピンドル２および／または工具ロ
ータ５は電気的に絶縁される。穿孔スピンドル２は本発
明のこの実施例においては金属製（すなわち導電性）の
クランプ３が付設され、このクランプ３は穿孔作業開始
前にプリント回路基板ＬＰの導電性表面層Ｓｏまで下降
する。穿孔スピンドル２または工具ロータ５の高さ位
置、したがって、ドリル１の高さ位置は高さ測定装置６
によって計測される。The printed circuit board LP is arranged, optionally insulated, on a machine table 4 having a surface layer which is as flat and as horizontal as possible. For example, the printed circuit board LP is shown with two conductive layers, a conductive surface layer So and an nth conductive layer Sn. Circuit board layer S
Other insulating layers and conductive layers (not shown) are alternately provided between o and Sn and below the n-th conductive layer Sn. Above the printed circuit board LP there is arranged a perforating spindle 2 whose height is freely adjustable and rotatable,
A drilling tool, for example a drill 1, is gripped by the tool rotor 5. The drilling spindle 2 and / or the tool rotor 5 are electrically insulated. The drilling spindle 2 is provided with a clamp 3 made of metal (ie conductive) in this embodiment of the invention, which clamp 3 descends to the conductive surface layer So of the printed circuit board LP before the start of the drilling operation. The height position of the drilling spindle 2 or the tool rotor 5, and therefore the height position of the drill 1, is determined by the height measuring device 6
Measured by.
【００１９】本発明によれば、穿孔具（ドリル）１と導
電性表面層Ｓｏとｎ番目の導電層Ｓｎとの間には穿孔ス
ピンドル２を、たとえば、０ボルトの電位Ｐｂとする電
位差ΔＰが与えられ、表面層Ｓｏもしくはこれと接触す
るクランプ３をＰｏボルト（Ｐｏ≠０）の電位Ｐｏに
し、さらにｎ番目の導電層ＳｎをＰｎボルト（Ｐｎ≠
０）の電位Ｐｎにする。穿孔の開始に際し、ドリル１の
先端が表面層Ｓｏに接触すると、ドリル１と表面層Ｓｏ
との間に信号が発生する。これを信号読取器７を経て高
さ測定装置６に送り、孔の深さゼロのレベルを決定する
ことができる。その後、穿孔作業において、ドリル１を
送りながら、穿孔スピンドル２または工具ロータ５の高
さ位置を、たとえば、ドリル１の送りを停止すべき所望
の深さに達するまで、高さ測定装置６により継続的に測
定する。According to the present invention, there is a potential difference ΔP between the drilling tool (drill) 1, the conductive surface layer So and the n-th conductive layer Sn, the drilling spindle 2 having a potential Pb of, for example, 0 volt. The applied surface layer So or the clamp 3 in contact with the surface layer So is set to the potential Po of Po volt (Po ≠ 0), and the n-th conductive layer Sn is set to Pn volt (Pn ≠).
0) potential Pn. When the tip of the drill 1 contacts the surface layer So at the start of drilling, the drill 1 and the surface layer So
A signal is generated between and. This can be sent to the height measuring device 6 via the signal reader 7 and the level of zero hole depth can be determined. After that, in the drilling operation, while the drill 1 is being fed, the height measuring device 6 continues until the height position of the drilling spindle 2 or the tool rotor 5 reaches a desired depth at which the feed of the drill 1 should be stopped. To measure.
【００２０】前記盲穴が丁度到達すべきｎ番目の導電層
Ｓｎを電位Ｐｎ≠Ｐｂに接続しておくと、ドリル１の先
端がｎ番目の導電層Ｓｎに接触した時に、これら二つの
要素間にある信号が検出される。この信号を高さ測定装
置６に送ることにより孔の深さの最終レベルが決定さ
れ、これに基づいてドリル１の送りが停止される。この
ようにして、盲穴の所望の深さを高い精度で達成するこ
とができる。If the n-th conductive layer Sn that the blind hole should reach should be connected to the potential Pn ≠ Pb, when the tip of the drill 1 contacts the n-th conductive layer Sn, the gap between these two elements is increased. The signal at is detected. By sending this signal to the height-measuring device 6, the final level of the depth of the hole is determined, on the basis of which the feed of the drill 1 is stopped. In this way, the desired depth of the blind hole can be achieved with high accuracy.
