JPH071812Y2 - マルチビーム半導体レーザ装置 - Google Patents
マルチビーム半導体レーザ装置Info
- Publication number
- JPH071812Y2 JPH071812Y2 JP1988149845U JP14984588U JPH071812Y2 JP H071812 Y2 JPH071812 Y2 JP H071812Y2 JP 1988149845 U JP1988149845 U JP 1988149845U JP 14984588 U JP14984588 U JP 14984588U JP H071812 Y2 JPH071812 Y2 JP H071812Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- electrode
- heat sink
- solder material
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 22
- 239000000463 material Substances 0.000 claims description 21
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 238000000926 separation method Methods 0.000 claims description 8
- 230000004927 fusion Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 3
- 229910020220 Pb—Sn Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910017855 NH 4 F Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988149845U JPH071812Y2 (ja) | 1988-11-16 | 1988-11-16 | マルチビーム半導体レーザ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988149845U JPH071812Y2 (ja) | 1988-11-16 | 1988-11-16 | マルチビーム半導体レーザ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0270471U JPH0270471U (enrdf_load_stackoverflow) | 1990-05-29 |
| JPH071812Y2 true JPH071812Y2 (ja) | 1995-01-18 |
Family
ID=31422448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988149845U Expired - Lifetime JPH071812Y2 (ja) | 1988-11-16 | 1988-11-16 | マルチビーム半導体レーザ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071812Y2 (enrdf_load_stackoverflow) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4069463A (en) * | 1976-09-02 | 1978-01-17 | International Business Machines Corporation | Injection laser array |
-
1988
- 1988-11-16 JP JP1988149845U patent/JPH071812Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0270471U (enrdf_load_stackoverflow) | 1990-05-29 |
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