JPH0897350A - Semiconductor integrated circuit package - Google Patents

Abstract

PURPOSE: To obtain a structure for preventing deformation of lead by enabling use of existing socket and through hole without changing a manufacturing process. CONSTITUTION: Mold resin is supplied onto a lead 2 along a side surface of a package body 1 from the rear surface thereof and is then hardened. In this case, the resin is supplied not to reach the connecting part 4 of the end part of the lead 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit package, and more particularly to a semiconductor integrated circuit package having a structure in which deformation of lead portions is prevented.

[0002]

2. Description of the Related Art Generally, semiconductor integrated circuit packages are
As shown in FIG. 2, two sides or four of the package body 1
A plurality of leads 2 are led out from the side surface at substantially equal intervals and arranged in line. As described above, in the semiconductor integrated circuit package, only the lead 2 is exposed, and the exposed lead 2 is connected to a predetermined portion of a package socket or a printed board (not shown).

Further, Japanese Utility Model Publication No. 1-78047 discloses that
A semiconductor integrated circuit package as shown in FIG. 3 is disclosed. That is, the leads 2 are led out from the two side surfaces of the package body 1 at equal intervals, and the gaps between these leads 2 are all solidified with the molding resin 3 to form the leads 2
It has a structure that prevents deformation of the.

[0004]

In the conventional semiconductor integrated circuit package having the structure shown in FIG. 2, there is a risk that the leads may be deformed by an external force when connecting to a socket or a printed circuit board, during transportation or during testing. Has the drawback of being large.

Although the semiconductor integrated circuit package of FIG. 3 has a structure for preventing the deformation of the leads, it is difficult to process the resin 3 along the leads 2, which causes a cost increase. Become. Further, since the resin 3 is along the leads, it is not possible to use a socket that is widely used in the past, and it is impossible to insert the leads into the through holes of the printed circuit board. ..

Further, in the current manufacturing process of a semiconductor integrated circuit package, lead processing is performed after resin molding, but in the structure of FIG. 3, it is necessary to perform resin molding after lead processing, and the manufacturing process is changed. It is necessary to do this, which also causes a cost increase.

An object of the present invention is to provide a semiconductor integrated circuit package having a simple structure to solve all the above problems and to protect the deformation of the leads.

[0008]

A semiconductor integrated circuit package according to the present invention includes a plurality of leads extending from a side surface of the package body and the package body except for the lead tips for fixing the leads to each other. And a resin continuously provided in parallel with the side surface of the.

[0009]

With the exception of the tips of the leads led out from the side surface of the package body, resin is poured and fixed onto these lead portions substantially in parallel with the side surfaces to prevent deformation of the leads and to prevent the conventional socket It is possible to use through holes on the printed circuit board.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing an embodiment of the present invention.
(A) is a cross-sectional view taken along the line I-I of (B), and (B) is a rear view.

In FIG. 1, a package body 1 is a package manufactured by a conventional manufacturing process. From the four side surfaces of the package body 1, a plurality of gull wing-shaped leads 2 are led out at substantially equal intervals.
With this structure, as shown in (B) of the package body 1, the resin 3 having a relatively high viscosity is poured into the gap between the leet 2 and the periphery of the package body 1 with the back surface facing upward.

At this time, the resin 3 is poured on the leads 2 in parallel to the four side surfaces of the package body 1, but the resin 3 is poured so as not to cover the connecting portion 4 which is the tip of each lead, and these connecting portions are connected. Leave all 4 exposed. Since the resin has a high viscosity, it does not flow out from the gap portion of the lead 2 and is solidified so that the leads can be fixed to each other.

In addition to the structure of the above-described embodiment, the structure in which the leads 2 are led out from the two side surfaces of the package body 1 can be similarly applied. Further, although the lead 2 is bent and formed in a so-called gull wing shape, it is obvious that the lead may be straight.

[0015]

As described above, according to the present invention, the mold resin for fixing the leads to each other is poured into and solidified on the leads except for the connecting portions which are the tips of the leads, so that the leads are deformed. There is an effect that prevention is possible while using the socket and the through hole of the printed circuit board.

Further, since the resin for fixing the leads can be poured in at the final stage of the manufacturing process, there is an effect that the manufacturing process need not be changed.

[Brief description of drawings]

1A is a cross-sectional view of an embodiment of the present invention, and FIG. 1B is a rear view thereof.

FIG. 2 is a diagram showing an example of a conventional semiconductor integrated circuit package.

FIG. 3 is a diagram showing another example of a conventional semiconductor integrated circuit package.

[Explanation of symbols]

 1 Package body 2 Lead 3 Resin 4 Lead tip (connecting part)

Claims (2)

[Claims] 1. A plurality of leads led out from the side surface of the package body, and a resin continuously provided in parallel to the side surface of the package body except for the lead tips for fixing the leads to each other. A semiconductor integrated circuit package comprising: 2. The semiconductor integrated circuit package according to claim 1, wherein the resin is provided on the plurality of leads when viewed from the back surface of the package body.