【００２１】工具ロータ５に機械的接触により電位Ｐｂ
を加える場合を図示したが、電位Ｐｂは誘導的または容
量的にドリル１に加えることもできる。A mechanical contact with the tool rotor 5 results in an electric potential Pb.
Although the case of adding is illustrated, the potential Pb can be applied to the drill 1 inductively or capacitively.
【図１】本発明による穿孔装置の縦断面図である。1 is a vertical cross-sectional view of a punching device according to the present invention.
１…ドリル ２…穿孔スピ
ンドル ３…クランプ ４…機械テー
ブル ５…工具ロータ ６…高さ測定
装置 ７…信号読取器 ＬＰ…プリン
ト回路基板 Ｓｏ…プリント回路基盤の表面層 Ｓｎ…ｎ番目
の導電層 Ｐｏ…電位（表面層もしくはクランプ） Ｐｂ…電位
（ドリル） Ｐｎ…電位（ｎ番目の導電層）1 ... Drill 2 ... Drilling spindle 3 ... Clamp 4 ... Machine table 5 ... Tool rotor 6 ... Height measuring device 7 ... Signal reader LP ... Printed circuit board So ... Surface layer of printed circuit board Sn ... nth conductive layer Po ... potential (surface layer or clamp) Pb ... potential (drill) Pn ... potential (nth conductive layer)
───────────────────────────────────────────────────── フロントページの続き (72)発明者 トマス クンツ ドイツ連邦共和国、ケルクハイム 65779 アルテ コーニクシュタイナー シュト ラッセ．９ (72)発明者 ゲルハルト フォイト ドイツ連邦共和国、ビィーベルタル 35444 スデーテンシュトラッセ 12 (72)発明者 ウルリッヒ ロック ドイツ連邦共和国、バーベンハウゼン 64832 ツィゲールヒュッテンシュトラッ セ 10 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Thomas Kuntz, Germany Kerkheim 65779 Arte Konigsteiner Strasse. 9 (72) Inventor Gerhard Voith, Wiedertal, Federal Republic of Germany 35444 Sudetenstraße 12 (72) Inventor Ulrich Lock, Babenhausen, Federal Republic of Germany 64832 Zigelhuttenstraße 10
Claims (6)
ーブル上に配置されたプリント回路基板の導電性表面層
の方向に下降させると共に、プリント回路基板表面に対
する前記穿孔具の各高さ位置を高さ測定装置により測定
するプリント回路基板等の穿孔装置において、穿孔具と
導電性表面層もしくはｎ番目の回路基板層との間に電位
差（ΔＰ）を発生させると共に、穿孔具の先端と表面層
との接触に際し前記穿孔具と表面層との間で測定しうる
信号を孔の深さのゼロレベルの決定に用い、必要に応じ
該穿孔具の先端とｎ番目の回路基板層との接触に際し測
定しうる信号を孔の深さの最終レベルの決定に用いるこ
とを特徴とするプリント回路基板等の穿孔装置。1. A punching spindle for supporting a punching tool is lowered toward a conductive surface layer of a printed circuit board disposed on a machine table, and each height position of the punching tool with respect to the printed circuit board surface is raised. In a punching device such as a printed circuit board to be measured by a depth measuring device, a potential difference (ΔP) is generated between the punching tool and the conductive surface layer or the nth circuit board layer, and the tip of the punching tool and the surface layer are The signal that can be measured between the perforator and the surface layer upon contact is used to determine the zero level of the depth of the hole and, if necessary, upon contact between the tip of the perforator and the nth circuit board layer. A perforating device for printed circuit boards and the like, characterized in that the possible signal is used for determining the final level of the hole depth.
位（Ｐｂ）が工具ロータの直接接触により誘導的または
容量的に生ぜしめることを特徴とするプリント回路基板
等の穿孔装置。2. A punching device for a printed circuit board or the like according to claim 1, wherein the potential (Pb) of the punching tool is inductively or capacitively generated by direct contact of the tool rotor.
