JPH0529159U - Structure of lead frame for electronic parts - Google Patents
Structure of lead frame for electronic partsInfo
- Publication number
- JPH0529159U JPH0529159U JP076643U JP7664391U JPH0529159U JP H0529159 U JPH0529159 U JP H0529159U JP 076643 U JP076643 U JP 076643U JP 7664391 U JP7664391 U JP 7664391U JP H0529159 U JPH0529159 U JP H0529159U
- Authority
- JP
- Japan
- Prior art keywords
- reinforcing film
- inner lead
- lead frame
- lead
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
(57)【要約】
【目的】 電子部品用リードフレームにおいて、各イン
ナーリードにおける先端部の変形を防止して、不良品の
発生率を、コストのアップを招来することなく低減す
る。
【構成】 前記各インナーリード７の先端部に、合成樹
脂製の補強フィルム９を、多数本のインナーリード７に
跨がるように貼着し、この補強フィルム９のうち各イン
ナーリード７の部位に、当該インナーリード７を部分的
に露出するようにした抜き孔１０を穿設する。
(57) [Summary] [Object] In a lead frame for an electronic component, the deformation of the tip portion of each inner lead is prevented, and the incidence of defective products is reduced without increasing the cost. [Structure] A reinforcing film 9 made of a synthetic resin is attached to the tip of each inner lead 7 so as to straddle a large number of inner leads 7, and a portion of each inner lead 7 of the reinforcing film 9 is attached. Then, a hole 10 is formed so that the inner lead 7 is partially exposed.
Description
【０００１】[0001]
本考案は、ＩＣ又はＬＳＩ等の電子部品に使用するリードフレームの構造に関 するものである。 The present invention relates to the structure of a lead frame used for electronic parts such as ICs and LSIs.
【０００２】[0002]
一般に、ＩＣ又はＬＳＩ等の電子部品は、従来から良く知られているように、 薄い金属板製のリードフレームに、アイランド部を造形すると共に、細幅に形成 した多数本のインナーリードを、当該各インナーリードが前記アイランド部に向 かって放射状に延びるようにして一体的に造形し、前記アイランド部の上面に半 導体チップをダイボンディングし、次いで、この半導体チップにおける各端子と 前記各インナーリードとの相互間を、極めて細い金線にてワイヤーボンディング したのち、その全体を合成樹脂製のモールド部にてパッケージする構成にしてい る。 Generally, as is well known in the art, electronic parts such as ICs and LSIs have a thin metal plate lead frame on which an island portion is formed and a large number of narrow inner leads. The inner leads are integrally formed so as to extend radially toward the island portion, a semiconductor chip is die-bonded to the upper surface of the island portion, and then the terminals of the semiconductor chip and the inner leads are connected to each other. The wires are bonded to each other with an extremely thin gold wire, and then the entire structure is packaged with a synthetic resin mold part.
【０００３】 ところで、前記各インナーリードは、リードフレームにおけるサイドメンバー 等から前記アイランド部に向かっていわゆる片持梁式に長く突出しており、しか も、細幅であって、当該各インナーリードの先端部は、極めて変形し易い形態に なっているから、前記の金線によるワイヤーボンディングに際して、各インナー リードの先端部が変形して、ワイヤーボンディングの不良が多発するばかりか、 その他の工程中における各インナーリードの先端部の変形によって、前記金線が 千切れたり、金線のインナーリードに対する接合部が外れたり、或いは隣接同士 が互いに接触したりすることが多発し、不良品の発生率が増大することになる。By the way, each inner lead has a so-called cantilever type long projection from the side member or the like in the lead frame toward the island portion. Since the parts are very easily deformed, the tip of each inner lead is deformed during wire bonding with the above-mentioned gold wire, resulting in frequent occurrence of wire bonding defects. Due to the deformation of the tip of the inner lead, the gold wire often breaks, the joining part of the gold wire to the inner lead is dislodged, or adjacent parts often come into contact with each other, increasing the incidence of defective products. Will be done.
