JPH07114183A - 光重合性組成物及びこれを用いた硬化塗膜パターンの形成方法 - Google Patents

光重合性組成物及びこれを用いた硬化塗膜パターンの形成方法

Info

Publication number
JPH07114183A
JPH07114183A JP5258620A JP25862093A JPH07114183A JP H07114183 A JPH07114183 A JP H07114183A JP 5258620 A JP5258620 A JP 5258620A JP 25862093 A JP25862093 A JP 25862093A JP H07114183 A JPH07114183 A JP H07114183A
Authority
JP
Japan
Prior art keywords
coating film
group
parts
weight
photopolymerizable composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5258620A
Other languages
English (en)
Japanese (ja)
Inventor
Nobuo Komatsu
信夫 小松
Ikuyo Kai
幾世 甲斐
Masami Konishi
真美 小西
Naozumi Iwazawa
直純 岩沢
Satoshi Furusawa
智 古沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Paint Co Ltd
Sony Corp
Original Assignee
Kansai Paint Co Ltd
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Paint Co Ltd, Sony Corp filed Critical Kansai Paint Co Ltd
Priority to JP5258620A priority Critical patent/JPH07114183A/ja
Priority to US08/322,415 priority patent/US5591562A/en
Priority to KR1019940026320A priority patent/KR100297128B1/ko
Priority to TW083109538A priority patent/TW287188B/zh
Publication of JPH07114183A publication Critical patent/JPH07114183A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP5258620A 1993-10-15 1993-10-15 光重合性組成物及びこれを用いた硬化塗膜パターンの形成方法 Pending JPH07114183A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP5258620A JPH07114183A (ja) 1993-10-15 1993-10-15 光重合性組成物及びこれを用いた硬化塗膜パターンの形成方法
US08/322,415 US5591562A (en) 1993-10-15 1994-10-13 Water and acid developable photoresist composition exhibiting improved adhesion
KR1019940026320A KR100297128B1 (ko) 1993-10-15 1994-10-14 광중합성조성물및이것을사용한경화도막패턴의형성방법
TW083109538A TW287188B (en:Method) 1993-10-15 1994-10-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5258620A JPH07114183A (ja) 1993-10-15 1993-10-15 光重合性組成物及びこれを用いた硬化塗膜パターンの形成方法

Publications (1)

Publication Number Publication Date
JPH07114183A true JPH07114183A (ja) 1995-05-02

Family

ID=17322812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5258620A Pending JPH07114183A (ja) 1993-10-15 1993-10-15 光重合性組成物及びこれを用いた硬化塗膜パターンの形成方法

Country Status (4)

Country Link
US (1) US5591562A (en:Method)
JP (1) JPH07114183A (en:Method)
KR (1) KR100297128B1 (en:Method)
TW (1) TW287188B (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6464218A (en) * 1987-09-03 1989-03-10 Tokyo Electron Ltd Applicator for resist

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5853957A (en) * 1995-05-08 1998-12-29 Tamura Kaken Co., Ltd Photosensitive resin compositions, cured films thereof, and circuit boards
WO1999054788A1 (fr) * 1998-04-17 1999-10-28 Kansai Paint Co., Ltd. Composition de resine photosensible
JP2004123775A (ja) * 2002-09-30 2004-04-22 Taiyo Ink Mfg Ltd 感光性熱硬化性ペースト組成物
US20080156346A1 (en) * 2006-12-28 2008-07-03 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for cleaning a substrate

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4338232A (en) * 1977-12-27 1982-07-06 The Dow Chemical Company Radiation-curable resins
US4302373A (en) * 1980-08-05 1981-11-24 E. I. Du Pont De Nemours And Company Water-borne coating composition made from modified epoxy resin, polymeric acid and tertiary amine
DE3123536A1 (de) * 1981-06-13 1982-12-30 Basf Farben + Fasern Ag, 2000 Hamburg Bindemittel fuer kathodisch abscheidbare ueberzugsmassen, verfahren zu ihrer herstellung und ihre verwendung
US4431782A (en) * 1981-07-27 1984-02-14 The Dow Chemical Company Process for the preparation of radiation-curable, water-thinnable vinyl ester resins
JPS6187147A (ja) * 1984-09-27 1986-05-02 Fuji Photo Film Co Ltd 光重合性組成物
US4798877A (en) * 1985-04-08 1989-01-17 The Dow Chemical Company Radiation-curable resins
US4789620A (en) * 1986-03-03 1988-12-06 Mitsubishi Rayon Co. Ltd. Liquid photosensitive resin composition containing carboxylated epoxy acrylates or methacrylates
JPH06828B2 (ja) * 1986-10-15 1994-01-05 宇部興産株式会社 光硬化性組成物
JPH0717737B2 (ja) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
JP2686283B2 (ja) * 1988-06-13 1997-12-08 関西ペイント株式会社 光重合性組成物
GB2213487B (en) * 1987-12-08 1992-01-08 Kansai Paint Co Ltd Method of forming a cured coating film
CA1338575C (en) * 1987-12-08 1996-09-03 Naozumi Iwasawa Curable resin composition
JPH02115845A (ja) * 1988-10-26 1990-04-27 Tokyo Ohka Kogyo Co Ltd サンドブラスト用光重合性組成物及びこれを用いた彫刻方法
JPH03115845A (ja) * 1990-03-15 1991-05-16 Tokyo Electron Ltd 麈埃検出装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6464218A (en) * 1987-09-03 1989-03-10 Tokyo Electron Ltd Applicator for resist

Also Published As

Publication number Publication date
TW287188B (en:Method) 1996-10-01
KR950013333A (ko) 1995-05-17
KR100297128B1 (ko) 2001-11-22
US5591562A (en) 1997-01-07

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