孔スピンドルに導電性表面層まで下降しうるクランプ手
段を付設すると共に、導電性表面層の電位（Ｐｏ）はク
ランプ手段を電位（Ｐｏ）に接続することにより得るこ
とを特徴とするプリント回路基板等の穿孔装置。3. The device according to claim 1, wherein the boring spindle is provided with a clamp means capable of descending to the conductive surface layer, and the potential (Po) of the conductive surface layer is the potential (Po) of the clamp means. A punching device for a printed circuit board or the like, which is obtained by connecting to a substrate.
置において、穿孔具はゼロボルトの電位（Ｐｂ）にされ
ると共に、表面層もしくはｎ番目の回路基板層はＰボル
ト（Ｐ≠０）の電位（Ｐｏ）もしくは（Ｐｎ）に接続す
ることを特徴とするプリント回路基板等の穿孔装置。4. The device according to claim 1, wherein the perforation tool is set to a potential (Pb) of zero volt, and the surface layer or the nth circuit board layer is P volt (P ≠). A punching device for a printed circuit board or the like, which is connected to a potential (Po) or (Pn) of 0).
置において、ｎ番目の回路基板層の適宜の深さ位置を予
備決定するため試験穿孔を行うと共に、その後の穿孔の
実施に際し穿孔具の送り速度をｎ番目の回路基板層の表
面に達する前の僅かな距離においてより小さい数値に切
り換えることを特徴とするプリント回路基板等の穿孔装
置。5. The device according to claim 1, wherein test drilling is performed to predetermine an appropriate depth position of the nth circuit board layer, and subsequent drilling is performed. A punching device for a printed circuit board or the like, characterized in that the feed speed of the punching tool is switched to a smaller numerical value in a short distance before reaching the surface of the n-th circuit board layer.
置において、各穿孔に際し事前の穿孔で確定しうるｎ番
目の回路基板層の深さ位置を、より小さい数値への送り
速度の切り換えに際してｎ番目の回路基板層の到達直前
に考慮することを特徴とする。6. The device according to claim 1, wherein the depth position of the n-th circuit board layer, which can be determined by prior drilling, is set to a smaller numerical value in each drilling. Is considered immediately before reaching the n-th circuit board layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4340249A DE4340249A1 (en) | 1993-11-26 | 1993-11-26 | Apparatus for controlling boring depth in multilayer PCB |
| DE4340249:6 | 1993-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07285097A true JPH07285097A (en) | 1995-10-31 |
Family
ID=6503463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6291695A Pending JPH07285097A (en) | 1993-11-26 | 1994-11-25 | Device for punching printed circuit board,etc |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH07285097A (en) |
| DE (1) | DE4340249A1 (en) |
| IT (1) | IT1278342B1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006526776A (en) * | 2003-06-02 | 2006-11-24 | ノバトール アーベー | Depth measuring method and depth measuring device for composite material processed body hole machined by orbital cutting tool |
| JP2009004585A (en) * | 2007-06-22 | 2009-01-08 | Hitachi Via Mechanics Ltd | Printed-circuit board manufacturing method, and printed-circuit board |
| CN102686050A (en) * | 2012-06-04 | 2012-09-19 | 广东成德电路股份有限公司 | Blind via manufacture method of multi-layer printed circuit board |
| CN103692485A (en) * | 2013-12-31 | 2014-04-02 | 林晓辉 | Belt drill |
| CN110402032A (en) * | 2019-08-16 | 2019-11-01 | 孔令飞 | A kind of equipment that preprocessing being carried out to circuit board using heat conductivity |
| CN112440331A (en) * | 2019-09-03 | 2021-03-05 | 维亚机械株式会社 | Substrate punching device and substrate punching method |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1285334B1 (en) | 1996-05-17 | 1998-06-03 | Pluritec Italia | EQUIPMENT AND RELATED PROCESSING DEPTH CONTROL METHOD FOR A CIRCUIT PLATE OPERATING MACHINE |
| DE19703990A1 (en) * | 1997-02-03 | 1998-08-06 | Giesecke & Devrient Gmbh | Modular electronic data carrier |
| FR2774617B1 (en) * | 1998-02-06 | 2000-05-05 | St Microelectronics Sa | METHOD AND MACHINE FOR MACHINING A CAVITY IN AN ELECTRONIC CHIP CARD CONTAINING AN ANTENNA |
