JPH07202062A - Semiconductor device - Google Patents

Abstract

PURPOSE:To prevent specific pins from bending and sockets from splitting and to raise the fitting yield rate of sockets to packages. CONSTITUTION:Concerning leader pins of a package 1, a pin at each of its four corners is eliminated respectively, and specific pins of the four sides of the package are eliminated, and corresponding parts of a socket to the specific pin eliminated parts 4a of the four sides of the package 1 are thickened to reinforce them.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor device which improves the yield of semiconductor packages and semiconductor sockets.

[0002]

2. Description of the Related Art First, a conventional semiconductor package and a semiconductor socket will be described with reference to the drawings.

FIG. 8 is a plan view of the package as seen from the bottom direction, and FIG. 9 is a C- when the package of FIG. 8 is mounted.
It is sectional drawing in a C'line.

The structure of a conventional package includes a package 1, a mounting area 2 for mounting a semiconductor chip, and pins 3. FIG. 3 shows an example in which the pins 3 are continuously and regularly arranged around the mounting area 2. All the pins 3 are arranged at the same pitch (1.27 or 2.54 mm) from one end to the other of the four sides of the package 1. It was arranged.

When the package 1 is mounted, it is mounted in the socket 5 mounted on the printed circuit board 6, and the socket 5 is made of a thin plastic material of about 1 mm due to the length of the pins.

[0006] In addition, the published utility model publication (Hei 2-5424).
In the package 7), the pins are arranged at random pitches and are arranged up to the four corners of the package.

[0007]

The conventional package is
The pins were all arranged at a certain pitch across the four sides of the case.

Therefore, there is no problem if the packages can be kept parallel to each other when they are attached and detached at the time of mounting. However, as shown in FIG. 10, when the packages are tilted and a force in a specific direction is applied (see FIG.
(In the direction of the ↓ mark), and the force is concentrated on one pin (see 3a in FIG. 11) at the corner with a thickness of 0.2 mmφ, pin bending occurs, and the package becomes a defective product. Further, the socket is as thin as about 1 mm, and there is a problem in that the socket cracks due to the force applied when the package is attached and detached, and the yield of the package and the socket at the time of mounting is reduced.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings.

FIG. 1 shows a plan view of a first embodiment of the package of the present invention. This package includes a package 1 made of tetrahedral ceramic or alloy, and a mounting area 2 for mounting a semiconductor chip arranged in the center of the package 1 and made of a conductor such as gold.
To connect the inside of the mounting area 2 to output a signal from the semiconductor chip to the outside of the package 1 or to input a signal from the outside of the package 1 to the semiconductor chip, the mounting area 2 is equally spaced (1.27 mm). Etc.), a region 4 where the pins 3 are not arranged at the four corners of the tetrahedron package 1 where the pins 3 are arranged, and a region 4a where the pins 3 arranged in the package 1 are not arranged. It is composed by. Since there are regions 4 in which the pins 3 are not arranged at the four corners of the package 1, even when the package 1 is mounted obliquely as in the example shown in FIG. The force is not applied, and the force can be distributed to the two pins 3b. 2 (a),
(B) shows a package in which a semiconductor chip is mounted on the mounting area 2. The bonding stick 8 is connected to the corresponding pin 3, and is connected to the pad 10 on the semiconductor chip 7 mounted in the mounting area 2 via the bonding wire 9. A side view of the package of FIG. 1 is shown in FIG. 3 to clarify the shape of the package. The description of the parts indicated by the same numbers as in FIG. 1 is omitted. The area 4a is provided corresponding to the protrusion of the corresponding socket. A side view of this socket is shown in FIG. 4, and a plan view thereof is shown in FIG. here,
The hole provided in the central portion of the socket 5 is an opening portion corresponding to the semiconductor chip mounted on the package 1. This socket 5 is composed of a socket 5 made of plastic and a socket reinforcing portion 5a formed as a convex portion on the socket 5 also made of plastic. The pin 3 is not arranged in the portion in the package 1 corresponding to the socket reinforcing portion 5a of the convex portion, and even if the package 1 is mounted in the socket 5, there is no obstacle. FIG. 6 shows a sectional view taken along the line AA ′ of the package 1 of FIG. 1 when the package 1 is mounted in the socket 5. In FIG. 6, the socket reinforcing portion 5a enters the region 4a where the pin 3 is not arranged, and mounting can be performed without any change from the conventional case. However, the printed circuit board 6 is provided so as to be connected to other circuits and devices.

