JPH08130285A - Electronic component - Google Patents
Electronic componentInfo
- Publication number
- JPH08130285A JPH08130285A JP26852394A JP26852394A JPH08130285A JP H08130285 A JPH08130285 A JP H08130285A JP 26852394 A JP26852394 A JP 26852394A JP 26852394 A JP26852394 A JP 26852394A JP H08130285 A JPH08130285 A JP H08130285A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bent
- electronic component
- external leads
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品、特に短い間
隔及び長い間隔のいずれのスルーホールを備えた回路基
板にも取り付け可能な電子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, and more particularly to an electronic component which can be mounted on a circuit board having through holes of short intervals and long intervals.
【０００２】[0002]
【従来の技術】従来のパワーＩＣの正面図及び側面図を
図４及び図５に示す。このパワーＩＣは、図示しない半
導体素子をトランスファモールド法によりエポキシ樹脂
から成る樹脂封止体６で被覆して形成される。樹脂封止
体６の一の側面６ａからは５本の外部リード１１が導出
される。各外部リード１１は同一方向に直線状に且つ平
行に延伸する。隣接する外部リード間の間隔Ｌ1は例え
ば１.７ｍｍである。このパワーＩＣは、外部リード１
１の先端部１１ｃが回路基板のスルーホールに挿入され
且つ半田で固着されて回路基板に取付けられる。2. Description of the Related Art A front view and a side view of a conventional power IC are shown in FIGS. This power IC is formed by covering a semiconductor element (not shown) with a resin sealing body 6 made of epoxy resin by a transfer molding method. Five external leads 11 are led out from one side surface 6 a of the resin sealing body 6. Each outer lead 11 extends linearly and in parallel in the same direction. The distance L 1 between adjacent external leads is, for example, 1.7 mm. This power IC is external lead 1
The tip portion 11c of No. 1 is inserted into the through hole of the circuit board, fixed by solder, and attached to the circuit board.
【０００３】[0003]
【発明が解決しようとする課題】ところで、回路基板装
置の設計上の都合から、スルーホールのピッチ間隔は代
表的には、１.７ｍｍと２.５４ｍｍの２種の間隔があ
る。このため、所定の外部リード間隔を有する電子部品
は、外部リード間隔と異なるピッチ間隔のスルーホール
を備えた回路基板にはそのまま実装することができなか
った。このような回路基板に対して、対応するピッチ間
隔のスルーホールに合致する間隔の外部リードを有する
リードフレーム及びトランスファモールド金型を新たに
用意しなければならず、リードフレームの金型の設計を
大きく変更する必要があった。For the convenience of designing a circuit board device, there are typically two types of through hole pitch intervals, 1.7 mm and 2.54 mm. Therefore, an electronic component having a predetermined external lead interval cannot be mounted as it is on a circuit board provided with through holes having a pitch interval different from the external lead interval. For such a circuit board, it is necessary to newly prepare a lead frame and a transfer mold having external leads with intervals matching the through holes with corresponding pitch intervals. I had to make a big change.
【０００４】そこで本発明は、外部リードを成形する金
型の設計を変更せずに、異なるピッチ間隔のスルーホー
ルを備えた回路基板へ容易に実装できる電子部品を提供
することを目的とする。Therefore, an object of the present invention is to provide an electronic component which can be easily mounted on a circuit board having through holes having different pitch intervals without changing the design of a mold for molding external leads.
