JPH0726853Y2 - Ｌｅｄ表示装置 - Google Patents

Ｌｅｄ表示装置

Info

Publication number
JPH0726853Y2
JPH0726853Y2 JP1989064824U JP6482489U JPH0726853Y2 JP H0726853 Y2 JPH0726853 Y2 JP H0726853Y2 JP 1989064824 U JP1989064824 U JP 1989064824U JP 6482489 U JP6482489 U JP 6482489U JP H0726853 Y2 JPH0726853 Y2 JP H0726853Y2
Authority
JP
Japan
Prior art keywords
lens
led
display device
led chips
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989064824U
Other languages
English (en)
Japanese (ja)
Other versions
JPH033762U (OSRAM
Inventor
富美夫 深瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989064824U priority Critical patent/JPH0726853Y2/ja
Publication of JPH033762U publication Critical patent/JPH033762U/ja
Application granted granted Critical
Publication of JPH0726853Y2 publication Critical patent/JPH0726853Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1989064824U 1989-06-01 1989-06-01 Ｌｅｄ表示装置 Expired - Lifetime JPH0726853Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989064824U JPH0726853Y2 (ja) 1989-06-01 1989-06-01 Ｌｅｄ表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989064824U JPH0726853Y2 (ja) 1989-06-01 1989-06-01 Ｌｅｄ表示装置

Publications (2)

Publication Number Publication Date
JPH033762U JPH033762U (OSRAM) 1991-01-16
JPH0726853Y2 true JPH0726853Y2 (ja) 1995-06-14

Family

ID=31596110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989064824U Expired - Lifetime JPH0726853Y2 (ja) 1989-06-01 1989-06-01 Ｌｅｄ表示装置

Country Status (1)

Country Link
JP (1) JPH0726853Y2 (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61205463A (ja) * 1985-03-08 1986-09-11 Shinwa Seisakusho:Kk 生海苔連続軟化洗浄装置
JP2540829Y2 (ja) * 1993-04-02 1997-07-09 信男 鈴木 ガス発生装置およびガス発生装置用除じん装置
WO2007139781A2 (en) * 2006-05-23 2007-12-06 Cree Led Lighting Solutions, Inc. Lighting device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4912881U (OSRAM) * 1972-05-11 1974-02-02
JPS5315269Y2 (OSRAM) * 1972-06-26 1978-04-21
JPS51154160U (OSRAM) * 1975-06-02 1976-12-08
JPS5950455U (ja) * 1982-09-24 1984-04-03 三洋電機株式会社 発光ダイオ−ド装置
JPH0447747Y2 (OSRAM) * 1986-08-25 1992-11-11
JPS648762U (OSRAM) * 1987-07-07 1989-01-18
JPS6449987U (OSRAM) * 1987-09-22 1989-03-28

Also Published As

Publication number Publication date
JPH033762U (OSRAM) 1991-01-16

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term