A second embodiment of the present invention is shown in FIG.
It shows in (b). FIG. 7A shows a structure in which regions 4 a in which the pins 3 are not arranged are provided in parallel between the four sides of the package 1 and the mounting region 2. This package 1
The socket 5 shown in FIG. 7 (b) corresponding to the above has the socket reinforcing portions 5a provided in parallel between the four sides of the socket 5 and the four sides of the opening portion 11, respectively.

In the first and second embodiments of the present invention, the reinforcing portion of the socket is provided horizontally or vertically on the four sides of the socket, but it may be provided obliquely and is not linear but curved. It goes without saying that it may be provided in. Further, the socket reinforcing portion 5a may be formed at the same time when the socket is formed, or may be formed by adhering a reinforcing material (metal, polycarbonate, etc.) after the socket is formed. If it is not enough to remove one pin at each of the four corners of the package, three pins may be removed from each package and the force applied when the package is tilted may be distributed to the three pins.

[0013]

As described above, according to the present invention, by removing the pins at the four corners, even if a force is applied in a specific direction at the time of mounting as shown in FIG. 6 pins 3b), and it is possible to prevent a specific pin from being greatly bent.

Further, since the pin of a specific block on the package is deleted and the socket corresponding to that part is thickly reinforced, the socket can be broken even if force is applied to the socket during mounting. It is possible to prevent Therefore, the yield of the case and the socket at the time of mounting can be improved.

[Brief description of drawings]

FIG. 1 is a plan view of a package according to a first embodiment of the present invention.

2A is a plan view of a semiconductor chip mounted on the package of FIG. 1, and FIG. 2B is a B of the package of FIG.
-B 'sectional drawing.

3 is a side view of the package of FIG.

FIG. 4 is a side view of a socket corresponding to the package of FIG.

5 is a plan view of a socket corresponding to the package of FIG.

6 is a sectional view taken along the line AA ′ when the package of FIG. 1 is mounted.

7A is a plan view (partial view) of a package according to a second embodiment of the present invention, and FIG. 7B is a plan view (partial view) of a socket corresponding to the package of FIG.

FIG. 8 is a plan view of a conventional package.

9 is a cross-sectional view taken along the line CC ′ when the package of FIG. 8 is mounted.

FIG. 10 is a diagram showing an example of a package inclination.

FIG. 11 is an enlarged view of the four corners of FIG.

[Explanation of symbols]

 1 Package 2 Mounting area 3 Pins 3a Four corner pins 3b Second pin from the corner 4 Pin removal part (four corners) 4a Pin removal part 5 Socket 5a Socket reinforcement part

Claims (5)

[Claims] 1. A package having a semiconductor chip mounting area, a plurality of pins provided around the semiconductor chip mounting area and connected to a semiconductor chip mounted in the semiconductor chip mounting area, and via the plurality of pins. A semiconductor device, wherein a predetermined pin of the plurality of pins on the package is deleted in a socket connected to the package. 2. The semiconductor device according to claim 1, wherein the predetermined pins are pins at four corners in the package. 3. The semiconductor device according to claim 1, wherein a portion of the socket corresponding to the predetermined pin in the package, facing the package, is thickened. 4. The semiconductor device according to claim 1, wherein the predetermined pins are pins other than the four corners in the package. 5. The semiconductor device according to claim 4, wherein a portion of the socket corresponding to the predetermined pin in the package, facing the package, is formed thick.