【０００５】[0005]
【課題を解決するための手段】本発明の電子部品は、樹
脂封止体の一の側面から複数の外部リードが導出され、
外部リードの少なくとも２つは樹脂封止体から導出され
た導出部と、導出部に連続する中間部と、中間部に連続
して形成され且つ回路基板のスルーホールに挿入される
先端部とを有する。この電子部品では、複数の外部リー
ドのうち一方の側に配置された外部リードは、中間部が
樹脂封止体の第１の主面側へ導出部から折り曲げられ且
つ先端部が導出部と略同一の方向へ中間部から折り曲げ
られる。複数の外部リードのうち他方の側に配置された
外部リードは、中間部が樹脂封止体の第２の主面側へ導
出部から折り曲げられ且つ先端部が導出部と略同一の方
向へ中間部から折り曲げられる。隣接する外部リードの
先端部間の間隔は隣接する外部リードの導出部間の間隔
よりも大きい。本発明の実施例では、複数の外部リード
は外側に配置された外部リードから中央側に配置された
外部リードに向かうにつれて中間部が折り曲げられて第
１の主面側又は第２の主面側へ突出する幅が段階的に小
さくなる。隣接する外部リードの先端部間の間隔は２.
５４ｍｍであり且つ隣接する外部リードの導出部間の間
隔は１.７ｍｍである。外部リードの先端部は、導出部
に対して一定角度で傾斜して一直線上に並置される。In the electronic component of the present invention, a plurality of external leads are led out from one side surface of the resin sealing body,
At least two of the external leads have a lead-out portion led out from the resin encapsulant, an intermediate portion continuous with the lead-out portion, and a tip portion formed continuously with the intermediate portion and inserted into a through hole of the circuit board. Have. In this electronic component, the outer lead arranged on one side of the plurality of outer leads has an intermediate portion bent to the first main surface side of the resin encapsulant from the lead-out portion, and a tip portion thereof being substantially the lead-out portion. It is bent from the middle part in the same direction. The external lead arranged on the other side of the plurality of external leads has an intermediate portion bent from the lead-out portion to the second main surface side of the resin encapsulant and a tip portion in the same direction as the lead-out portion. Can be bent from the section. The distance between the tip portions of the adjacent external leads is larger than the distance between the lead portions of the adjacent external leads. In the embodiment of the present invention, the plurality of outer leads are bent at the intermediate portion from the outer lead arranged on the outer side to the outer lead arranged on the center side, and the first main surface side or the second main surface side. The width of protrusion to becomes gradually smaller. The distance between the tips of adjacent external leads is 2.
The distance between the lead-out portions of adjacent outer leads is 54 mm and the distance between them is 1.7 mm. The tip portions of the external leads are arranged in parallel with each other with a certain angle with respect to the lead-out portion.
【０００６】[0006]
【作用】外部リードを折り曲げ成形する前はピッチ間隔
の小さなスルーホールを備えた回路基板に電子部品を実
装することができる。また、外部リードを折り曲げたと
き、隣接する外部リードの先端部間の間隔は隣接する外
部リードの導出部間の間隔よりも大きいので、ピッチ間
隔が大きいスルーホールの回路基板への実装が可能であ
る。さらに、外部リードを成形する金型を変更せずに、
樹脂封止体のいずれかの主面に向かって外部リードの中
間部を折り曲げるので、加工が容易である。The electronic component can be mounted on the circuit board having through holes with a small pitch interval before the external leads are bent and formed. In addition, when the external leads are bent, the distance between the tips of the adjacent external leads is larger than the distance between the lead-out portions of the adjacent external leads, so it is possible to mount through holes with large pitch intervals on the circuit board. is there. Furthermore, without changing the mold for molding the external leads,
Since the intermediate portion of the external lead is bent toward any of the main surfaces of the resin encapsulant, processing is easy.
【０００７】[0007]
【実施例】以下、パワーＩＣに適用した本発明による電
子部品の実施例を図１〜図３について説明する。本発明
によるパワーＩＣの正面図、側面図及び底面図を図１〜
図３に示す。このパワーＩＣは、図示しない半導体素子
を樹脂封止体６で被覆し、樹脂封止体６の一の側面６ａ
から５本の外部リード１〜５が導出される。外部リード
１〜５は樹脂封止体６から導出された導出部１ａ〜５ａ
と、導出部１ａ〜５ａに連続する中間部１ｂ〜５ｂと、
中間部１ｂ〜５ｂに連続して形成され且つ回路基板のス
ルーホールに挿入される先端部１ｃ〜５ｃとを有する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of an electronic component according to the present invention applied to a power IC will be described below with reference to FIGS. 1 is a front view, a side view and a bottom view of a power IC according to the present invention.
