JPH0727635Y2 - 高周波混成集積回路 - Google Patents

高周波混成集積回路

Info

Publication number
JPH0727635Y2
JPH0727635Y2 JP1989040367U JP4036789U JPH0727635Y2 JP H0727635 Y2 JPH0727635 Y2 JP H0727635Y2 JP 1989040367 U JP1989040367 U JP 1989040367U JP 4036789 U JP4036789 U JP 4036789U JP H0727635 Y2 JPH0727635 Y2 JP H0727635Y2
Authority
JP
Japan
Prior art keywords
copper block
heat dissipation
integrated circuit
hybrid integrated
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989040367U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02131351U (sv
Inventor
進 阪本
孝司 藤岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1989040367U priority Critical patent/JPH0727635Y2/ja
Publication of JPH02131351U publication Critical patent/JPH02131351U/ja
Application granted granted Critical
Publication of JPH0727635Y2 publication Critical patent/JPH0727635Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1989040367U 1989-04-04 1989-04-04 高周波混成集積回路 Expired - Lifetime JPH0727635Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989040367U JPH0727635Y2 (ja) 1989-04-04 1989-04-04 高周波混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989040367U JPH0727635Y2 (ja) 1989-04-04 1989-04-04 高周波混成集積回路

Publications (2)

Publication Number Publication Date
JPH02131351U JPH02131351U (sv) 1990-10-31
JPH0727635Y2 true JPH0727635Y2 (ja) 1995-06-21

Family

ID=31550095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989040367U Expired - Lifetime JPH0727635Y2 (ja) 1989-04-04 1989-04-04 高周波混成集積回路

Country Status (1)

Country Link
JP (1) JPH0727635Y2 (sv)

Also Published As

Publication number Publication date
JPH02131351U (sv) 1990-10-31

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