【０００４】 そこで、従来は、例えば、実開昭６２−８０３４４号公報等に記載されている ように、前記各インナーリードの先端部に、合成樹脂製の補強フィルムを、多数 本のインナーリードに跨がるように貼着することによって、各インナーリードの 先端部の変形を防止するようにしている。Therefore, conventionally, as described in, for example, Japanese Utility Model Laid-Open No. 62-80344, a synthetic resin reinforcing film is attached to a large number of inner leads at the tip of each inner lead. By sticking them so that they straddle each other, the tip of each inner lead is prevented from being deformed.
【０００５】[0005]
しかし、このように各インナーリードの先端部に補強フィルムを多数本のイン ナーリードにわたって跨がるように貼着した場合において、金線によるワイヤー ボンディングに際して、前記金線の各インナーリードに対する接合部（セカンド 接合部）を、前記補強フィルムよりも外側の部位にすると、前記金線の長さが長 くなり、金の使用量が増大するから、ワイヤーボンディングに要するコストがア ップすると言う問題がある。 However, when a reinforcing film is attached to the tip of each inner lead in such a manner as to straddle a large number of inner leads in this way, when wire bonding with a gold wire, the joining part ( If the second joining part) is located outside the reinforcing film, the length of the gold wire becomes longer and the amount of gold used increases, which raises the problem that the cost required for wire bonding increases. is there.
【０００６】 また、各インナーリードの先端部を、これに貼着する補強フィルムよりもアイ ランド部の方向に突出して、この先端部に対して、ワイヤーボンディングにおけ る金線を接合するように構成すると、前記金線の使用量を低減できる反面、各イ ンナーリードの先端部のうち前記金線を接合する部分は、補強フィルムから突出 しており、換言すると、各インナーリードの先端部のうち前記金線を接合する部 分の変形を、前記補強フィルムによって効果的に防止することができないので、 不良品の発生率が、前者の場合よりも増大すると言う問題がある。In addition, the tip of each inner lead is projected in the direction of the land than the reinforcing film attached to the inner lead, and the gold wire in wire bonding is bonded to the tip. According to this configuration, while the amount of the gold wire used can be reduced, the portion of the tip of each inner lead to which the gold wire is joined protrudes from the reinforcing film, in other words, the tip of each inner lead. Since the reinforcing film cannot effectively prevent the deformation of the portion that joins the gold wire, there is a problem that the incidence of defective products is higher than in the former case.
【０００７】 本考案は、これらの問題を一挙に解消できるようにしたリードフレームを提供 することを技術的課題とするものである。The present invention has a technical object to provide a lead frame capable of solving these problems all at once.
【０００８】[0008]
この技術的課題を達成するため本考案は、半導体チップをマウントするアイラ ンド部と、このアイランド部に向かって延びる多数本の細幅インナーリードとを 備えて成るリードフレームにおいて、且つ、前記各インナーリードの先端部に、 合成樹脂製の補強フィルムを、多数本のインナーリードに跨がるように貼着して 成るリードフレームにおいて、前記補強フィルムのうち各インナーリードの部位 には、当該インナーリードを部分的に露出するようにした抜き孔を穿設する構成 にした。 In order to achieve this technical problem, the present invention provides a lead frame comprising an island part for mounting a semiconductor chip and a large number of narrow inner leads extending toward the island part, and In a lead frame in which a reinforcing film made of synthetic resin is attached to the tip of the lead so as to straddle a large number of inner leads, the inner lead is attached to each inner lead part of the reinforcing film. It has a structure in which a through hole is formed so as to partially expose the.