As shown in FIG. In this power IC, a semiconductor element (not shown) is covered with a resin sealing body 6, and one side surface 6 a of the resin sealing body 6 is covered.
From the five external leads 1 to 5. The external leads 1 to 5 are lead portions 1 a to 5 a led from the resin sealing body 6.
And intermediate portions 1b to 5b continuous with the lead-out portions 1a to 5a,
It has the front-end | tip part 1c-5c which is continuously formed in the intermediate part 1b-5b and is inserted in the through hole of a circuit board.
【０００８】５本の外部リードのうち中央に配置された
第３の外部リード３の先端部３ｃは導出部３ａと同一直
線上に延伸する。図２及び図３に示すように、第３の外
部リード３を基準にして一方の側９に配置された第１及
び第２の外部リード１，２は、中間部１ｂ，２ｂが樹脂
封止体６の第１の主面７側へ導出部１ａ，２ａから折り
曲げられ且つ先端部１ｃ，２ｃが導出部１ａ，２ａと略
同一の方向へ中間部１ｂ，２ｂから折り曲げられる。第
３の外部リード３を基準にして他方の側１０に配置され
た第４及び第５の外部リード４，５は、中間部４ｂ，５
ｂが樹脂封止体６の第２の主面８側へ導出部４ａ，５ａ
から折り曲げられ且つ先端部４ｃ，５ｃが導出部４ａ，
５ａと略同一の方向へ中間部４ｂ，５ｂから折り曲げら
れる。Of the five outer leads, the tip portion 3c of the third outer lead 3 arranged at the center extends on the same straight line as the lead-out portion 3a. As shown in FIGS. 2 and 3, in the first and second outer leads 1 and 2 arranged on one side 9 with the third outer lead 3 as a reference, the intermediate portions 1b and 2b are resin-sealed. The lead-out portions 1a and 2a are bent toward the first main surface 7 side of the body 6 and the tip portions 1c and 2c are bent from the intermediate portions 1b and 2b in substantially the same direction as the lead-out portions 1a and 2a. The fourth and fifth outer leads 4, 5 arranged on the other side 10 with respect to the third outer lead 3 have intermediate portions 4b, 5
b is a lead-out part 4a, 5a to the 2nd main surface 8 side of the resin sealing body 6.
And the tip portions 4c and 5c are bent from the leading portion 4a,
The intermediate portions 4b and 5b are bent in the substantially same direction as 5a.
【０００９】図２及び図３に示すように、各外部リード
は外側に配置された外部リードから中央側に配置された
外部リードに向かうにつれて、中間部が折り曲げられて
第１の主面７側又は第２の主面８側へ突出する幅が段階
的に小さくなる。即ち、第２の外部リード２の方が第１
の外部リード１よりも第１の主面７側へ突出する幅が小
さく、第４の外部リード４の方が第５の外部リード５よ
りも第２の主面８側へ突出する幅が小さい。隣接する外
部リードの先端部間の間隔（Ｌ2＝２.５４ｍｍ）は隣接
する外部リードの導出部間の間隔（Ｌ1＝１.７ｍｍ）よ
りも大きい。５本の外部リードの先端部１ｃ〜５ｃは、
導出部１ａ〜５ａに対して約４８°傾斜して一直線上に
並置される。As shown in FIGS. 2 and 3, each outer lead is bent at its intermediate portion from the outer lead arranged on the outer side to the outer lead arranged on the center side, and the first main surface 7 side. Alternatively, the width protruding toward the second main surface 8 side is gradually reduced. That is, the second external lead 2 is the first
Of the external lead 1 is smaller than the width of the external lead 1 protruding toward the first main surface 7, and the width of the fourth external lead 4 is smaller than that of the fifth external lead 5 toward the second main surface 8 . The distance (L 2 = 2.54 mm) between the tip portions of the adjacent external leads is larger than the distance (L 1 = 1.7 mm) between the lead portions of the adjacent external leads. The tips 1c to 5c of the five external leads are
The lead-out portions 1a to 5a are inclined by about 48 ° and are juxtaposed on a straight line.