| FR2781589A1 (en) * | 1998-07-22 | 2000-01-28 | Solaic Sa | Device for cutting a cavity close to an antenna contained in an integrated circuit card body |
| DE10040303C2 (en) * | 2000-08-17 | 2002-07-11 | Volker Nissen | Process for the defined deep drilling of blind holes (blind vias) in multilayer printed circuit boards (multilayer) |
| DE10056184A1 (en) * | 2000-11-13 | 2002-05-29 | Cimatec Gmbh Produkte Fuer Lei | drilling |
| EP1248502A1 (en) * | 2001-04-02 | 2002-10-09 | Posalux S.A. | Process for determining of uncertainties for printed circuit board perforating apparatus |
| WO2005029928A2 (en) * | 2003-09-19 | 2005-03-31 | Viasystems Group, Inc. | Closed loop backdrilling system |
| DE102012203318A1 (en) | 2011-12-22 | 2013-06-27 | Rohde & Schwarz Gmbh & Co. Kg | Method for exposing objective layer within multilayer circuit board, involves forming recess from surface of multilayer printed circuit board upto sacrificial layer or into sacrificial layer by erosion process |
| DE102013004679B4 (en) * | 2013-03-19 | 2017-11-23 | Skybrain Vermögensverwaltung GmbH | Apparatus and method for processing printed circuit boards |
| EP2987576A1 (en) | 2014-08-19 | 2016-02-24 | Skybrain Vermögensverwaltungs GmbH | Methods for drilling a hole and drilling machine therefore |
| DE102018127991A1 (en) * | 2018-11-08 | 2020-05-14 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Process for the mechanical processing of a sandwich structure, tool device and sandwich structure |
| US11690177B2 (en) | 2020-04-07 | 2023-06-27 | Nextgin Technology Bv | Methods and systems for back-drilling a multi-layer circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3206354A1 (en) * | 1982-02-22 | 1983-09-01 | Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt | Device for modifying or repairing non-visible conductor-track patterns on multilayer printed-circuit boards |
| US4765784A (en) * | 1984-12-06 | 1988-08-23 | Advanced Controls, Inc. | Electronic depth control for drill |
| DE3719167C1 (en) * | 1987-06-09 | 1988-11-03 | Klingelnberg Soehne | Numerically controlled PCB processing machine |
-
1993
- 1993-11-26 DE DE4340249A patent/DE4340249A1/en not_active Withdrawn
-
1994
- 1994-11-25 JP JP6291695A patent/JPH07285097A/en active Pending
- 1994-11-25 IT IT94BZ000062A patent/IT1278342B1/en active IP Right Grant
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006526776A (en) * | 2003-06-02 | 2006-11-24 | ノバトール アーベー | Depth measuring method and depth measuring device for composite material processed body hole machined by orbital cutting tool |
| JP2009004585A (en) * | 2007-06-22 | 2009-01-08 | Hitachi Via Mechanics Ltd | Printed-circuit board manufacturing method, and printed-circuit board |
| KR101465264B1 (en) * | 2007-06-22 | 2014-11-26 | 비아 메카닉스 가부시키가이샤 | Manufacturing method of print board and print board |
| CN102686050A (en) * | 2012-06-04 | 2012-09-19 | 广东成德电路股份有限公司 | Blind via manufacture method of multi-layer printed circuit board |
| CN103692485A (en) * | 2013-12-31 | 2014-04-02 | 林晓辉 | Belt drill |
| CN110402032A (en) * | 2019-08-16 | 2019-11-01 | 孔令飞 | A kind of equipment that preprocessing being carried out to circuit board using heat conductivity |
| CN112440331A (en) * | 2019-09-03 | 2021-03-05 | 维亚机械株式会社 | Substrate punching device and substrate punching method |
| CN112440331B (en) * | 2019-09-03 | 2023-05-23 | 维亚机械株式会社 | Substrate perforating device and substrate perforating method |
Also Published As
| Publication number | Publication date |
|---|---|
| ITBZ940062A1 (en) | 1996-05-25 |
| DE4340249A1 (en) | 1995-06-01 |
| IT1278342B1 (en) | 1997-11-17 |
| ITBZ940062A0 (en) | 1994-11-25 |
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