【０００９】[0009]
このように構成すると、補強フィルムに穿設した抜き孔内において、インナー リードに対して金線を接合することができるから、各インナーリードを、補強フ ィルムに対して、当該インナーリードの先端部まで貼着することができる。 従って、本考案によると、アイランド部にマウントした半導体チップと、各イ ンナーリードとの間を接続する金線の長さを長くすることなく、前記各インナー リードの先端部における変形を、補強フィルムにて防止することができるから、 不良品の発生率を、金線の使用量の増大、ひいてはコストのアップを招来するこ となく確実に低減できる効果を有する。 According to this structure, the gold wire can be joined to the inner lead in the hole formed in the reinforcing film, so that each inner lead is connected to the reinforcing film at the tip of the inner lead. Can be attached up to. Therefore, according to the present invention, the deformation of the tip end of each inner lead is prevented by the reinforcing film without increasing the length of the gold wire connecting between the semiconductor chip mounted on the island portion and each inner lead. Therefore, there is an effect that the defective product generation rate can be surely reduced without increasing the usage amount of the gold wire and eventually increasing the cost.
【００１０】[0010]
以下、本考案の実施例を図面について説明する。 図において符号１は、薄い金属板から打ち抜き形成したリードフレームを示し 、このリードフレーム１には、その左右両サイドフレーム２，３の略中間に、ア イランド部４が、支持バー５，６にて支持した状態で一体的に造形されていると 共に、多数本のインナーリード７が、当該各インナーリード７の先端が前記アイ ランド部４に向かって放射状に延びるように一体的に造形されている。 Embodiments of the present invention will be described below with reference to the drawings. In the figure, reference numeral 1 indicates a lead frame formed by punching out from a thin metal plate. In this lead frame 1, an illand portion 4 is provided on the support bars 5 and 6 approximately in the middle of the left and right side frames 2 and 3. The inner leads 7 are integrally formed so that the tips of the inner leads 7 extend radially toward the land portion 4. There is.
【００１１】 なお、符号８は、ダムバーを示し、また、前記アイランド部３の上面、及び前 記各インナーリード７の先端部の上面には、Ａｇメッキが施されている。 符号９は、ポリイミド樹脂等の熱硬化性合成樹脂製にて平面矩形状に形成した 補強フィルムを示し、この補強フィルム９を、前記アイランド部４の上面及び各 インナーリード７における先端部の上面に、当該補強フィルム９が各インナーリ ード７の相互間に跨がると共に、各インナーリード７とアイランド部４との間に も跨がるように貼着する。Reference numeral 8 indicates a dam bar, and the upper surface of the island portion 3 and the upper surfaces of the tip portions of the inner leads 7 are Ag-plated. Reference numeral 9 indicates a reinforcing film made of thermosetting synthetic resin such as polyimide resin and formed in a rectangular shape in a plane. The reinforcing film 9 is provided on the upper surface of the island portion 4 and the upper surface of the tip of each inner lead 7. The reinforcing film 9 is attached so as to straddle each inner lead 7 and also between each inner lead 7 and the island portion 4.
【００１２】 そして、前記補強フィルム９のうち前記各インナーリード７の部位に、抜き孔 １０を穿設して、この各抜き孔１０内に、前記インナーリード７の上面が部分的 に露出するように構成する。なお、この各抜き孔１０は、補強フィルム９をリー ドフレーム１に対して貼着したあとにおいて、ホォトエッチング法によって穿設 する。Then, a hole 10 is formed in each of the inner leads 7 of the reinforcing film 9 so that the upper surface of the inner lead 7 is partially exposed in each hole 10. To configure. Each of the holes 10 is formed by the photoetching method after the reinforcing film 9 is attached to the lead frame 1.
【００１３】 この構成において、前記補強フィルム９の上面のうち前記アイランド部４の部 分に、半導体チップ１１を、熱硬化性のペースト又は接着剤にてマウントし、次 いで、この半導体チップ１１と、前記各インナーリード７の上面のうち前記各補 強フィルム９に穿設した抜き孔１０に露出する部分との間を、金線１２にてワイ ヤーボンディングしたのち、これらの全体を、熱硬化性合成樹脂製のモールド部 １３によってパッケージするのである。In this structure, the semiconductor chip 11 is mounted on the upper surface of the reinforcing film 9 on the island portion 4 with a thermosetting paste or an adhesive, and then the semiconductor chip 11 and After wire bonding with a gold wire 12 between the upper surface of each inner lead 7 and a portion exposed in the hole 10 formed in each reinforcing film 9, the whole of these is heat-cured. It is packaged by the mold portion 13 made of a synthetic resin.
【００１４】 前記の金線１２によるワイヤーボンディングに際して、金線１２を、各インナ ーリード７に対して、補強フィルム９に穿設した抜き孔１０内において接合する ことができるから、各インナーリードを、補強フィルム９に対して、当該インナ ーリード７の先端部まで貼着することができるのである。At the time of wire bonding with the gold wire 12, the gold wire 12 can be bonded to each inner lead 7 in the hole 10 formed in the reinforcing film 9, so that each inner lead is It is possible to attach even the tip of the inner lead 7 to the reinforcing film 9.
【図１】本考案の実施例によるリードフレームの平面図
である。FIG. 1 is a plan view of a lead frame according to an exemplary embodiment of the present invention.
【図２】図１における要部の拡大図である。FIG. 2 is an enlarged view of a main part in FIG.
【図３】図２のIII −III 視断面図である。FIG. 3 is a sectional view taken along line III-III in FIG.
１ リードフレーム ２，３ サイドフレーム ４ アイランド部 ５，６ 支持バー ７ インナーリード ８ ダムバー ９ 補強フィルム １０ 抜き孔 １１ 半導体チップ １２ 金線 １３ モールド部 1 Lead Frame 2,3 Side Frame 4 Island 5,6 Support Bar 7 Inner Lead 8 Dam Bar 9 Reinforcing Film 10 Holes 11 Semiconductor Chip 12 Gold Wire 13 Mold
Claims (1)
と、このアイランド部に向かって延びる多数本の細幅イ
ンナーリードとを備え、且つ、前記各インナーリードの
先端部に、合成樹脂製の補強フィルムを、多数本のイン
ナーリードに跨がるように貼着して成るリードフレーム
において、前記補強フィルムのうち各インナーリードの
部位に、当該インナーリードを部分的に露出するように
した抜き孔を穿設したことを特徴とする電子部品用リー
ドフレームの構造。1. An island portion for mounting a semiconductor chip, and a large number of narrow inner leads extending toward the island portion, wherein a reinforcing film made of synthetic resin is provided at the tip of each inner lead. In a lead frame that is attached so as to straddle a large number of inner leads, a punching hole is formed in each of the inner leads of the reinforcing film so that the inner leads are partially exposed. The structure of the lead frame for electronic parts characterized by the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP076643U JPH0529159U (en) | 1991-09-24 | 1991-09-24 | Structure of lead frame for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP076643U JPH0529159U (en) | 1991-09-24 | 1991-09-24 | Structure of lead frame for electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0529159U true JPH0529159U (en) | 1993-04-16 |
Family
ID=13611071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP076643U Pending JPH0529159U (en) | 1991-09-24 | 1991-09-24 | Structure of lead frame for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0529159U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010114401A (en) * | 2008-11-04 | 2010-05-20 | Powertech Technology Inc | Interconnect structure of leadframe, and interconnect method of leadframe |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471945A (en) * | 1977-11-21 | 1979-06-08 | Hitachi Ltd | Crt dispaly unit |
| JPH0246754A (en) * | 1988-08-08 | 1990-02-16 | Nec Corp | Lead frame for semiconductor device |
| JPH03202400A (en) * | 1989-04-07 | 1991-09-04 | Sgs Thomson Microelectron Sa | Electronic module sealing and micromodule manufactured using said sealing technique |
-
1991
- 1991-09-24 JP JP076643U patent/JPH0529159U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471945A (en) * | 1977-11-21 | 1979-06-08 | Hitachi Ltd | Crt dispaly unit |
| JPH0246754A (en) * | 1988-08-08 | 1990-02-16 | Nec Corp | Lead frame for semiconductor device |
| JPH03202400A (en) * | 1989-04-07 | 1991-09-04 | Sgs Thomson Microelectron Sa | Electronic module sealing and micromodule manufactured using said sealing technique |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010114401A (en) * | 2008-11-04 | 2010-05-20 | Powertech Technology Inc | Interconnect structure of leadframe, and interconnect method of leadframe |
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