【００１０】このパワーＩＣは、外部リード１，２，４
及び５を折り曲げ成形する前はピッチ間隔１.７ｍｍの
スルーホールを備えた回路基板に実装することができ
る。また、外部リード１，２，４及び５を折り曲げたと
き、ピッチ間隔が２.５４ｍｍのスルーホールを備えた
回路基板への実装が可能となる。さらに、外部リードを
成形する金型を変更せずに、樹脂封止体６の第１の主面
７又は第２の主面８へ向かって外部リードの中間部１
ｂ，２ｂ，４ｂ及び５ｂを折り曲げるので、加工が容易
である。This power IC has external leads 1, 2, 4
Before bending and forming 5, 5 can be mounted on a circuit board having through holes with a pitch interval of 1.7 mm. Further, when the external leads 1, 2, 4, and 5 are bent, they can be mounted on a circuit board having through holes with a pitch interval of 2.54 mm. Further, without changing the mold for molding the outer lead, the intermediate portion 1 of the outer lead is directed toward the first main surface 7 or the second main surface 8 of the resin sealing body 6.
Since b, 2b, 4b and 5b are bent, processing is easy.
【００１１】本発明は、上記の実施例に限定されず、変
更が可能である。例えば図１の実施例では外部リードは
５本であったが、外部リードの本数が２本以上であれば
何本の場合でも本発明が適用できる。また、外部リード
の先端部間の間隔（図１のＬ2）は回路基板の設計に応
じて任意に設定することが可能である。The present invention is not limited to the above embodiment, but can be modified. For example, although the number of external leads is five in the embodiment of FIG. 1, the present invention can be applied to any number of external leads as long as the number is two or more. Further, the interval (L 2 in FIG. 1) between the tips of the external leads can be arbitrarily set according to the design of the circuit board.
【００１２】[0012]
【発明の効果】本発明により、容易に且つ大きな設計変
更無しでスルーホール間隔の大きい回路基板へ実装する
ことが可能な電子部品を提供できる。このため、スルー
ホール間隔が異なる種々の回路基板に対応させるために
リードフレーム及びトランスファモールド金型を多数用
意する必要がなく、電子部品のコストダウンが可能とな
る。According to the present invention, it is possible to provide an electronic component which can be easily mounted on a circuit board having a large through-hole distance without a large design change. For this reason, it is not necessary to prepare a large number of lead frames and transfer molds in order to deal with various circuit boards having different through-hole intervals, and the cost of electronic components can be reduced.
【図１】 本発明による電子部品の実施例を示す正面図FIG. 1 is a front view showing an embodiment of an electronic component according to the present invention.
【図２】 図１の電子部品の側面図FIG. 2 is a side view of the electronic component shown in FIG.
【図３】 図１の電子部品の底面図FIG. 3 is a bottom view of the electronic component shown in FIG.
【図４】 従来の電子部品の正面図FIG. 4 is a front view of a conventional electronic component.
【図５】 図４の電子部品の側面図5 is a side view of the electronic component of FIG.
