JPH0726139Y2 - Icカード - Google Patents
IcカードInfo
- Publication number
- JPH0726139Y2 JPH0726139Y2 JP4465889U JP4465889U JPH0726139Y2 JP H0726139 Y2 JPH0726139 Y2 JP H0726139Y2 JP 4465889 U JP4465889 U JP 4465889U JP 4465889 U JP4465889 U JP 4465889U JP H0726139 Y2 JPH0726139 Y2 JP H0726139Y2
- Authority
- JP
- Japan
- Prior art keywords
- module
- card
- metal foil
- card base
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Credit Cards Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4465889U JPH0726139Y2 (ja) | 1989-04-17 | 1989-04-17 | Icカード |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4465889U JPH0726139Y2 (ja) | 1989-04-17 | 1989-04-17 | Icカード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02135271U JPH02135271U (enrdf_load_stackoverflow) | 1990-11-09 |
| JPH0726139Y2 true JPH0726139Y2 (ja) | 1995-06-14 |
Family
ID=31558158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4465889U Expired - Lifetime JPH0726139Y2 (ja) | 1989-04-17 | 1989-04-17 | Icカード |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0726139Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH686325A5 (de) * | 1992-11-27 | 1996-02-29 | Esec Sempac Sa | Elektronikmodul und Chip-Karte. |
-
1989
- 1989-04-17 JP JP4465889U patent/JPH0726139Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02135271U (enrdf_load_stackoverflow) | 1990-11-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6538311B2 (en) | Two-stage transfer molding method to encapsulate MMC module | |
| JP3170199B2 (ja) | 半導体装置及びその製造方法及び基板フレーム | |
| JPH0482799A (ja) | Icカードの製造方法およびicカード | |
| KR980006193A (ko) | 열적 개량된 플립 칩 패키지 및 그 제조 방법 | |
| JPH11214552A (ja) | 集積回路ボードおよび集積回路ボードの製造プロセス | |
| KR920001689A (ko) | 반도체장치 및 그 제조방법 | |
| WO1989001873A1 (en) | Integrated circuit device and method of producing the same | |
| JP2000148949A (ja) | 非接触icカードおよびその製造方法 | |
| JPH0726139Y2 (ja) | Icカード | |
| US7193305B1 (en) | Memory card ESC substrate insert | |
| JPH0230597A (ja) | 半導体カード用モジュール | |
| JPH02151496A (ja) | 集積回路装置の製造方法 | |
| JP2006107420A (ja) | メモリカード構造とその製造方法 | |
| JPH081109Y2 (ja) | 複数チップ内蔵のicモジュール | |
| JPH0719859B2 (ja) | Icカード用モジュールの製造方法 | |
| JPH081108Y2 (ja) | Icモジュール | |
| JP2996507B2 (ja) | 金属板ベース回路基板 | |
| JP3495566B2 (ja) | 半導体装置 | |
| US7074654B1 (en) | Tape supported memory card leadframe structure | |
| JP3705235B2 (ja) | 半導体装置の製造方法 | |
| US7556986B1 (en) | Tape supported memory card leadframe structure | |
| JPH06216492A (ja) | 電子装置 | |
| JPH11135708A (ja) | 半導体装置用基体及びその製造方法 | |
| JP2516394Y2 (ja) | 半導体装置 | |
| JPH079378Y2 (ja) | 半導体装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |