JP2730470B2 - Semiconductor package and semiconductor socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor device for improving the yield of semiconductor packages and semiconductor sockets.

[0002]

2. Description of the Related Art First, a conventional semiconductor package and a conventional semiconductor socket will be described with reference to the drawings.

FIG. 8 is a plan view of the package as viewed from the bottom, and FIG.
It is sectional drawing in the C 'line.

A conventional package has a package 1, a mounting area 2 for mounting a semiconductor chip, and pins 3. FIG. 3 shows an example in which the pins 3 are continuously and regularly arranged around the mounting area 2. All the pins 3 are arranged at the same pitch (1.27 or 2.54 mm) from one end of the four sides of the package 1. Had been arranged.

When the package 1 is mounted, it is mounted on a socket 5 mounted on a printed circuit board 6, and the socket 5 is made of a thin plastic or the like of about 1 mm in relation to the length of pins.

[0006] In addition, a published utility model publication (Hei 2-5424)
7) shows a package in which pins are arranged at random pitches and are arranged up to four corners of the package.

[0007]

The conventional package is:
The pins were all arranged at a certain pitch from the four sides of the case.

For this reason, there is no problem if the package is kept parallel when it is attached or detached during mounting. However, as shown in FIG. 10, when the package is tilted and a force in a specific direction is applied (FIG. 10).
↓ direction), force is concentrated on one pin (see 3a in FIG. 11) at a corner having a thickness of 0.2 mmφ, and pin bending occurs, resulting in a defective package. In addition, the socket is as thin as about 1 mm, and there is a problem that the socket is cracked by a force applied when the package is attached or detached, and the yield of the package and the socket at the time of mounting is reduced.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings.

FIG. 1 shows a plan view of a first embodiment of the package of the present invention. This package includes a package 1 made of a tetrahedral ceramic or alloy, and a mounting area 2 for mounting a semiconductor chip, which is disposed at the center of the package 1 and made of a conductor such as gold.
In order to output a signal from the semiconductor chip to the outside of the package 1 connected to the inside of the mounting area 2 or to input a signal from the outside of the package 1 to the semiconductor chip, an equal interval (1.27 mm Etc.), an area 4 where the pins 3 are not arranged at four corners in the tetrahedral package 1 where the pins 3 are arranged, and an area 4a where the pins 3 are arranged and not arranged in the package 1. It is constituted by. At the four corners in the package 1, there are regions 4 where the pins 3 are not arranged. Therefore, even when the package 1 is mounted obliquely as in the example shown in FIG. The force is not applied, and the force can be distributed to the two pins 3b. FIG. 2 (a),
(B) shows a package in which a semiconductor chip is mounted in the mounting area 2. The bonding stick 8 is connected to the corresponding pin 3, and is connected to the pad 10 on the semiconductor chip 7 mounted on the mounting area 2 via the bonding wire 9. A side view of the package of FIG. 1 is shown in FIG. 3 to clarify the shape of the package. The description of the portions indicated by the same numbers as those in FIG. 1 is omitted. The region 4a is provided corresponding to the projection of the corresponding socket. FIG. 4 shows a side view and FIG. 5 shows a plan view of the socket. here,
The hole provided in the center of the socket 5 is an opening formed corresponding to the semiconductor chip mounted on the package 1. The socket 5 includes a socket 5 made of plastic, and a socket reinforcing portion 5a formed as a projection on the socket 5 also made of plastic. The pins 3 are not arranged in the portion of the package 1 corresponding to the socket reinforcing portion 5a of the projection, and there is no obstacle even if the package 1 is mounted on the socket 5. FIG. 6 is a cross-sectional view of the package 1 of FIG. 1 taken along line AA ′ when the package 1 is mounted on the socket 5. In FIG. 6, the socket reinforcing portion 5a enters the region 4a where the pins 3 are not arranged, and can be mounted without any change from the related art. However, the printed circuit board 6 is wired and provided for connection with other circuits and devices.

A second embodiment of the present invention is shown in FIG.
(B). FIG. 7A shows a case in which regions 4 a where the pins 3 are not arranged are provided in parallel between the four sides of the package 1 and the mounting region 2. This package 1
The socket 5 shown in FIG. 7B corresponding to FIG. 7 (b) has a socket reinforcing portion 5a provided in parallel between the four sides of the socket 5 and the four sides of the opening 11 respectively.

In the first and second embodiments of the present invention, the reinforcing portions of the socket are provided horizontally or vertically on the four sides of the socket. However, the reinforcing portions may be provided diagonally, and are not linear but curved. Needless to say, it may be provided at Further, the socket reinforcing portion 5a may be formed at the same time when the socket is formed, or may be formed by bonding a reinforcing material (metal, polycarbonate, etc.) after the socket is formed. If it is not sufficient to delete one pin at each of the four corners of the package, three pins may be deleted and the force applied when mounting the package at an angle may be distributed to the three pins.

[0013]

As described above, according to the present invention, even if a force is applied in a specific direction at the time of mounting as shown in FIG. 6, and the specific pins can be prevented from being greatly bent.

Further, since pins of a specific block on the package are deleted and the socket corresponding to the pin is thickly reinforced, even if a force is applied to the socket during mounting, the socket is broken. It is possible to prevent. Therefore, the yield of the case and the socket at the time of mounting can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view of a package according to a first embodiment of the present invention.

2A is a plan view showing a state where a semiconductor chip is mounted on the package of FIG. 1, and FIG. 2B is a plan view of the package of FIG.
Sectional drawing in the -B 'line.

FIG. 3 is a side view of the package of FIG. 1;

FIG. 4 is a side view of a socket corresponding to the package of FIG. 1;

FIG. 5 is a plan view of a socket corresponding to the package of FIG. 1;

FIG. 6 is a sectional view taken along line AA ′ when the package of FIG. 1 is mounted.

7A is a plan view (part) of a package according to a second embodiment of the present invention, and FIG. 7B is a plan view (part) of a socket corresponding to the package of FIG.

FIG. 8 is a plan view of a conventional package.

FIG. 9 is a sectional view taken along line CC ′ when the package of FIG. 8 is mounted.

FIG. 10 is a diagram showing an example of package inclination.

FIG. 11 is an enlarged view of four corners of FIG. 8;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Package 2 Mounting area 3 Pin 3a Four corner pins 3b Second pin from corner 4 Pin deleted part (four corners) 4a Pin deleted part 5 Socket 5a Socket reinforcement part

Claims (2)

(57) [Claims] In a semiconductor socket having a plurality of holes into which a plurality of external pins of a semiconductor package are respectively inserted, a partial region corresponding to a region where the plurality of external pins of the semiconductor package is not provided has a convex portion. A semiconductor socket, comprising: 2. A semiconductor package provided around a semiconductor chip mounting area and having a plurality of pins connected to a semiconductor chip mounted on the semiconductor chip mounting area, and a plurality of pins into which the plurality of pins of the semiconductor package are respectively inserted. half configured to include a semiconductor socket having a hole
In the conductor device , the semiconductor package may be configured such that a predetermined pin of the plurality of pins is deleted, and a partial region of the semiconductor socket corresponding to a region where the pin is deleted is a projection. Semiconductor device .