JPH0710495Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0710495Y2 JPH0710495Y2 JP4036889U JP4036889U JPH0710495Y2 JP H0710495 Y2 JPH0710495 Y2 JP H0710495Y2 JP 4036889 U JP4036889 U JP 4036889U JP 4036889 U JP4036889 U JP 4036889U JP H0710495 Y2 JPH0710495 Y2 JP H0710495Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- alumina ceramic
- metallized portion
- semiconductor device
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 27
- 239000000919 ceramic Substances 0.000 claims description 17
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 238000007789 sealing Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 210000001503 joint Anatomy 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4036889U JPH0710495Y2 (ja) | 1989-04-04 | 1989-04-04 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4036889U JPH0710495Y2 (ja) | 1989-04-04 | 1989-04-04 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02131353U JPH02131353U (en, 2012) | 1990-10-31 |
| JPH0710495Y2 true JPH0710495Y2 (ja) | 1995-03-08 |
Family
ID=31550097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4036889U Expired - Lifetime JPH0710495Y2 (ja) | 1989-04-04 | 1989-04-04 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710495Y2 (en, 2012) |
-
1989
- 1989-04-04 JP JP4036889U patent/JPH0710495Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02131353U (en, 2012) | 1990-10-31 |
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