１〜５・・外部リード、１ａ〜５ａ・・導出部、１ｂ〜
５ｂ・・中間部、１ｃ〜５ｃ・・先端部、６・・樹脂封
止体、６ａ・・一の側面、７・・第１の主面、８・・第
２の主面、９・・一方の側、１０・・他方の側1-5 ... External lead, 1a-5a ... Lead-out part, 1b-
5b .. intermediate part, 1c to 5c .. tip part, 6 .. resin encapsulant, 6a .. one side face, 7 ... first main surface, 8 ... second main surface, 9 ... One side, 10 ... the other side
Claims (4)
ードが導出され、該外部リードの少なくとも２つは前記
樹脂封止体から導出された導出部と、該導出部に連続す
る中間部と、該中間部に連続して形成され且つ回路基板
のスルーホールに挿入される先端部とを有する電子部品
において、 前記複数の外部リードのうち一方の側に配置された外部
リードは、前記中間部が前記樹脂封止体の第１の主面側
へ前記導出部から折り曲げられ且つ前記先端部が前記導
出部と略同一の方向へ前記中間部から折り曲げられ、 前記複数の外部リードのうち他方の側に配置された外部
リードは、前記中間部が前記樹脂封止体の第２の主面側
へ前記導出部から折り曲げられ且つ前記先端部が前記導
出部と略同一の方向へ前記中間部から折り曲げられ、 隣接する前記外部リードの先端部間の間隔は隣接する前
記外部リードの導出部間の間隔よりも大きいことを特徴
とする電子部品。1. A plurality of external leads are led out from one side surface of the resin encapsulant, and at least two of the external leads are led out from the resin encapsulant, and an intermediate portion continuous to the lead-out portion. An electronic component having a portion and a tip portion continuously formed in the intermediate portion and inserted into a through hole of a circuit board, the external lead arranged on one side of the plurality of external leads is An intermediate portion is bent from the lead-out portion to the first main surface side of the resin encapsulant, and the tip portion is bent from the intermediate portion in a direction substantially the same as the lead-out portion; In the external lead arranged on the other side, the intermediate portion is bent from the lead-out portion to the second main surface side of the resin encapsulant, and the tip portion is in the same direction as the lead-out portion. Bent from the part, before adjoining The electronic component is characterized in that the distance between the tip portions of the external leads is larger than the distance between the lead-out portions of the adjacent external leads.
た外部リードから中央側に配置された外部リードに向か
うにつれて前記中間部が折り曲げられて第１の主面側又
は第２の主面側へ突出する幅が段階的に小さくなる「請
求項１」に記載の電子部品。2. The plurality of outer leads are bent at the intermediate portion from the outer lead arranged on the outer side toward the outer lead arranged on the center side, and the first main surface side or the second main surface side. The electronic component according to claim 1, wherein a width protruding inward is gradually reduced.
隔は２.５４ｍｍであり且つ隣接する前記外部リードの
導出部間の間隔は１.７ｍｍである「請求項２」に記載
の電子部品。3. The electronic component according to claim 2, wherein the distance between the tip portions of the adjacent external leads is 2.54 mm, and the distance between the lead portions of the adjacent external leads is 1.7 mm. .
に対して一定角度で傾斜して一直線上に並置された「請
求項３」に記載の電子部品。4. The electronic component according to claim 3, wherein the tip portions of the external leads are arranged side by side on a straight line with a certain angle with respect to the lead-out portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26852394A JPH08130285A (en) | 1994-11-01 | 1994-11-01 | Electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26852394A JPH08130285A (en) | 1994-11-01 | 1994-11-01 | Electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08130285A true JPH08130285A (en) | 1996-05-21 |
Family
ID=17459710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26852394A Pending JPH08130285A (en) | 1994-11-01 | 1994-11-01 | Electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08130285A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003039223A1 (en) * | 2001-10-23 | 2003-05-08 | Robert Bosch Gmbh | Transistor pin geometries that are suitable for contacting |
| GB2505634A (en) * | 2012-05-04 | 2014-03-12 | Control Tech Ltd | Power resistor leg arrangement |
-
1994
- 1994-11-01 JP JP26852394A patent/JPH08130285A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003039223A1 (en) * | 2001-10-23 | 2003-05-08 | Robert Bosch Gmbh | Transistor pin geometries that are suitable for contacting |
| GB2505634A (en) * | 2012-05-04 | 2014-03-12 | Control Tech Ltd | Power resistor leg arrangement |
| US9136242B2 (en) | 2012-05-04 | 2015-09-15 | Control Techniques Limited | Component leg arrangement |
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